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1.发明申请ELECTRONIC DEVICE INCLUDING MEMS DEVICES AND HOLED SUBSTRATES, IN PARTICULAR OF THE LGA OR BGA TYPE 有权包括MEMS器件和HOLED衬底的电子器件，特别是LGA或BGA型公开(公告)号：US20110081739A1
公开(公告)日：2011-04-07
申请号：US12969022
申请日：2010-12-15
IPC分类号： H01L21/50
CPC分类号： B81B7/0061 , B81B7/007 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/1461 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.
摘要翻译： 电子设备包括设置有通过开口的基板和包括活性表面的MEMS器件，其中MEMS器件的一部分对流体的化学/物理变化敏感。 MEMS器件的有源表面面向衬底并与其间隔开，敏感部分与开口对准。 保护封装至少部分地包括MEMS器件和衬底，至少留下MEMS器件的敏感部分，并暴露衬底的开口。 屏障元件位于围绕敏感部分的区域中，以实现用于MEMS器件的保护结构，使得敏感部分是自由的。
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2.发明申请Electronic Device Including MEMS Devices And Holed Substrates, In Particular Of The LGA Or BGA Type 有权包括MEMS器件和孔径基板的电子器件，特别是LGA或BGA型公开(公告)号：US20120032285A1
公开(公告)日：2012-02-09
申请号：US13275092
申请日：2011-10-17
CPC分类号： B81B7/0061 , B81B7/007 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/48091 , H01L2924/00014 , H01L2924/1461 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic device includes a substrate provided with a passing opening and a MEMS device including an active surface wherein a portion of the MEMS device is integrated sensitive to chemical/physical variations of a fluid. The active surface of the MEMS device faces the substrate and is spaced therefrom, the sensitive portion being aligned to the opening. A protective package incorporates at least partially the MEMS device and the substrate, leaving at least the sensitive portion of the MEMS device, and the opening of the substrate exposed. A barrier element is positioned in an area which surrounds the sensitive portion to realize a protection structure for the MEMS device, so that the sensitive portion is free.
摘要翻译： 电子设备包括设置有通过开口的基板和包括活性表面的MEMS器件，其中MEMS器件的一部分对流体的化学/物理变化敏感。 MEMS器件的有源表面面向衬底并与其间隔开，敏感部分与开口对准。 保护封装至少部分地包括MEMS器件和衬底，至少留下MEMS器件的敏感部分，并暴露衬底的开口。 屏障元件位于围绕敏感部分的区域中，以实现用于MEMS器件的保护结构，使得敏感部分是自由的。
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