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1.发明申请Method of improving surface roughness of fluid flow conduits within a diffusion bonded fluid flow structure 审中-公开改善扩散接合流体流动结构内流体流动管道表面粗糙度的方法公开(公告)号：US20090057375A1
公开(公告)日：2009-03-05
申请号：US12288604
申请日：2008-10-21
申请人： Mark Crockett , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
发明人： Mark Crockett , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
IPC分类号： B23K31/12
CPC分类号： B23K20/021
摘要： The present invention relates to a method of diffusion bonding sheets of patterned material to fabricate a fluid delivery system; and particularly relates to a method of improving the interior surface roughness of fluid flow conduits formed within the diffusion bonded fluid delivery system structure.
摘要翻译： 本发明涉及一种扩散接合图案化材料片材以制造流体输送系统的方法; 特别涉及一种改进形成在扩散接合流体输送系统结构内的流体流动管道的内表面粗糙度的方法。
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公开(公告)号：US20080296354A1
公开(公告)日：2008-12-04
申请号：US11756320
申请日：2007-05-31
申请人： MARK CROCKETT , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
发明人： MARK CROCKETT , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
摘要： The present invention relates to stainless steel sheets which would be useful in semiconductor processing and in other applications which require high purity fluid handling. The invention also relates to a method of selecting and processing such sheets.
摘要翻译： 本发明涉及可用于半导体加工和需要高纯度流体处理的其它应用中的不锈钢板。 本发明还涉及一种选择和处理这种片材的方法。
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公开(公告)号：US07798388B2
公开(公告)日：2010-09-21
申请号：US11756248
申请日：2007-05-31
申请人： Mark Crockett , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
发明人： Mark Crockett , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
CPC分类号： B23K20/021
摘要： The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.
摘要翻译： 本发明涉及钢和钢合金的扩散接合方法，以制造可用于半导体加工的流体输送系统以及需要高纯度流体处理的其它应用中。
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4.发明申请Method of preventing bonding between a load distribution block and a plate set of stacked sheets during diffusion bonding of a fluid flow structure 审中-公开一种在流体流动结构的扩散接合期间防止载荷分布块与层叠片材的板组之间的接合的方法公开(公告)号：US20090072009A1
公开(公告)日：2009-03-19
申请号：US12288631
申请日：2008-10-21
申请人： Mark Crockett , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
发明人： Mark Crockett , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
IPC分类号： B23K31/02
摘要： The present invention relates to diffusion bonding of patterned sheets to form a fluid flow handling structure, and to a method of preventing bonding between a load distribution block and a plate set of stacked sheets during the diffusion bonding process.
摘要翻译： 本发明涉及图案化片材的扩散接合以形成流体流动处理结构，以及在扩散接合过程中防止负载分布块和堆叠片材板组之间的结合的方法。
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5.发明申请公开(公告)号：US20080296351A1
公开(公告)日：2008-12-04
申请号：US11756248
申请日：2007-05-31
申请人： Mark Crockett , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
发明人： Mark Crockett , John W. Lane , Vincent Kirchhoff , Marcel E. Josephson , Hong P. Gao , Bhaswan Manjunath
IPC分类号： B23K20/24
CPC分类号： B23K20/021
摘要： The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.
摘要翻译： 本发明涉及钢和钢合金的扩散接合方法，以制造可用于半导体加工的流体输送系统以及需要高纯度流体处理的其它应用中。
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