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1.发明申请Printing and drying method, method of production of electronic device, and printing and drying system 有权印刷干燥方法，电子装置的生产方法以及印刷和干燥系统公开(公告)号：US20060213382A1
公开(公告)日：2006-09-28
申请号：US11387715
申请日：2006-03-24
IPC分类号： B41M1/12
CPC分类号： H05K3/227 , H01G13/04 , H05K1/0306 , H05K3/007 , H05K3/207 , H05K2203/0156 , H05K2203/0271 , H05K2203/1545
摘要： A printing and drying method comprising laying a support sheet 20 elongated in the long direction so as to bridge both a printing zone 42 and a drying zone 44, in the printing zone 42, giving the support sheet 20 a first tension F1, in that state, printing the support sheet 20 with predetermined patterns, then feeding the support sheet 20 toward the drying zone 44, in the drying zone 44, giving the support sheet 20 on which the predetermined patterns were printed a second tension F2, and in that state, drying it in a drying chamber 62. The first tension F1 and the second tension F2 are given by separate tension giving means, and the second tension F2 is tension given along the support sheet 20 in the long direction and able to prevent shrinkage of the support sheet 20 in the long direction while passing through the drying zone 44.
摘要翻译： 一种印刷和干燥方法，包括铺设在长方向上伸长的支撑片材20，以便在印刷区域42中桥接印刷区域42和干燥区域44，给予支撑片材20第一张力F 1，其中 状态，以预定图案印刷支撑片材20，然后在干燥区域44中将支撑片材20供给到干燥区域44，给出其上印刷有预定图案的第二张力F 2的支撑片材20，并且其中 状态，在干燥室62中干燥。 第一张力F 1和第二张力F 2由单独的张力赋予装置给出，第二张力F 2是沿着支撑片20在长方向上施加的张力，并且能够防止支撑片20在长时间内收缩 同时通过干燥区44。
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2.发明授权Printing and drying method, method of production of electronic device, and printing and drying system 有权印刷干燥方法，电子装置的生产方法以及印刷和干燥系统公开(公告)号：US07661361B2
公开(公告)日：2010-02-16
申请号：US11387715
申请日：2006-03-24
IPC分类号： B41L35/14
CPC分类号： H05K3/227 , H01G13/04 , H05K1/0306 , H05K3/007 , H05K3/207 , H05K2203/0156 , H05K2203/0271 , H05K2203/1545
摘要： A printing and drying method comprising laying a support sheet 20 elongated in the long direction so as to bridge both a printing zone 42 and a drying zone 44, in the printing zone 42, giving the support sheet 20 a first tension F1, in that state, printing the support sheet 20 with predetermined patterns, then feeding the support sheet 20 toward the drying zone 44, in the drying zone 44, giving the support sheet 20 on which the predetermined patterns were printed a second tension F2, and in that state, drying it in a drying chamber 62. The first tension F1 and the second tension F2 are given by separate tension giving means, and the second tension F2 is tension given along the support sheet 20 in the long direction and able to prevent shrinkage of the support sheet 20 in the long direction while passing through the drying zone 44.
摘要翻译： 一种印刷和干燥方法，包括铺设在长方向上伸长的支撑片材20，以便在打印区域42中桥接印刷区域42和干燥区域44，在该状态下给予支撑片材20第一张力F1 ，以预定图案印刷支撑片材20，然后在干燥区域44中将支撑片材20供给到干燥区域44，给出其上印刷有预定图案的第二张力F2的支撑片材20，在该状态下， 在干燥室62中干燥。第一张力F1和第二张力F2由单独的张力赋予装置给出，第二张力F2是沿着支撑片20沿长方向给定的张力，并且能够防止支撑件 片材20在通过干燥区域44的同时在长方向上。
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公开(公告)号：US20060196592A1
公开(公告)日：2006-09-07
申请号：US10550749
申请日：2004-03-31
申请人： Masahiro Karatsu , Shigeki Sato , Masaaki Kanasugi
发明人： Masahiro Karatsu , Shigeki Sato , Masaaki Kanasugi
IPC分类号： B31B1/60
CPC分类号： H01G4/30 , Y10T156/10
摘要： It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component. The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of laminating a plurality of multi-layered units each formed by laminating a ceramic green sheet, an electrode layer and a release layer on a support sheet in this order, the method further including steps of positioning the multi-layered unit on a base substrate so that the surface of the release layer is contact with an agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between itself and the support substrate is higher than the bonding strength between the support sheet and the ceramic green sheet and lower than the bonding strength between itself and the release layer, pressing it and laminating multi-layered units on the base substrate.
摘要翻译： 本发明的目的是提供一种制造多层陶瓷电子部件的方法，其可以可靠地防止包括陶瓷生片和电极层的多层单元被损坏并有效地层压所需数量的 多层单元，从而制造多层陶瓷电子部件。 根据本发明的多层陶瓷电子部件的制造方法包括如下步骤：在该载体片材上层叠多个多层单元，每个多层单元通过将陶瓷生片，电极层和剥离层层叠在支撑片上而形成 该方法还包括以下步骤：将多层单元定位在基底基板上，使得剥离层的表面与形成在基底表面上的凝集层接触，使得其本身之间的结合强度 并且支撑基板高于支撑片和陶瓷生片之间的接合强度，并且低于其本身和剥离层之间的接合强度，将其压制并层压在基底基板上的多层单元。
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公开(公告)号：US07360305B2
公开(公告)日：2008-04-22
申请号：US10550713
申请日：2004-03-31
申请人： Masahiro Karatsu , Shigeki Sato , Masaaki Kanasugi
发明人： Masahiro Karatsu , Shigeki Sato , Masaaki Kanasugi
IPC分类号： H05K3/36
CPC分类号： H01G4/30 , Y10T29/49126 , Y10T29/4913
摘要： A method for manufacturing a multi-layered ceramic electronic component includes positioning a multi-layered unit including a release layer, an electrode layer and a ceramic green sheet formed on a support sheet in such a manner that the surface of the multi-layered unit is located on a base substrate and a step of pressing the multi-layered unit toward the base substrate, thereby laminating the multi-layered unit on the base substrate, and employs as the base substrate a base substrate having such surface roughness as to include per 0.01 mm2 thereof not more than one protrusion that can penetrate the ceramic green sheet of the multi-layered unit laminated on the base substrate to half or more the thickness of the ceramic green sheet and include per 100 mm2 thereof not more than one protrusion that can completely penetrate the ceramic green sheet.
摘要翻译： 一种多层陶瓷电子部件的制造方法，其特征在于，将形成在所述支撑片上的剥离层，电极层，陶瓷生片等的多层单元定位成多层单元的表面为 位于基底基板上的步骤和将多层单元朝向基底基板的步骤，从而将多层单元层叠在基底基板上，并且使用具有这样的表面粗糙度的基底基板作为基底基板， 其不超过一个突出部，其可以穿透层叠在基底基板上的多层单元的陶瓷生片的厚度为陶瓷生片的厚度的一半以上， SUP> 2 <！ - SIPO
- >不超过一个可完全穿透陶瓷生片的突起。 -
公开(公告)号：US07491282B2
公开(公告)日：2009-02-17
申请号：US10550743
申请日：2004-03-31
申请人： Masahiro Karatsu , Shigeki Sato , Masaaki Kanasugi
发明人： Masahiro Karatsu , Shigeki Sato , Masaaki Kanasugi
CPC分类号： H01G4/30
摘要： It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component.The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of laminating a plurality of multi-layered units each formed by laminating a release layer, an electrode layer and a ceramic green sheet on a support sheet in this order, the method further including steps of positioning the multi-layered unit on a base substrate so that the surface of the ceramic green sheet is contact with an agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between itself and the support substrate is higher than the bonding strength between the support sheet and the release layer and lower than the bonding strength between itself and the ceramic green sheet, pressing it and laminating multi-layered units on the base substrate.
摘要翻译： 本发明的目的是提供一种制造多层陶瓷电子部件的方法，其可以可靠地防止包括陶瓷生片和电极层的多层单元被损坏并有效地层压所需数量的 多层单元，从而制造多层陶瓷电子部件。 根据本发明的多层陶瓷电子部件的制造方法包括如下步骤：将多个多层单元层压在该层叠单元上，所述多层单元通过在该支撑片上层叠剥离层，电极层和陶瓷生片 该方法还包括以下步骤：将多层单元定位在基底基板上，使得陶瓷生片的表面与形成在基底基板的表面上的凝集层接触， 其本身和支撑基底的高度大于支撑片和剥离层之间的结合强度，并且低于其本身与陶瓷生片之间的接合强度，将其压制并层压在基底上的多层单元。
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公开(公告)号：US20070017091A1
公开(公告)日：2007-01-25
申请号：US10550713
申请日：2004-03-31
申请人： Masahiro Karatsu , Shigeki Sato , Masaaki Kanasugi
发明人： Masahiro Karatsu , Shigeki Sato , Masaaki Kanasugi
IPC分类号： H05K3/36
CPC分类号： H01G4/30 , Y10T29/49126 , Y10T29/4913
摘要： It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component. The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of positioning a multi-layered unit including a release layer, an electrode layer and a ceramic green sheet formed on a support sheet in such a manner that the surface of the multi-layered unit is located on a base substrate and a step of pressing the multi-layered unit toward the base substrate, thereby laminating the multi-layered unit on the base substrate, and employs as the base substrate a base substrate having such surface roughness as to include per 0.01 mm2 thereof not more than one protrusion that can penetrate the ceramic green sheet of the multi-layered unit laminated on the base substrate to half or more the thickness of the ceramic green sheet and include per 100 mm2 thereof not more than one protrusion that can completely penetrate the ceramic green sheet.
摘要翻译： 本发明的目的是提供一种制造多层陶瓷电子部件的方法，其可以可靠地防止包括陶瓷生片和电极层的多层单元被损坏并有效地层压所需数量的 多层单元，从而制造多层陶瓷电子部件。 根据本发明的多层陶瓷电子部件的制造方法包括如下步骤：将形成在支撑片上的剥离层，电极层和陶瓷生坯片的多层单元定位成使得 多层单元的表面位于基底基板上，并且将多层单元朝向基底基板按压的步骤，从而将多层单元层叠在基底基板上，并且使用基底基板作为基底基板， 这种表面粗糙度包括每0.01mm 2不超过一个突起，其可以穿透层压在基底基底上的多层单元的陶瓷生片的一半以上，陶瓷的厚度 绿色片材，并且每100mm 2不超过一个可完全穿透陶瓷生片的突起。
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公开(公告)号：US20060180269A1
公开(公告)日：2006-08-17
申请号：US10550743
申请日：2004-03-31
申请人： Masahiro Karatsu , Shigekl Sato , Masaaki Kanasugi
发明人： Masahiro Karatsu , Shigekl Sato , Masaaki Kanasugi
CPC分类号： H01G4/30
摘要： It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component. The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of laminating a plurality of multi-layered units each formed by laminating a release layer, an electrode layer and a ceramic green sheet on a support sheet in this order, the method further including steps of positioning the multi-layered unit on a base substrate so that the surface of the ceramic green sheet is contact with an agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between itself and the support substrate is higher than the bonding strength between the support sheet and the release layer and lower than the bonding strength between itself and the ceramic green sheet, pressing it and laminating multi-layered units on the base substrate.
摘要翻译： 本发明的目的是提供一种制造多层陶瓷电子部件的方法，其可以可靠地防止包括陶瓷生片和电极层的多层单元被损坏并有效地层压所需数量的 多层单元，从而制造多层陶瓷电子部件。 根据本发明的多层陶瓷电子部件的制造方法包括如下步骤：将多个多层单元层压在该层叠单元上，所述多层单元通过在该支撑片上层叠剥离层，电极层和陶瓷生片 该方法还包括以下步骤：将多层单元定位在基底基板上，使得陶瓷生片的表面与形成在基底基板的表面上的凝集层接触， 其本身和支撑基底的高度大于支撑片和剥离层之间的结合强度，并且低于其本身与陶瓷生片之间的接合强度，将其压制并层压在基底上的多层单元。
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公开(公告)号：US20060286500A1
公开(公告)日：2006-12-21
申请号：US10553714
申请日：2004-04-12
申请人： Syougo Murosawa , Shigeki Sato , Masaaki Kanasugi
发明人： Syougo Murosawa , Shigeki Sato , Masaaki Kanasugi
IPC分类号： F27D5/00
摘要： It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an electrode paste from sinking into a ceramic green sheet, thereby enabling manufacture of a multi-layered unit including a ceramic green sheet and an electrode layer laminated to each other in a desired manner. The method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component according to the present invention includes a step of forming a ceramic green sheet on the surface of a first carrier film including a surface-treated region and non-surface-treated regions on which no surface treatment is performed on both sides of the surface-treated region, a step of forming a release layer on the surface of a second carrier film having a width substantially equal to that of the first carrier film, a step of forming an electrode layer in a predetermined pattern and a spacer layer in a complementary pattern to that of the electrode layer on the surface of the release layer, thereby forming an inner electrode layer, a step of forming an adhesive layer on the surface of a third carrier film having a width substantially equal to that of the first carrier film, a step of transferring the adhesive layer formed on the surface of the third carrier film onto the surface of the ceramic green sheet, and a step of transferring the inner electrode layer formed on the surface of the second carrier film onto the adhesive layer formed on the surface of the ceramic green sheet, thereby fabricating a multi-layered unit including the ceramic green sheet and the inner electrode layer laminated onto each other, wherein the adhesive layer is formed by coating the surface of the third carrier film with an adhesive agent solution so that the width of the adhesive layer is narrower than that of the third carrier film by at least 2a where α is a positive value, wider than the width of the ceramic green sheet formed on the surface of the first carrier film and the widths of the release layer and the inner electrode layer formed on the surface of the second carrier film by at least 2a and wider than the width of the surface-treated region of the first carrier film at least 2a.
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9.发明授权公开(公告)号：US07402220B2
公开(公告)日：2008-07-22
申请号：US10553536
申请日：2004-04-12
申请人： Syougo Murosawa , Shigeki Sato , Masaaki Kanasugi
发明人： Syougo Murosawa , Shigeki Sato , Masaaki Kanasugi
摘要： It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an electrode paste from sinking into a ceramic green sheet, thereby enabling manufacture of a multi-layered unit including a ceramic green sheet and an electrode layer laminated to each other in a desired manner.
摘要翻译： 本发明的目的是提供一种用于制造多层陶瓷电子部件的多层单元的方法，其可以防止陶瓷生片变形和破坏，并且防止电极浆料中包含的溶剂 浸入陶瓷生片中，从而能够以期望的方式制造包括陶瓷生片和电极层的多层单元。
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10.发明申请公开(公告)号：US20060254701A1
公开(公告)日：2006-11-16
申请号：US10553536
申请日：2004-04-12
申请人： Syougo Murosawa , Shigeki Sato , Masaaki Kanasugi
发明人： Syougo Murosawa , Shigeki Sato , Masaaki Kanasugi
摘要： It is an object of the present invention is to provide a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component which can prevent a ceramic green sheet from being deformed and destroyed and prevent a solvent contained in an electrode paste from sinking into a ceramic green sheet, thereby enabling manufacture of a multi-layered unit including a ceramic green sheet and an electrode layer laminated to each other in a desired manner. The method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component according to the present invention includes a step of forming a ceramic green sheet on the surface of a first carrier film, a step of forming a release layer on the surface of a second carrier film including a surface-treated region on which a surface treatment is performed for improving releasability and non-surface-treated regions on which no surface treatment is performed on both sides of the surface-treated region and having a width substantially equal to that of the first carrier film, a step of forming an electrode layer in a predetermined pattern and a spacer layer in a complementary pattern to that of the electrode layer on the surface of the release layer, thereby forming an inner electrode layer, a step of forming an adhesive layer on the surface of a third carrier film having a width substantially equal to that of the second carrier film, a step of transferring the adhesive layer formed on the third carrier film onto the surface of the inner electrode layer, and a step of transferring the ceramic green sheet formed on the surface of the first carrier film onto the adhesive layer transferred on the surface of the inner electrode layer formed on the surface of the second carrier film, thereby fabricating a multi-layered unit including the ceramic green sheet and the inner electrode layer laminated onto each other, wherein the adhesive layer is formed by coating the surface of the third carrier film with an adhesive agent solution so that the width of the adhesive layer is narrower than the width of the third carrier film by at least 2α where α is a positive value, wider than the width of the ceramic green sheet formed on the surface of the first carrier film and the widths of the release layer and the inner electrode layer formed on the surface of the second carrier film by at least 2α and wider than the width of the surface-treated region of the second carrier film by at least 2α.
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