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    Laser casting apparatus and method
    1.
    发明授权
    Laser casting apparatus and method 失效
    激光铸造设备及方法

    公开(公告)号：US5672285A

    公开(公告)日：1997-09-30

    申请号：US385675

    申请日：1995-02-08

    申请人： Masaki Kondo ,  Shigeki Maekawa

    发明人： Masaki Kondo ,  Shigeki Maekawa

    IPC分类号： H01L21/268 ,  B23K26/06 ,  H01S3/10

    CPC分类号： B23K26/0648 ,  B23K26/06 ,  B23K26/064

    摘要： A laser casting apparatus includes a laser light source, a phase disturbing device for disturbing a phase of laser light output from the laser light source, and a beam forming device for forming a beam of a predetermined shape. The formed beam is cast on a work after decomposing the laser light in to beams each having a small area and then superposing the decomposed beams. The phase disturbing device disturbs the phase of the light in a manner so that the superimposed beam formed of the decomposed beams has a uniform energy distribution without interference fringes.

    摘要翻译： 激光投射装置包括激光光源，用于干扰从激光光源输出的激光的相位的相位干扰装置，以及用于形成预定形状的光束的光束形成装置。 将激光分解成具有小面积的光束，然后叠加分解的光束，将形成的光束投射在工件上。 相位干扰装置以这样的方式干扰光的相位，使得由分解光束形成的叠加光束具有均匀的能量分布而没有干涉条纹。

    Semiconductor device test probe
    2.
    发明授权
    Semiconductor device test probe 有权
    半导体器件测试探头

    公开(公告)号：US07276923B2

    公开(公告)日：2007-10-02

    申请号：US11206167

    申请日：2005-08-18

    申请人： Megumi Takemoto ,  Shigeki Maekawa ,  Yoshihiro Kashiba ,  Yoshinori Deguchi ,  Kazunobu Miki

    发明人： Megumi Takemoto ,  Shigeki Maekawa ,  Yoshihiro Kashiba ,  Yoshinori Deguchi ,  Kazunobu Miki

    IPC分类号： G01R31/00

    CPC分类号： G01R1/06738 ,  G01R1/06711 ,  H01L2224/48463 ,  H01L2924/01037 ,  H01L2924/01057 ,  H01L2924/01079

    摘要： A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t≦r≦35t where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 μm to 30 μm and larger than that of the second curved surface. The test probe may be manufactured by a method comprising the steps of roughing the tip portion of the curved surface by abrasing by means of electrolyte abrasion or abrasing particles to form a symmetrical spherical curved surface, and finishing the tip portion by sliding it on an abrasive member comprising an elastically deformable thick film fixed to a substrate and having abrasive particles therein or thereon directly or through a metallic film.

    摘要翻译： 一种半导体器件测试探针，其具有尖端部分，用于抵抗集成半导体器件的电极焊盘，以建立与电极焊盘的电接触，以测试半导体器件的功能。 球形尖端部分具有由9t <= r <= 35t表示的曲率半径r，其中r是球面的曲率半径，t是电极焊盘的厚度。 尖端部分可以具有基本上位于探头滑动方向上的第一弯曲表面，当探头被推靠在电极垫上并相对于电极焊盘滑动时，第一弯曲表面与第一弯曲表面相对的第二弯曲表面。 第一曲面的曲率半径为7μm〜30μm，大于第二曲面的曲率半径。 测试探针可以通过以下方法制造，该方法包括以下步骤：通过利用电解质磨损或磨损颗粒进行磨损来粗糙化弯曲表面的尖端部分以形成对称的球形曲面，并且通过将其磨削在磨料上来完成尖端部分 其包括固定到基底的可弹性变形的厚膜，其上直接或通过金属膜在其中或其上具有磨料颗粒。

    Socket for testing a semiconductor device and a connecting sheet used for the same
    3.
    发明授权
    Socket for testing a semiconductor device and a connecting sheet used for the same 失效
    用于测试半导体器件的插座和用于其的连接片

    公开(公告)号：US06989681B2

    公开(公告)日：2006-01-24

    申请号：US10659281

    申请日：2003-09-11

    申请人： Shigeki Maekawa ,  Yoshihiro Kashiba

    发明人： Shigeki Maekawa ,  Yoshihiro Kashiba

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0483

    摘要： Probes 1 for testing and outer connecting terminals 14a are electrically connected to a test socket for semiconductor devices. In use of a connecting sheet, fabricated by an elastically deformative insulating member and electrodes 202, flexibility is given, and good electrical contacts are obtainable. Further, because the connecting sheet 2 is exchangeable, contacting capability is recovered by exchange when solder debris is adhered and deposited to increase contact resistances. Accordingly, even though there is scattering of the heights of the outer connecting terminals, good electrical contact with the probes is obtainable, and even though the solder debris of the outer connecting terminals is adhered and deposited as a result of repeated usage, tests can be continuously conducted, wherein the test socket for semiconductor devices has good maintenance capability.

    摘要翻译： 用于测试的探针1和外部连接端子14a被电连接到用于半导体器件的测试插座。 在使用通过弹性变形绝缘构件和电极202制造的连接片材的情况下，给出柔性，并且可以获得良好的电接触。 此外，由于连接片2是可交换的，所以当焊料残渣被附着和沉积以增加接触电阻时，通过交换来回收接触能力。 因此，即使存在外部连接端子的高度的散射，也可以获得与探针的良好的电接触，并且即使由于重复使用而使外部连接端子的焊料残渣粘附和沉积，也可以是 连续进行，其中半导体器件测试插座具有良好的维护能力。

    Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter
    4.
    发明授权
    Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter 有权
    用于半导体器件的测试探针，其制造方法和用于除去异物的部件

    公开(公告)号：US06888344B2

    公开(公告)日：2005-05-03

    申请号：US10285625

    申请日：2002-11-01

    申请人： Shigeki Maekawa ,  Megumi Takemoto ,  Kazunobu Miki ,  Mutsumi Kano ,  Takahiro Nagata ,  Yoshihiro Kashiba

    发明人： Shigeki Maekawa ,  Megumi Takemoto ,  Kazunobu Miki ,  Mutsumi Kano ,  Takahiro Nagata ,  Yoshihiro Kashiba

    IPC分类号： G01R1/067 ,  G01R3/00 ,  G01R1/04

    CPC分类号： G01R1/06738 ,  G01R1/06755 ,  G01R3/00

    摘要： A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of: θ=cos−1(1−t/R)≧15° where the radius of curvature of the spherical surface is R, the thickness of the pad is t, and the angle formed at the pad surface between the tangential line with respect to the probe tip face and the pad surface when the probe is pressed against the pad is θ, the probe have a flat portion at an end of the tip portion. Accordingly, a contact surface can be established between the probe trip and the pad with a sufficient degree of electrical continuity, and when the the probe level is adjusted in the probing, a time required for positioning the probe prior to the start of measurement is cut down and variation in measurement are reduced.

    摘要翻译： 一种用于半导体器件的测试探针，所述测试探针具有被压靠在半导体器件的测试焊盘上的尖端部分，以建立所述尖端部分和所述焊盘之间的电接触，以测试所述半导体器件的操作，其中形成所述探针 在探针被压靠在衬垫上时，具有相对于探针的尖端面的切线与衬垫表面之间形成有不小于15度的角度的尖端形状， 具有满足以下关系的球面的探针：<？in-line-formula description =“In-line Formulas”end =“lead”？> theta = cos（1-t） / R）> = 15°<？in-line-formula description =“在线公式”end =“tail”？>其中球面的曲率半径为R，垫的厚度为t， 当探针被按压时，形成在相对于探针尖端面的切线与焊盘表面之间的焊盘表面处的角度 衬垫是θ，探针在尖端部分的端部具有平坦部分。 因此，可以在探针跳闸和焊盘之间建立足够的电连续性的接触表面，并且当在探测中调整探针电平时，切割在测量开始之前定位探针所需的时间被切断 降低了测量的变化。

    Method for manufacturing casting and apparatus for manufacturing a casting
    6.
    发明授权
    Method for manufacturing casting and apparatus for manufacturing a casting 失效
    铸件的制造方法以及铸件的制造装置

    公开(公告)号：US5433262A

    公开(公告)日：1995-07-18

    申请号：US22657

    申请日：1993-03-01

    申请人： Kenji Kawaguchi ,  Mikio Yamashita ,  Shigeki Maekawa

    发明人： Kenji Kawaguchi ,  Mikio Yamashita ,  Shigeki Maekawa

    IPC分类号： B22D17/12 ,  B22D17/00 ,  B22D17/22 ,  B22D17/32 ,  B22D18/02 ,  F04C18/02 ,  B22D27/11

    CPC分类号： B22D17/00 ,  F04C18/0246

    摘要： A process and an apparatus for manufacturing a cast product in which the cavity 2c is defined by a top die 1, a bottom die 2 and a slidable die insert 11 relative to the top die 1 and a pressure is applied to the die insert 11 by a hydraulic cylinder 13 before casting, injecting a molten metal 6 at a pressure higher than that on the die insert 11 to cause the die insert 11 to move rearward, whereby the molten metal 6 is additionally filled in the cavity 2c by an amount corresponding to the shrinkage due to pressurization, and a pressure on the molten metal 6 within the cavity 2c is maintained through the die insert 11 even after the molten metal 6 in the gate 2b has been solidified and the injection pressure has: not been transmitted anymore.

    摘要翻译： 用于制造铸造产品的工艺和装置，其中腔2c由顶模1，底模2和相对于顶模1的可滑动模插入件11限定，并且压力通过 在铸造之前的液压缸13，以比模具插入件11上的压力更高的压力喷射熔融金属6，使模具插入件11向后移动，从而将熔融金属6另外填充在空腔2c中相当于 即使在栅极2b中的熔融金属6已经固化并且注入压力已经不再传输之后，由于加压引起的收缩和腔体2c内的熔融金属6上的压力也被保持通过模插件11。

    Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested
    8.
    发明授权
    Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested 失效
    测试插座，测试插座的制造方法，使用测试插座的测试方法和要测试的部件

    公开(公告)号：US06794890B1

    公开(公告)日：2004-09-21

    申请号：US09625047

    申请日：2000-07-24

    申请人： Yasushi Tokumo ,  Shigeki Maekawa ,  Yoshihiro Kashiba ,  Shigeru Takada

    发明人： Yasushi Tokumo ,  Shigeki Maekawa ,  Yoshihiro Kashiba ,  Shigeru Takada

    IPC分类号： G01R1073

    CPC分类号： G01R1/0466 ,  G01R1/06716 ,  G01R1/06738

    摘要： Two resilient sections are connected to a tip end which is to be brought into contact with an external connection terminal of a contact belonging to a test socket of an electronic device or semiconductor package. The resilient sections provided opposite to each other and are bent so as to extend horizontally with respect to the tip end. The force exerted downward on the tip end is equally distributed between the plurality of resilient sections. The resilient sections are eventually deflected downwardly without involvement of horizontal sliding action. The force which is exerted on the tip end in reaction to the downward deflection of the curved portions brings the tip end into pressing contact with the external connection terminal without involvement of horizontal sliding action of the tip end with respect to the external connection terminal.

    摘要翻译： 两个弹性部分连接到要与属于电子装置或半导体封装的测试插座的触点的外部连接端子接触的尖端。 弹性部分彼此相对设置并弯曲成相对于尖端水平延伸。 向下施加在尖端上的力均等地分布在多个弹性部分之间。 弹性部分最终向下偏转而不涉及水平滑动作用。 与弯曲部分的向下偏转相对应地施加在尖端上的力使得尖端与外部连接端子压接，而不会引起尖端相对于外部连接端子的水平滑动。

    Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus
    9.
    发明授权
    Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus 失效
    用于除去附着于探针尖端的异物的部件和制造探针尖端的方法，清洁附着在探针尖端的异物的方法，探针和探测装置

    公开(公告)号：US06741086B2

    公开(公告)日：2004-05-25

    申请号：US10126982

    申请日：2002-04-22

    申请人： Shigeki Maekawa ,  Megumi Takemoto ,  Yoshihiro Kashiba

    发明人： Shigeki Maekawa ,  Megumi Takemoto ,  Yoshihiro Kashiba

    IPC分类号： B08B100

    CPC分类号： B08B1/00 ,  G01R1/06738 ,  G01R3/00

    摘要： The present invention provides a member for removing foreign matter adhering to the spherical tip portion of a test probe which is put into contact with the bonding pads of a semiconductor chip to test the action of the semiconductor chip. The member includes four essential layers of a base plate, a first elastic member on the base plate and flexibly deformable upon contact of the probe, specifically, a predetermined Young's modulus, a second elastic member on the first elastic member and having a tensile strength and a thickness responding to contact stress produced by the contact of the probe, and an abrasive layer on the second elastic member and made of hard particles and a binding material in a volume ratio providing a smooth sliding action of the probe and producing a high abrasive efficiency to any adhering foreign matter. The removing member can smoothly slide the probe to effectively remove the foreign matter adhering to the probe tip.

    摘要翻译： 本发明提供了一种用于去除与半导体芯片的接合焊盘接触的测试探针的球形尖端部分的异物的元件，以测试半导体芯片的作用。 所述构件包括基板的四个基本层，所述基板上的第一弹性构件，并且在所述探针接触时可挠曲，特别是预定的杨氏模量，所述第一弹性构件上的第二弹性构件， 响应于由探针接触产生的接触应力的厚度和第二弹性构件上的研磨层，由硬颗粒和结合材料制成的体积比提供了探针的平滑滑动作用并产生高的研磨效率 任何粘附的异物。 移除构件可以平滑地滑动探针，以有效地去除粘附到探针尖端的异物。