公开(公告)号：US6148909A

公开(公告)日：2000-11-21

申请号：US236371

申请日：1999-01-25

申请人： Masashi Osanai ,  Shunsuke Miyamoto ,  Tomohisa Sato ,  Hiroaki Takechi ,  Tsutomu Hatanaka ,  Norio Takahashi ,  Toshiyuki Kamei ,  Takumi Sugihara ,  Isao Shibata ,  Hironori Akiba

发明人： Masashi Osanai ,  Shunsuke Miyamoto ,  Tomohisa Sato ,  Hiroaki Takechi ,  Tsutomu Hatanaka ,  Norio Takahashi ,  Toshiyuki Kamei ,  Takumi Sugihara ,  Isao Shibata ,  Hironori Akiba

IPC分类号： F04B49/06 ,  F04B41/00 ,  F25B1/00 ,  G05D23/00 ,  G05D23/19 ,  F25B29/00

CPC分类号： G05D23/1919

摘要： A temperature control system which performs control of an object whose temperature is to be controlled as accurately as possible. The system comprises: a chiller located in a fluid circulating and supplying system, for cooling a thermal fluid returning from a vacuum chamber, a first flow control valve located in the fluid circulating and supplying system in a position between the chiller and the vacuum chamber, a bypass passage for splitting and supplying thermal fluid returning from the vacuum chamber to a position between the first flow control valve and the vacuum chamber, before it reaches the chiller, a second flow control valve located in the bypass passage, and a halogen lamp heater located in the fluid circulating and supplying system in a position between a confluence point of the bypass passage and the vacuum chamber, for adjusting the temperature of the thermal fluid passing therethrough to a set temperature.

摘要翻译： 一种温度控制系统，其对要温度控制的物体尽可能准确地进行控制。 该系统包括：位于流体循环供应系统中的冷却器，用于冷却从真空室返回的热流体;位于冷却器和真空室之间位置的流体循环供应系统中的第一流量控制阀， 旁通通道，用于将从真空室返回的热流体分流并供应到第一流量控制阀和真空室之间的位置，到达冷却器之前，位于旁路通道中的第二流量控制阀和卤素灯加热器 位于流体循环和供给系统中的位于旁路通道的汇合点和真空室之间的位置，用于将通过其的热流体的温度调节到设定温度。

公开(公告)号：US20140014643A1

公开(公告)日：2014-01-16

申请号：US14008287

申请日：2012-03-28

申请人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

发明人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

IPC分类号： H01L21/67

CPC分类号： H01L21/67103 ,  H01L21/67098 ,  H01L21/68728 ,  H01L21/68785

摘要： A heating device includes a base plate and a face plate that is provided above the base plate and on which a wafer is placed. The face plate includes an aluminum substrate, a film heater that is provided to the aluminum substrate and heats the wafer, and a gap ball that is disposed on the aluminum substrate and interposed between the aluminum substrate and the wafer. The aluminum substrate is provided with a second attachment hole into which the gap ball is press-fitted. The gap ball is held only by an inner wall of the second attachment hole by being press-fitted.

摘要翻译： 加热装置包括基板和面板，其设置在基板上方并且放置有晶片。 面板包括铝基板，设置在铝基板上并加热晶片的薄膜加热器，以及设置在铝基板上且介于铝基板和晶片之间的间隙球。 铝基板设置有第二安装孔，间隙球被压配入其中。 间隙球仅由第二安装孔的内壁通过压配而保持。

公开(公告)号：US20140014644A1

公开(公告)日：2014-01-16

申请号：US14008373

申请日：2012-03-28

申请人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

发明人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

IPC分类号： H01L21/02

CPC分类号： H01L21/02002 ,  H01L21/67103 ,  H01L21/68728 ,  H01L21/68785 ,  H05B3/143

摘要： A heating device includes a substrate in a form of a face plate that is positioned above a base plate, on which a wafer is placed, and to which a film heater for heating wafer is provided, columns that are vertically provided between the base plate and the face plate and support the face plate, and tension members that pull the face plate toward the base plate. The columns and the tension members are positioned to support or pull at least a part of the face plate corresponding to a placement region of the wafer. Each of the tension members includes a shaft having an upper end locked by the face plate and a lower end penetrating the base plate and a coil spring that is positioned on the base plate and biases the lower end of the shaft downward.

摘要翻译： 加热装置包括位于基板上方的面板形状的基板，晶片被放置在基板上，并且设置有用于加热晶片的薄膜加热器，垂直设置在基板和 面板和支撑面板，以及将面板拉向底板的张紧构件。 柱和张紧构件定位成支撑或拉动对应于晶片的放置区域的面板的至少一部分。 每个张力构件包括具有被面板锁定的上端和穿过基板的下端的轴，以及定位在基板上的螺旋弹簧，并且将轴的下端偏压到下方。

公开(公告)号：US20070009010A1

公开(公告)日：2007-01-11

申请号：US11472463

申请日：2006-06-22

申请人： Koji Shio ,  Hideyuki Wakai ,  Akihiro Ohsawa ,  Hironori Akiba

发明人： Koji Shio ,  Hideyuki Wakai ,  Akihiro Ohsawa ,  Hironori Akiba

IPC分类号： G01K11/00

CPC分类号： G01K11/125

摘要： A non-contact wafer temperature measuring apparatus by which a wafer temperature can be measured with accuracy in situ even in a low temperature process. The wafer temperature measuring apparatus for measuring a wafer temperature based on reflected light of light applied to a wafer as a target of temperature measurement includes: a light source unit for generating light containing a P-polarized component having a wavelength not larger than 400 nm and applying the light to the wafer; a light receiving unit for receiving the light reflected by the wafer and detecting at least intensity of the P-polarized component having the wavelength not larger than 400 nm; and a signal processing unit for calculating a temperature of the target of temperature measurement at least based on the intensity of the P-polarized component having the wavelength not larger than 400 nm detected by the light receiving unit.

摘要翻译： 非接触式晶片温度测量装置，即使在低温工艺中也可以准确地测量晶片温度。 用于测量基于作为温度测量对象的晶片的光的反射光的晶片温度测量装置包括：用于产生包含波长不大于400nm的P偏振分量的光的光源单元和 将光施加到晶片; 光接收单元，用于接收由晶片反射的光并至少检测波长不大于400nm的P偏振分量的至少强度; 以及信号处理单元，用于至少基于由光接收单元检测到的具有不大于400nm的波长的P偏振分量的强度来计算温度测量目标温度。

公开(公告)号：US06347521B1

公开(公告)日：2002-02-19

申请号：US09685805

申请日：2000-10-11

申请人： Kanichi Kadotani ,  Makio Tsubota ,  Hironori Akiba ,  Tadayuki Hanamoto

发明人： Kanichi Kadotani ,  Makio Tsubota ,  Hironori Akiba ,  Tadayuki Hanamoto

IPC分类号： F25B2102

CPC分类号： H01L21/67103 ,  F25B21/02 ,  F25B2500/01 ,  H01L23/38 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention provides a temperature control device with excellent temperature uniformity and thermal response, which can be manufactured easily, and a manufacturing method for the same. A thermoelectric device 21 is arranged between a substrate mounting plate 1 and a cooling plate 3. Copper foil electrodes 5, 5, . . . on the upper side of the thermoelectric device 21 are adhered to a lower surface of the substrate mounting plate 1 with an adhesive sheet 17 covering substantially the entire lower surface of the substrate mounting plate 1, and copper foil electrodes 7, 7, . . . on the lower side of the thermoelectric device 21 are adhered to an upper surface of the cooling plate 3 with an adhesive sheet 19 covering substantially the entire upper surface of the substrate mounting plate 1. The total thickness of the adhesive sheet 17 and the copper foil electrodes 5 adhering to it, and the total thickness of the adhesive sheet 19 and the copper foil electrodes 7 adhering to it, is each set approximately 25 to 1000 &mgr;m thin, so as to make the thermal resistance sufficiently low. Thermoelectric conversion elements 9 and 13 are distributed across a large area covering at least the entire area corresponding to the substrate 2.

摘要翻译： 本发明提供一种具有优异的温度均匀性和热响应的温度控制装置，其可以容易地制造，以及其制造方法。 热电装置21设置在基板安装板1和冷却板3之间。铜箔电极5,5。 。 。 在基板安装板1的下表面上，在基板安装板1的大致整个下表面覆盖有粘接片17和铜箔电极7,7，将热电元件21的上侧粘接。 。 。 在热电装置21的下侧，利用覆盖基板安装板1的整个上表面的粘合片19将冷却板3的上表面粘接。粘合片17和铜箔的总厚度 附着在其上的电极5和附着在其上的粘合片19和铜箔电极7的总厚度分别设定为25〜1000μm左右，使得热阻足够低。 热电转换元件9和13分布在覆盖至少对应于基板2的整个区域的大面积上。

公开(公告)号：US06894215B2

公开(公告)日：2005-05-17

申请号：US10348153

申请日：2003-01-21

申请人： Hironori Akiba

发明人： Hironori Akiba

IPC分类号： H01L35/30 ,  H01L35/02 ,  H01L35/32

CPC分类号： H01L35/30

摘要： A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements (13, 14) which are alternately placed, and outer electrodes (15) and inner electrodes (16), which are alternately placed between the thermoelectric elements (13, 14), and at least part of at least either one of the outer electrode (15) or the inner electrode (16) has a shape approximately along an object which exchanges heat with the electrodes (15, 16). The inner electrodes (16) surround an object which exchanges heat with the electrodes (15, 16).

摘要翻译： 提供了一种结构简单，热应力断裂较少的热电模块。 为此，热电模块包括交替放置的p型和n型热电元件（13,14），以及交替放置在热电元件（13）之间的外电极（15）和内电极（16） ，14），并且外部电极（15）或内部电极（16）中的至少一个的至少一部分具有大致沿着与电极（15,16）进行热交换的物体的形状。 内部电极（16）围绕与电极（15,16）进行热交换的物体。