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94 条记录 (耗时 0.045 秒)

    Heating Device
    1.
    发明申请
    Heating Device 审中-公开
    加热装置

    公开(公告)号：US20140014643A1

    公开(公告)日：2014-01-16

    申请号：US14008287

    申请日：2012-03-28

    申请人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

    发明人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

    IPC分类号： H01L21/67

    CPC分类号： H01L21/67103 ,  H01L21/67098 ,  H01L21/68728 ,  H01L21/68785

    摘要： A heating device includes a base plate and a face plate that is provided above the base plate and on which a wafer is placed. The face plate includes an aluminum substrate, a film heater that is provided to the aluminum substrate and heats the wafer, and a gap ball that is disposed on the aluminum substrate and interposed between the aluminum substrate and the wafer. The aluminum substrate is provided with a second attachment hole into which the gap ball is press-fitted. The gap ball is held only by an inner wall of the second attachment hole by being press-fitted.

    摘要翻译： 加热装置包括基板和面板，其设置在基板上方并且放置有晶片。 面板包括铝基板，设置在铝基板上并加热晶片的薄膜加热器，以及设置在铝基板上且介于铝基板和晶片之间的间隙球。 铝基板设置有第二安装孔，间隙球被压配入其中。 间隙球仅由第二安装孔的内壁通过压配而保持。

    Heating Device
    2.
    发明申请
    Heating Device 审中-公开
    加热装置

    公开(公告)号：US20140014644A1

    公开(公告)日：2014-01-16

    申请号：US14008373

    申请日：2012-03-28

    申请人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

    发明人： Hironori Akiba ,  Kazuhiko Kubota ,  Tsutomu Hatanaka ,  Yuichi Sakai ,  Akira Yonemizu ,  Kazuhiko Ooshima

    IPC分类号： H01L21/02

    CPC分类号： H01L21/02002 ,  H01L21/67103 ,  H01L21/68728 ,  H01L21/68785 ,  H05B3/143

    摘要： A heating device includes a substrate in a form of a face plate that is positioned above a base plate, on which a wafer is placed, and to which a film heater for heating wafer is provided, columns that are vertically provided between the base plate and the face plate and support the face plate, and tension members that pull the face plate toward the base plate. The columns and the tension members are positioned to support or pull at least a part of the face plate corresponding to a placement region of the wafer. Each of the tension members includes a shaft having an upper end locked by the face plate and a lower end penetrating the base plate and a coil spring that is positioned on the base plate and biases the lower end of the shaft downward.

    摘要翻译： 加热装置包括位于基板上方的面板形状的基板，晶片被放置在基板上，并且设置有用于加热晶片的薄膜加热器，垂直设置在基板和 面板和支撑面板，以及将面板拉向底板的张紧构件。 柱和张紧构件定位成支撑或拉动对应于晶片的放置区域的面板的至少一部分。 每个张力构件包括具有被面板锁定的上端和穿过基板的下端的轴，以及定位在基板上的螺旋弹簧，并且将轴的下端偏压到下方。

    PLASMA DISPLAY PANEL DRIVING METHOD AND PLASMA DISPLAY DEVICE
    3.
    发明申请
    PLASMA DISPLAY PANEL DRIVING METHOD AND PLASMA DISPLAY DEVICE 审中-公开
    等离子显示面板驱动方法和等离子体显示装置

    公开(公告)号：US20120280963A1

    公开(公告)日：2012-11-08

    申请号：US13522260

    申请日：2011-01-19

    申请人： Keiji Akamatsu ,  Yuichi Sakai ,  Minoru Takeda ,  Hidehiko Shoji ,  Naoyuki Tomioka

    发明人： Keiji Akamatsu ,  Yuichi Sakai ,  Minoru Takeda ,  Hidehiko Shoji ,  Naoyuki Tomioka

    IPC分类号： G09G5/00 ,  G09G3/28

    CPC分类号： G09G3/296 ,  G09G3/2927 ,  G09G3/2965 ,  G09G2330/026 ,  G09G2330/027

    摘要： The present invention allows a plasma display apparatus having a high-luminance panel to decrease initializing bright points that easily occur just after power-on of the apparatus, enhancing the quality of display image. The panel has discharge cells, each of which including a data electrode, and a display electrode pair formed of a scan electrode and a sustain electrode. In the driving method of the panel, one field period is formed of subfields, each of which including an initializing period for generating initializing discharge in the discharge cells, an address period for applying scan pulses to the scan electrodes and applying address pulses to the data electrodes, and a sustain period for applying sustain pulses to the data electrode pairs. In the structure above, a predetermined period after power-off of the apparatus has no generation of the address pulses, the scan pulses, and the sustain pulses.

    摘要翻译： 本发明允许具有高亮度面板的等离子体显示装置降低初始化装置刚刚开启之后容易出现的亮点，从而提高显示图像的质量。 面板具有包括数据电极的放电单元和由扫描电极和维持电极形成的显示电极对。 在面板的驱动方法中，一个场周期由子场形成，每个子场包括用于在放电单元中产生初始化放电的初始化周期，用于向扫描电极施加扫描脉冲的寻址周期，并将数据施加到数据 电极和用于将维持脉冲施加到数据电极对的维持周期。 在上述结构中，设备断电后的预定周期不产生寻址脉冲，扫描脉冲和维持脉冲。

    Heating apparatus, heating method, and computer readable storage medium
    4.
    发明授权
    Heating apparatus, heating method, and computer readable storage medium 有权
    加热装置，加热方法和计算机可读存储介质

    公开(公告)号：US07992318B2

    公开(公告)日：2011-08-09

    申请号：US12007975

    申请日：2008-01-17

    申请人： Tatsuya Kawaji ,  Yuichi Sakai ,  Masatoshi Kaneda

    发明人： Tatsuya Kawaji ,  Yuichi Sakai ,  Masatoshi Kaneda

    IPC分类号： F26B11/02

    CPC分类号： H01L21/67109 ,  H01L21/6838 ,  H01L21/6875

    摘要： A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.

    摘要翻译： 公开的用于加热其上涂覆有薄膜的基板的加热装置包括具有用于向处理室供应第一气体的气体供给开口的处理室和用于从处理室排出第一气体的排气开口; 加热板，其设置在所述处理室中并且包括用于加热所述基板的加热元件; 多个突起，布置在所述加热板上以支撑所述基板; 多个吸入孔，形成在加热板中，以便通过吸引衬底吸引加热板; 以及气体入口，其适于将第二气体供应到由所述多个突起支撑的所述加热板和所述基板之间的间隙。

    Signal processing apparatus, signal processing method, and recording medium
    6.
    发明授权
    Signal processing apparatus, signal processing method, and recording medium 有权
    信号处理装置，信号处理方法和记录介质

    公开(公告)号：US07954113B2

    公开(公告)日：2011-05-31

    申请号：US11336284

    申请日：2006-01-20

    申请人： Kosei Yamashita ,  Yasushi Miyajima ,  Motoyuki Takai ,  Yoichiro Sako ,  Toshiro Terauchi ,  Toru Sasaki ,  Yuichi Sakai

    发明人： Kosei Yamashita ,  Yasushi Miyajima ,  Motoyuki Takai ,  Yoichiro Sako ,  Toshiro Terauchi ,  Toru Sasaki ,  Yuichi Sakai

    IPC分类号： G06F3/00 ,  G06F9/44 ,  G06F9/46 ,  G06F13/00

    CPC分类号： G06F8/20

    摘要： A signal processing apparatus includes the following elements. A plurality of signal processing software modules perform unit signal-processing steps of signal processing by means of software processing. An instruction input receiving unit receives an instruction. A virtual connecting unit sets up a virtual connection between inputs and outputs of the signal processing software modules in response to the received instruction. A circuit structure information storing and managing unit stores and manages the virtually connected signal processing software modules. A path routing unit routes a signal processing path to determine the order in which the stored signal processing software modules perform the signal processing. A signal processing executing unit performs the signal processing by sequentially executing the signal processing software modules in the determined order. The path routing unit determines whether a feedback loop including no delay element is generated in a circuit composed of the signal processing software modules.

    摘要翻译： 信号处理装置包括以下元件。 多个信号处理软件模块通过软件处理执行信号处理的单元信号处理步骤。 指令输入接收单元接收指令。 虚拟连接单元响应于接收到的指令在信号处理软件模块的输入和输出之间建立虚拟连接。 电路结构信息存储和管理单元存储和管理虚拟连接的信号处理软件模块。 路径路由单元路由信号处理路径以确定存储的信号处理软件模块执行信号处理的顺序。 信号处理执行单元通过以确定的顺序依次执行信号处理软件模块来执行信号处理。 路径路由单元确定在由信号处理软件模块组成的电路中是否产生不包括延迟元件的反馈回路。

    HEAT PROCESSING APPARATUS AND HEAT PROCESSING METHOD
    10.
    发明申请
    HEAT PROCESSING APPARATUS AND HEAT PROCESSING METHOD 有权
    热处理装置和热处理方法

    公开(公告)号：US20070169373A1

    公开(公告)日：2007-07-26

    申请号：US11624404

    申请日：2007-01-18

    申请人： Shigeki Aoki ,  Yuichi Sakai ,  Mitsuo Yamashita ,  Hiroshi Shinya

    发明人： Shigeki Aoki ,  Yuichi Sakai ,  Mitsuo Yamashita ,  Hiroshi Shinya

    IPC分类号： F26B3/00 ,  F26B19/00

    CPC分类号： F26B3/20 ,  F26B9/103 ,  F26B21/001 ,  G03F7/168 ,  G03F7/40 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/67248 ,  H01L21/677 ,  H01L21/67748

    摘要： A heat processing apparatus includes a heating plate configured to heat the substrate; a cover configured to surround a space above the heating plate; an exhaust gas flow forming mechanism configured to exhaust gas inside the cover to form exhaust gas flows within the space above the heating plate; a downflow forming mechanism configured to form downflows uniformly supplied onto an upper surface of the substrate placed on the heating plate; and a control mechanism configured to execute mode switching control between a mode arranged to heat the substrate while forming the downflows by the downflow forming mechanism and a mode arranged to heat the substrate while forming the exhaust gas flows by the exhaust gas flow forming mechanism.

    摘要翻译： 热处理装置包括：加热板，其被配置为加热所述基板; 盖构造成围绕加热板上方的空间; 排气流动形成机构，其构造成在所述盖内排出气体，以在所述加热板上方的空间内形成废气流; 下降形成机构，其被配置为形成均匀地供给到放置在所述加热板上的所述基板的上表面上的下流; 以及控制机构，其被配置为在通过下流形成机构形成下流的同时，在布置成加热所述基板的模式之间执行模式切换控制，以及布置成在形成所述废气的同时由所述排气流动形成机构流动的模式。