公开(公告)号：US5769588A

公开(公告)日：1998-06-23

申请号：US700267

申请日：1996-08-20

申请人： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

发明人： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

IPC分类号： H01L21/02 ,  B65G49/05 ,  B65G49/07 ,  B65G65/00 ,  H01L21/205 ,  H01L21/285 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/677

CPC分类号： H01L21/67754 ,  H01L21/67201 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

公开(公告)号：US5186594A

公开(公告)日：1993-02-16

申请号：US511481

申请日：1990-04-19

申请人： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

发明人： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

IPC分类号： H01L21/02 ,  B65G49/05 ,  B65G49/07 ,  B65G65/00 ,  H01L21/205 ,  H01L21/285 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/677

CPC分类号： H01L21/67754 ,  H01L21/67201 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

公开(公告)号：US06599076B2

公开(公告)日：2003-07-29

申请号：US10223539

申请日：2002-08-19

申请人： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall

发明人： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall

IPC分类号： B65G4907

CPC分类号： H01L21/67754 ,  H01L21/67201 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

公开(公告)号：US06454519B1

公开(公告)日：2002-09-24

申请号：US08813480

申请日：1997-03-07

申请人： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

发明人： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall ,  David Cheng

IPC分类号： B65G4905

CPC分类号： H01L21/67754 ,  H01L21/67201 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

公开(公告)号：US06454508B2

公开(公告)日：2002-09-24

申请号：US09070854

申请日：1998-05-01

申请人： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall

发明人： Masato M. Toshima ,  Phil M. Salzman ,  Steven C. Murdoch ,  Cheng Wang ,  Mark A. Stenholm ,  James Howard ,  Leonard Hall

IPC分类号： B65G4905

CPC分类号： H01L21/67754 ,  H01L21/67201 ,  H01L21/67766 ,  H01L21/67772 ,  H01L21/67778 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

摘要翻译： 工件加载界面包括在工件处理系统中，该系统在真空中处理工件（通常为晶片）。 工件装载界面包括两个独立的室。 每个室可以单独泵送。 因此，当来自第一室的第一个晶片盒被存取时，第二个晶片盒可装载在第二个室中，并且第二个室被抽出。 每个房间旨在最大限度地减少对洁净室的侵扰。 因此，每个室的门具有这样的机构，当打开门时，首先使门稍微远离室中的开口移动，然后门平行于室移动。 门打开后，一块晶片以一个像吊桥那样的运动通过开口下降。 当从盒中接触晶片的位置不同于盒从壳体中降出的位置时，盒可以在室内枢转。