摘要:
The present invention stably supplies a side blow gas to a piercing site and prevents the adherence of spatter to a cutting nozzle. A hood, which is attached to a side blow gas nozzle, guides side blow gas jetted from a side blow gas nozzle to the piercing site and prevents spatter from adhering to the cutting nozzle as laser beam and assist gas are respectively radiated or jetted onto a cutting material through a communicating hole.
摘要:
In a piercing operation prior to the laser cutting of steel, etc., the development of a technology in which a piercing hole of the intended shape is obtained in a short time, even for a thick cut work. An oxygen gas coaxial to the laser beam applied towards the cut work and a low concentration gas with a low oxygen concentration and major components comprising nitrogen gas, air, or a mixture thereof discharged from an outer gas nozzle disposed so as to surround the outer side of the flow of this oxygen gas is supplied and disposed towards said cut work, and can realize shortening of the time, etc., of the piercing operation time by applying a laser beam to the cut work. In addition, a laser processing nozzle provided with an inner gas nozzle which discharges oxygen gas and an outer gas nozzle which discharges low concentration gas, and a laser cutting apparatus provided with this nozzle is provided.
摘要:
A laser processing apparatus has a first laser beam reversal apparatus which reverses the laser beam from the laser oscillator, and a second laser beam reversal apparatus which reverses the laser beam reversed by the first laser beam reversal apparatus, and guides the laser beam to the inside of the processing head, in which a first laser optical path which runs from the laser oscillator to the first laser beam reversal apparatus, a second laser optical path which runs form the first laser beam reversal apparatus to the second laser beam reversal apparatus, and a third laser optical path which runs from the second laser beam reversal apparatus to the processing head are parallel.
摘要:
A laser processing apparatus has a first laser beam reversal apparatus which reverses the laser beam from the laser oscillator, and a second laser beam reversal apparatus which reverses the laser beam reversed by the first laser beam reversal apparatus, and guides the laser beam to the inside of the processing head, in which a first laser optical path which runs from the laser oscillator to the first laser beam reversal apparatus, a second laser optical path which runs form the first laser beam reversal apparatus to the second laser beam reversal apparatus, and a third laser optical path which runs from the second laser beam reversal apparatus to the processing head are parallel.