公开(公告)号：US20070272124A1

公开(公告)日：2007-11-29

申请号：US10584398

申请日：2004-12-27

申请人： Masayuki Tsutsumi ,  Satoshi Maeda ,  Keizo Kawahara ,  Takefumi Yoshida ,  Kazutake Okamoto ,  Morio Morino ,  Shoichi Uemura ,  Akinobu Nagara ,  Noriko Takahashi ,  Hiroko Oyama ,  Shunji Kurahara ,  Jun Yasui

发明人： Masayuki Tsutsumi ,  Satoshi Maeda ,  Keizo Kawahara ,  Takefumi Yoshida ,  Kazutake Okamoto ,  Morio Morino ,  Shoichi Uemura ,  Akinobu Nagara ,  Noriko Takahashi ,  Hiroko Oyama ,  Shunji Kurahara ,  Jun Yasui

IPC分类号： C08J5/18 ,  C08G73/22 ,  C08L79/04 ,  H05K1/03

CPC分类号： C08J5/18 ,  C08J2379/08 ,  H05K1/0346

摘要： This polyimide film is superior in heat resistance, rigidity and high frequency properties, is free of inconveniences due to curling even when various functional layers are laminated by heating, and is preferable as a substrate film superior in thermal degradation stability for electronic parts. This polyimide film has a planar orientation coefficient of 0.79-0.89 as measured by an X-ray diffraction method, a difference in the surface planar orientation degree between one surface thereof and the other surface thereof of not more than 2 and a curling degree of not more than 5%, which is obtained by imidation of a polyimide precursor film having a particular imidation rate.

摘要翻译： 该聚酰亚胺膜的耐热性，刚性和高频特性优异，即使通过加热层压各种功能层也不会发生卷曲的不便，优选作为电子部件的热劣化稳定性优异的基板膜。 该聚酰亚胺膜通过X射线衍射法测得的平面取向系数为0.79-0.89，其一个表面与另一个表面之间的表面平面取向度之差不大于2，卷曲度不为 大于5％，其通过酰亚胺化具有特定酰亚胺化速率的聚酰亚胺前体膜获得。

公开(公告)号：US08314203B2

公开(公告)日：2012-11-20

申请号：US10584398

申请日：2004-12-27

申请人： Masayuki Tsutsumi ,  Satoshi Maeda ,  Keizo Kawahara ,  Takefumi Yoshida ,  Kazutake Okamoto ,  Morio Morino ,  Shoichi Uemura ,  Akinobu Nagara ,  Noriko Takahashi ,  Hiroko Oyama ,  Shunji Kurahara ,  Jun Yasui

发明人： Masayuki Tsutsumi ,  Satoshi Maeda ,  Keizo Kawahara ,  Takefumi Yoshida ,  Kazutake Okamoto ,  Morio Morino ,  Shoichi Uemura ,  Akinobu Nagara ,  Noriko Takahashi ,  Hiroko Oyama ,  Shunji Kurahara ,  Jun Yasui

IPC分类号： C08G69/08

CPC分类号： C08J5/18 ,  C08J2379/08 ,  H05K1/0346

摘要： This polyimide film is superior in heat resistance, rigidity and high frequency properties, is free of inconveniences due to curling even when various functional layers are laminated by heating, and is preferable as a substrate film superior in thermal degradation stability for electronic parts. This polyimide film has a planar orientation coefficient of 0.79-0.89 as measured by an X-ray diffraction method, a difference in the surface planar orientation degree between one surface thereof and the other surface thereof of not more than 2 and a curling degree of not more than 5%, which is obtained by imidation of a polyimide precursor film having a particular imidation rate.

摘要翻译： 该聚酰亚胺膜的耐热性，刚性和高频特性优异，即使通过加热层压各种功能层也不会发生卷曲的不便，优选作为电子部件的热劣化稳定性优异的基板膜。 该聚酰亚胺膜通过X射线衍射法测得的平面取向系数为0.79-0.89，其一个表面与另一个表面之间的表面平面取向度之差不大于2，卷曲度不为 大于5％，其通过酰亚胺化具有特定酰亚胺化速率的聚酰亚胺前体膜获得。