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公开(公告)号：US12074099B2
公开(公告)日：2024-08-27
申请号：US17737564
申请日：2022-05-05
申请人： Materion Corporation
IPC分类号： H01L23/495 , H01L21/48 , H01L23/373 , H01L23/66
CPC分类号： H01L23/49568 , H01L21/4828 , H01L21/4842 , H01L23/3732 , H01L23/49558 , H01L23/49562 , H01L23/49582 , H01L23/49586 , H01L23/66 , H01L2223/6616 , H01L2223/6683
摘要： A microelectronics package assembly and process of making same are disclosed. The flange has an upper surface and a first coating disposed on the upper surface of the flange. The insulator has a bottom surface for mounting onto the flange and an upper surface opposite the bottom surface. A second coating is disposed on the bottom surface of the insulator and a third coating disposed on the upper surface of the insulator. The first coating, the second coating, and the third coating each have a thickness of less than or equal to 1 micron. At least one of the first coating, the second coating, and the third coating is applied via at least one of physical vapor deposition, atomic deposition, or chemical deposition.
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公开(公告)号：US20220359351A1
公开(公告)日：2022-11-10
申请号：US17737564
申请日：2022-05-05
申请人： Materion Corporation
IPC分类号： H01L23/495 , H01L21/48 , H01L23/66 , H01L23/373
摘要： A microelectronics package assembly and process of making same are disclosed. The flange has an upper surface and a first coating disposed on the upper surface of the flange. The insulator has a bottom surface for mounting onto the flange and an upper surface opposite the bottom surface. A second coating is disposed on the bottom surface of the insulator and a third coating disposed on the upper surface of the insulator. The first coating, the second coating, and the third coating each have a thickness of less than or equal to 1 micron. At least one of the first coating, the second coating, and the third coating is applied via at least one of physical vapor deposition, atomic deposition, or chemical deposition.
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