公开(公告)号：US12074099B2

公开(公告)日：2024-08-27

申请号：US17737564

申请日：2022-05-05

Applicant: Materion Corporation

Inventor： Ramesh Kothandapani ,  Christopher Johnson ,  ZhenWei Tee ,  Noel De Leon ,  SinLi Tan

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/373 ,  H01L23/66

CPC classification number: H01L23/49568 ,  H01L21/4828 ,  H01L21/4842 ,  H01L23/3732 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/49586 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6683

Abstract: A microelectronics package assembly and process of making same are disclosed. The flange has an upper surface and a first coating disposed on the upper surface of the flange. The insulator has a bottom surface for mounting onto the flange and an upper surface opposite the bottom surface. A second coating is disposed on the bottom surface of the insulator and a third coating disposed on the upper surface of the insulator. The first coating, the second coating, and the third coating each have a thickness of less than or equal to 1 micron. At least one of the first coating, the second coating, and the third coating is applied via at least one of physical vapor deposition, atomic deposition, or chemical deposition.

公开(公告)号：US20220359351A1

公开(公告)日：2022-11-10

申请号：US17737564

申请日：2022-05-05

Applicant: Materion Corporation

Inventor： Ramesh KOTHANDAPANI ,  Christopher Johnson ,  ZhenWei Tee ,  Noel De Leon ,  SinLi Tan

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/66 ,  H01L23/373

Abstract: A microelectronics package assembly and process of making same are disclosed. The flange has an upper surface and a first coating disposed on the upper surface of the flange. The insulator has a bottom surface for mounting onto the flange and an upper surface opposite the bottom surface. A second coating is disposed on the bottom surface of the insulator and a third coating disposed on the upper surface of the insulator. The first coating, the second coating, and the third coating each have a thickness of less than or equal to 1 micron. At least one of the first coating, the second coating, and the third coating is applied via at least one of physical vapor deposition, atomic deposition, or chemical deposition.

公开(公告)号：US20170239756A1

公开(公告)日：2017-08-24

申请号：US15435856

申请日：2017-02-17

Applicant: Materion Corporation

Inventor： Ramesh Kothandapani ,  SinLi Tan ,  Chee Kong Lee

IPC: B23K35/02 ,  B23K35/30 ,  B23K26/38 ,  B23K26/40 ,  H01L23/10 ,  B23K1/19 ,  C22C5/02 ,  H01L21/48 ,  H01L23/053 ,  B23K35/26 ,  B23K26/16

CPC classification number: B23K35/0222 ,  B23K1/19 ,  B23K26/16 ,  B23K26/38 ,  B23K26/40 ,  B23K35/0233 ,  B23K35/268 ,  B23K35/3013 ,  B23K2103/52 ,  C22C5/02 ,  H01L21/4817 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/16195

Abstract: Methods of making solder preforms are disclosed. A ribbon of raw material is received, and a first annular solder preform is formed by laser cutting the ribbon. The edges of the first annular solder preform can then be cleaned. The cutout section removed from the middle of the first annular solder preform can then be laser cut to form a second annular solder preform that is smaller than the first annular solder preform.