Cooling apparatus for electronic chips
    1.
    发明授权
    Cooling apparatus for electronic chips 失效
    电子芯片冷却装置

    公开(公告)号:US5630469A

    公开(公告)日:1997-05-20

    申请号:US501202

    申请日:1995-07-11

    IPC分类号: H01L23/40 H01L23/467 F28F7/00

    摘要: A circuit board mounted integrated circuit chip such as a processor is cooled by apparatus including a heat sink, a shroud and a fan. The heat sink includes a base placed on the top surface of the chip and fins extending up from the base. The shroud includes top and two opposed side walls closely enclosing the heat sink. The shroud is attached directly to the circuit board rather than to the heat sink or chip and can be used with chips and heat sinks that do not have special provision for attachment of the shroud. The fan moves cooling air through the shroud and between and around the heat sink fins. The fan is mounted to an end of the shroud and does not require clearance above the heat sink and shroud.

    摘要翻译: 诸如处理器的电路板安装的集成电路芯片由包括散热器,护罩和风扇的设备来冷却。 散热器包括放置在芯片顶表面上的基座和从基座向上延伸的翅片。 护罩包括紧密地封闭散热器的顶部和两个相对的侧壁。 护罩直接连接到电路板而不是连接到散热片或芯片上,并且可以与没有特殊设置用于安装护罩的芯片和散热器一起使用。 风扇使冷却空气通过护罩并在散热片之间和周围。 风扇安装在护罩的一端,不需要在散热器和护罩上方的间隙。

    Support structure for installation of a component assembly housed in a rotating, translating carriage chassis
    2.
    发明授权
    Support structure for installation of a component assembly housed in a rotating, translating carriage chassis 有权
    用于安装组装组件的支撑结构,该部件组件容纳在旋转的平移的托架底盘中

    公开(公告)号:US09007084B2

    公开(公告)日:2015-04-14

    申请号:US12815755

    申请日:2010-06-15

    IPC分类号: G01R31/00 G01R31/28

    CPC分类号: G01R31/2808

    摘要: A support structure for installation of a component assembly housed in a rotating, translating carriage chassis, the support structure including: a stationary rail that includes a shaft extruding perpendicular to the stationary rail; a rotating rail adapted to receive a carriage chassis rail, the rotating rail parallel to the stationary rail when the rotating rail is in a non-rotated position, the rotating rail including a shaft receptacle that receives the shaft, the rotating rail configured to rotate about the shaft and relative to the stationary rail; and a translation mechanism attached to the rotating rail, the translation mechanism enabling the carriage chassis rail to translate parallel to and along the rotating rail.

    摘要翻译: 一种用于安装容纳在旋转平移的托架底盘中的部件组件的支撑结构,所述支撑结构包括:静止轨道,其包括垂直于所述静止轨道的轴挤压; 旋转导轨,其适于接收滑架底盘导轨,当所述旋转导轨处于非旋转位置时,所述旋转轨道平行于所述静止导轨,所述旋转导轨包括容纳所述轴的轴容座,所述旋转导轨构造成围绕 轴和相对于固定轨道; 以及平移机构,其连接到旋转导轨上,所述平移机构使得所述滑架底架导轨平行于和沿着所述旋转导轨平移。

    Heatsink and package structures with fusible release layer
    4.
    发明授权
    Heatsink and package structures with fusible release layer 有权
    散热片和包装结构,带有易熔层

    公开(公告)号:US6084775A

    公开(公告)日:2000-07-04

    申请号:US207785

    申请日:1998-12-09

    IPC分类号: H01L21/48 H01L23/373 H05K7/20

    摘要: Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC modules or banks of IC modules that are interconnected to a printed circuit card. A mechanically compliant, thermally conductive adhesive is used to join the heatsinks to the modules. An oxide formed on the release layer readily bonds with the thermally conductive adhesive. In the event that heatsinks need to be removed to repair or rework the modules, local heat may be applied to melt the release layer to remove a heatsink without need for use of significant applied torque and normal forces. Because the release layer has a low melting point that affords easy separation from the adhesive layer, both component delaminations and the partial reflow or melting of solder joints on adjacent components are eliminated from the heatsink removal process.

    摘要翻译: 铝散热器镀有可焊层,并用焊料释放层覆盖。 剥离层包括锡 - 铅 - 铟合金。 散热器安装在与印刷电路卡互连的IC模块或集成电路模块组中。 使用机械兼容的导热粘合剂将散热器连接到模块。 形成在剥离层上的氧化物容易与导热粘合剂结合。 在需要去除散热器来修理或重新组装模块的情况下,可以施加局部热量来熔化释放层以除去散热器,而不需要使用显着施加的扭矩和法向力。 由于释放层具有提供与粘合剂层容易分离的低熔点,因此从散热器去除工艺中消除了相邻部件上的焊料接合部分脱模和部分回流或熔化。

    FAIL TO WIRE REMOVABLE MODULE FOR NETWORK COMMUNICATION LINK
    5.
    发明申请
    FAIL TO WIRE REMOVABLE MODULE FOR NETWORK COMMUNICATION LINK 失效
    未通过网络通信链路的可拆卸模块

    公开(公告)号:US20130121139A1

    公开(公告)日:2013-05-16

    申请号:US13297734

    申请日:2011-11-16

    IPC分类号: H04W24/00

    摘要: A fail-to-wire (FTW) module that preserves a primary data path connection from an upstream computer to a downstream computer if there is any kind of failure in a breakout data path to a breakout system. The FTW module provides switches between the incoming data network data and the breakout system such that when the breakout system encounters a failure, the switches are de-activated to bypass the breakout system. The switches in the FTW module are activated by a system health signal from the breakout system. The breakout system can be serviced without interrupting the data network connections since the FTW module can be extracted from the failed breakout system with data network connections intact. The FTW module is preferably a compact modular element that fits within the breakout chassis and is easily inserted and removed from the breakout system during servicing operations.

    摘要翻译: 如果在突破系统的突发数据路径中存在任何类型的故障,则可以保留从上游计算机到下游计算机的主数据路径连接的故障切换(FTW)模块。 FTW模块在传入的数据网络数据和分组系统之间提供交换机,以便当分线系统遇到故障时,交换机被禁用以绕过分组系统。 FTW模块中的交换机由突发系统的系统运行状况信号激活。 可以在不中断数据网络连接的情况下对突发系统进行维修,因为FTW模块可以从数据网络连接完好的故障突发系统中提取出来。 FTW模块优选地是紧凑的模块化元件,其适合在突出底盘内并且在维修操作期间容易地从分支系统插入和移除。