摘要:
A circuit board mounted integrated circuit chip such as a processor is cooled by apparatus including a heat sink, a shroud and a fan. The heat sink includes a base placed on the top surface of the chip and fins extending up from the base. The shroud includes top and two opposed side walls closely enclosing the heat sink. The shroud is attached directly to the circuit board rather than to the heat sink or chip and can be used with chips and heat sinks that do not have special provision for attachment of the shroud. The fan moves cooling air through the shroud and between and around the heat sink fins. The fan is mounted to an end of the shroud and does not require clearance above the heat sink and shroud.
摘要:
A support structure for installation of a component assembly housed in a rotating, translating carriage chassis, the support structure including: a stationary rail that includes a shaft extruding perpendicular to the stationary rail; a rotating rail adapted to receive a carriage chassis rail, the rotating rail parallel to the stationary rail when the rotating rail is in a non-rotated position, the rotating rail including a shaft receptacle that receives the shaft, the rotating rail configured to rotate about the shaft and relative to the stationary rail; and a translation mechanism attached to the rotating rail, the translation mechanism enabling the carriage chassis rail to translate parallel to and along the rotating rail.
摘要:
A fail-to-wire (FTW) module that preserves a primary data path connection from an upstream computer to a downstream computer if there is any kind of failure in a breakout data path to a breakout system. The FTW module provides switches between the incoming data network data and the breakout system such that when the breakout system encounters a failure, the switches are de-activated to bypass the breakout system. The switches in the FTW module are activated by a system health signal from the breakout system. The breakout system can be serviced without interrupting the data network connections since the FTW module can be extracted from the failed breakout system with data network connections intact. The FTW module is preferably a compact modular element that fits within the breakout chassis and is easily inserted and removed from the breakout system during servicing operations.
摘要:
Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC modules or banks of IC modules that are interconnected to a printed circuit card. A mechanically compliant, thermally conductive adhesive is used to join the heatsinks to the modules. An oxide formed on the release layer readily bonds with the thermally conductive adhesive. In the event that heatsinks need to be removed to repair or rework the modules, local heat may be applied to melt the release layer to remove a heatsink without need for use of significant applied torque and normal forces. Because the release layer has a low melting point that affords easy separation from the adhesive layer, both component delaminations and the partial reflow or melting of solder joints on adjacent components are eliminated from the heatsink removal process.
摘要:
A fail-to-wire (FTW) module that preserves a primary data path connection from an upstream computer to a downstream computer if there is any kind of failure in a breakout data path to a breakout system. The FTW module provides switches between the incoming data network data and the breakout system such that when the breakout system encounters a failure, the switches are de-activated to bypass the breakout system. The switches in the FTW module are activated by a system health signal from the breakout system. The breakout system can be serviced without interrupting the data network connections since the FTW module can be extracted from the failed breakout system with data network connections intact. The FTW module is preferably a compact modular element that fits within the breakout chassis and is easily inserted and removed from the breakout system during servicing operations.