摘要:
A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.
摘要:
A device for testing electronic components such as integrated circuit ICs, under particular pressure conditions, has a pressure test chamber with contact elements which on the one hand are connected to an electronic testing device and on the other hand extend into a cavity of the pressure test chamber. Arranged inside the cavity of the pressure test chamber, there is and air-fight sealing board which extends transversely over the contact elements and is sealed peripherally from an assigned pressure chamber half. By means of the sealing board, first contact element sections are separated air-tightly from second contact element sections but are in electrically conductive connection.
摘要:
A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.
摘要:
In a device for testing electronic components, in particular ICs, under particular pressure conditions, the pressure test chamber comprises contact elements (13) which on the one hand are connected to an electronic testing device and on the other hand extend into a cavity of the pressure test chamber. Arranged inside the cavity of the pressure test chamber, there is an air-tight sealing board (26) which extends transversely over the contact elements (13) and is sealed peripherally from an assigned pressure chamber half (2). By means of the sealing board (26), first contact element sections (19) are separated air-tightly from second contact element sections (20) but are in electrically conductive connection.
摘要:
A closure mechanism for pressure test chambers for testing electronic components, in particular ICs, has a plurality of pivoting jaws. At least some of the pivoting jaws have at least one lifting apparatus which can be advanced to two interacting cavity elements, which surround a cavity, by means of the pivoting jaws. Furthermore, at least some of the pivoting jaws have at least one locking device in order to move spacer elements into an intermediate space between the associated pivoting jaws and the compressed cavity element, as a result of which the tightness of the cavity is maintained even when the lifting apparatuses are retracted.
摘要:
A closure mechanism for pressure test chambers for testing electronic components, in particular ICs, has a plurality of pivoting jaws. At least some of the pivoting jaws have at least one lifting apparatus which can be advanced to two interacting cavity elements, which surround a cavity, by means of the pivoting jaws. Furthermore, at least some of the pivoting jaws have at least one locking device in order to move spacer elements into an intermediate space between the associated pivoting jaws and the compressed cavity element, as a result of which the tightness of the cavity is maintained even when the lifting apparatuses are retracted.
摘要:
Disclosed are a method and a device for tempering electronic components (5) within a handler (1) for a functional test. The components (5) are initially pre-tempered in a temperature chamber (2) by convecting a gas and are then directly tempered in a conductive manner to the test temperature in a test chamber (3). The gas pressure (P1) inside the test chamber (3) is greater than the gas pressure (P2) in the temperature chamber while the gas pressure (P2) in the temperature chamber (2) is greater than the ambient pressure (Pa). The inlet (4) and outlet (29) of the temperature chamber (2) are alternately opened and closed.
摘要:
In the case of a test apparatus for testing electronic components which are present in an assembly, in particular in the form of strips, a slide-like contacting board supporting device, to which the contacting board can be fastened, is mounted on the test head. The contacting board supporting device can be moved parallel to the plane of the contacting board when the contacting nest is docked on the test head, with the result that the contacting board can be brought into different test positions which are laterally beside one another.
摘要:
In the case of a test apparatus for testing electronic components which are present in an assembly, in particular in the form of strips, a slide-like contacting board supporting device (28), to which the contacting board (22) can be fastened, is mounted on the test head (15), wherein the contacting board supporting device (28) can be moved parallel to the plane of the contacting board when the contacting nest (24) is docked on the test head (15), with the result that the contacting board (22) can be brought into different test positions which are laterally beside one another.