System for post-processing of electronic components
    1.
    发明授权
    System for post-processing of electronic components 有权
    电子元器件后处理系统

    公开(公告)号:US08717048B2

    公开(公告)日:2014-05-06

    申请号:US12859059

    申请日:2010-08-18

    IPC分类号: G01R31/00

    摘要: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

    摘要翻译: 一种在制造电子部件之后后处理后处理机器中的多个电子部件的方法,包括提供具有对准固定装置的对准固定装置,其对齐固定装置具有夹紧机构,致动夹紧机构以扩大插座的尺寸, 每个插座被分配到对准夹具中的一个,并且扩大的插座大于待接收的电子部件,将电子部件定位在对准夹具的插座中,致动夹紧机构以减小插座的尺寸 电子部件在载体的插座内对准,将载体放置在后处理机中,并且当电子部件保持在载体的插座中的对准位置时,对电子部件进行后处理机的操作。

    Device for testing electronic components, in particular ICs, having a sealing board arranged inside a pressure test chamber
    2.
    发明授权
    Device for testing electronic components, in particular ICs, having a sealing board arranged inside a pressure test chamber 有权
    用于测试电子部件,特别是IC的装置,其具有布置在压力测试室内的密封板

    公开(公告)号:US07633304B2

    公开(公告)日:2009-12-15

    申请号:US12169899

    申请日:2008-07-09

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2881 G01R31/2862

    摘要: A device for testing electronic components such as integrated circuit ICs, under particular pressure conditions, has a pressure test chamber with contact elements which on the one hand are connected to an electronic testing device and on the other hand extend into a cavity of the pressure test chamber. Arranged inside the cavity of the pressure test chamber, there is and air-fight sealing board which extends transversely over the contact elements and is sealed peripherally from an assigned pressure chamber half. By means of the sealing board, first contact element sections are separated air-tightly from second contact element sections but are in electrically conductive connection.

    摘要翻译: 用于在特定压力条件下测试诸如集成电路IC的电子部件的装置具有压力测试室,其具有接触元件,其一方面连接到电子测试装置,另一方面延伸到压力测试的空腔中 房间。 在压力测试室的腔内设置有横向延伸接触元件的空气密封板,并且与指定的压力室一半在周围密封。 通过密封板,第一接触元件部分与第二接触元件部分气密分离,但是是导电连接的。

    SYSTEM FOR POST-PROCESSING OF ELECTRONIC COMPONENTS
    3.
    发明申请
    SYSTEM FOR POST-PROCESSING OF ELECTRONIC COMPONENTS 有权
    电子元件后处理系统

    公开(公告)号:US20110043231A1

    公开(公告)日:2011-02-24

    申请号:US12859059

    申请日:2010-08-18

    IPC分类号: G01R31/10 B23Q7/00 B23Q1/64

    摘要: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

    摘要翻译: 一种在制造电子部件之后后处理后处理机器中的多个电子部件的方法,包括提供具有对准固定装置的对准固定装置,其对齐固定装置具有夹紧机构,致动夹紧机构以扩大插座的尺寸, 每个插座被分配到对准夹具中的一个,并且扩大的插座大于待接收的电子部件,将电子部件定位在对准夹具的插座中,致动夹紧机构以减小插座的尺寸 电子部件在载体的插座内对准,将载体放置在后处理机中,并且当电子部件保持在载体的插座中的对准位置时,对电子部件进行后处理机的操作。

    DEVICE FOR TESTING ELECTRONIC COMPONENTS, IN PARTICULAR ICS, HAVING A SEALING BOARD ARRANGED INSIDE A PRESSURE TEST CHAMBER
    4.
    发明申请
    DEVICE FOR TESTING ELECTRONIC COMPONENTS, IN PARTICULAR ICS, HAVING A SEALING BOARD ARRANGED INSIDE A PRESSURE TEST CHAMBER 有权
    用于测试电子元件的设备,特别是ICS,具有安装在压力测试室内的密封板

    公开(公告)号:US20090015277A1

    公开(公告)日:2009-01-15

    申请号:US12169899

    申请日:2008-07-09

    IPC分类号: G01R31/3181 G01N17/00

    CPC分类号: G01R31/2881 G01R31/2862

    摘要: In a device for testing electronic components, in particular ICs, under particular pressure conditions, the pressure test chamber comprises contact elements (13) which on the one hand are connected to an electronic testing device and on the other hand extend into a cavity of the pressure test chamber. Arranged inside the cavity of the pressure test chamber, there is an air-tight sealing board (26) which extends transversely over the contact elements (13) and is sealed peripherally from an assigned pressure chamber half (2). By means of the sealing board (26), first contact element sections (19) are separated air-tightly from second contact element sections (20) but are in electrically conductive connection.

    摘要翻译: 在用于在特定压力条件下测试电子部件,特别是IC的装置中,压力测试室包括接触元件(13),其一方面连接到电子测试装置,另一方面延伸到 压力试验室。 在压力测试室的空腔内部布置有一个气密的密封板(26),该密封板横向于接触元件(13)延伸并且与指定的压力室一半(2)周围密封。 通过密封板(26),第一接触元件部分(19)与第二接触元件部分(20)气密地分离,但是是导电连接的。

    CLOSURE MECHANISM FOR PRESSURE TEST CHAMBERS FOR TESTING ELECTRONIC COMPONENTS, IN PARTICULAR IC'S
    5.
    发明申请
    CLOSURE MECHANISM FOR PRESSURE TEST CHAMBERS FOR TESTING ELECTRONIC COMPONENTS, IN PARTICULAR IC'S 失效
    用于测试电子元件的压力测试座的闭合机构,特别是IC

    公开(公告)号:US20100193520A1

    公开(公告)日:2010-08-05

    申请号:US12668265

    申请日:2008-07-01

    IPC分类号: B65D55/00

    摘要: A closure mechanism for pressure test chambers for testing electronic components, in particular ICs, has a plurality of pivoting jaws. At least some of the pivoting jaws have at least one lifting apparatus which can be advanced to two interacting cavity elements, which surround a cavity, by means of the pivoting jaws. Furthermore, at least some of the pivoting jaws have at least one locking device in order to move spacer elements into an intermediate space between the associated pivoting jaws and the compressed cavity element, as a result of which the tightness of the cavity is maintained even when the lifting apparatuses are retracted.

    摘要翻译: 用于测试电子部件,特别是IC的压力测试室的闭合机构具有多个枢转夹爪。 至少一些枢转夹具具有至少一个提升装置,其可通过枢转夹爪前进到围绕空腔的两个相互作用的空腔元件。 此外,至少一些枢转夹具具有至少一个锁定装置,以便将间隔元件移动到相关联的枢转爪和压缩空腔元件之间的中间空间中,结果即使当腔 提升装置缩回。

    Closure mechanism for pressure test chambers for testing electronic components, in particular ICs
    6.
    发明授权
    Closure mechanism for pressure test chambers for testing electronic components, in particular ICs 失效
    用于测试电子部件,特别是IC的压力测试室的封闭机构

    公开(公告)号:US08449002B2

    公开(公告)日:2013-05-28

    申请号:US12668265

    申请日:2008-07-01

    IPC分类号: B65D48/00 B65D45/30 E05B65/00

    摘要: A closure mechanism for pressure test chambers for testing electronic components, in particular ICs, has a plurality of pivoting jaws. At least some of the pivoting jaws have at least one lifting apparatus which can be advanced to two interacting cavity elements, which surround a cavity, by means of the pivoting jaws. Furthermore, at least some of the pivoting jaws have at least one locking device in order to move spacer elements into an intermediate space between the associated pivoting jaws and the compressed cavity element, as a result of which the tightness of the cavity is maintained even when the lifting apparatuses are retracted.

    摘要翻译: 用于测试电子部件,特别是IC的压力测试室的闭合机构具有多个枢转夹爪。 至少一些枢转夹具具有至少一个提升装置,其可通过枢转夹爪前进到围绕空腔的两个相互作用的空腔元件。 此外,至少一些枢转夹具具有至少一个锁定装置,以便将间隔元件移动到相关联的枢转爪和压缩空腔元件之间的中间空间中,结果即使当腔 提升装置缩回。

    Method and device for tempering electronic components
    7.
    发明申请
    Method and device for tempering electronic components 审中-公开
    回火电子元件的方法和装置

    公开(公告)号:US20100108205A1

    公开(公告)日:2010-05-06

    申请号:US11988927

    申请日:2007-03-29

    IPC分类号: C21D9/00 C21D1/74

    摘要: Disclosed are a method and a device for tempering electronic components (5) within a handler (1) for a functional test. The components (5) are initially pre-tempered in a temperature chamber (2) by convecting a gas and are then directly tempered in a conductive manner to the test temperature in a test chamber (3). The gas pressure (P1) inside the test chamber (3) is greater than the gas pressure (P2) in the temperature chamber while the gas pressure (P2) in the temperature chamber (2) is greater than the ambient pressure (Pa). The inlet (4) and outlet (29) of the temperature chamber (2) are alternately opened and closed.

    摘要翻译: 公开了用于对用于功能测试的处理器(1)内的电子部件(5)进行回火的方法和装置。 组件(5)最初通过对流气体在温室(2)中预调温,然后以导电方式直接回火到测试室(3)中的测试温度。 测试室(3)内部的气体压力(P1)大于温度室中的气体压力(P2),而温度室(2)中的气体压力(P2)大于环境压力(Pa)。 温度室(2)的入口(4)和出口(29)交替地打开和关闭。

    Test apparatus for the testing of electronic components
    8.
    发明授权
    Test apparatus for the testing of electronic components 有权
    用于电子元件测试的测试仪器

    公开(公告)号:US07741861B2

    公开(公告)日:2010-06-22

    申请号:US12090419

    申请日:2007-03-29

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2887 G01R31/2863

    摘要: In the case of a test apparatus for testing electronic components which are present in an assembly, in particular in the form of strips, a slide-like contacting board supporting device, to which the contacting board can be fastened, is mounted on the test head. The contacting board supporting device can be moved parallel to the plane of the contacting board when the contacting nest is docked on the test head, with the result that the contacting board can be brought into different test positions which are laterally beside one another.

    摘要翻译: 在用于测试存在于组件中,特别是带状形式的电子部件的测试装置的情况下,可将紧固接触板的滑动式接触板支撑装置安装在测试头上 。 当接触座对接在测试头上时,接触板支撑装置可以平行于接触板的平面移动,结果使得接触板可以进入彼此横向相邻的不同的测试位置。

    Test Apparatus for the Testing of Electronic Components
    9.
    发明申请
    Test Apparatus for the Testing of Electronic Components 有权
    电子元件测试测试仪器

    公开(公告)号:US20080231296A1

    公开(公告)日:2008-09-25

    申请号:US12090419

    申请日:2007-03-29

    IPC分类号: G01R31/28

    CPC分类号: G01R31/2887 G01R31/2863

    摘要: In the case of a test apparatus for testing electronic components which are present in an assembly, in particular in the form of strips, a slide-like contacting board supporting device (28), to which the contacting board (22) can be fastened, is mounted on the test head (15), wherein the contacting board supporting device (28) can be moved parallel to the plane of the contacting board when the contacting nest (24) is docked on the test head (15), with the result that the contacting board (22) can be brought into different test positions which are laterally beside one another.

    摘要翻译: 在用于测试组件(特别是带状)中的电子部件的测试装置的情况下,能够紧固接触板(22)的滑动接触板支撑装置(28) 安装在测试头(15)上,其中当接触嵌套(24)对接在测试头(15)上时,接触板支撑装置(28)可以平行于接触板的平面移动,结果 可以使接触板(22)进入彼此横向相邻的不同的测试位置。