Integrated hydrodynamic bearing/motor assembly
    1.
    发明授权
    Integrated hydrodynamic bearing/motor assembly 失效
    集成流体动力轴承/马达组件

    公开(公告)号:US5448120A

    公开(公告)日:1995-09-05

    申请号:US209691

    申请日:1994-03-10

    CPC分类号: H02K5/1672 G11B19/2009

    摘要: A spindle and hub assembly in a disk drive having an integrated motor including a housing having a cylindrical sleeve and two end flanges, the cylindrical sleeve and the upper end flange being one piece and forming the hub and the lower end flange being pressed into the hub and a shaft being rotatably supported in the end flanges by means of hydrodynamic bearings, where the hydrodynamic bearings have conical bearing surfaces converging towards the interior of the housing, whereby a high precision and low cost spindle and hub assembly is provided.

    摘要翻译: 在具有集成电动机的磁盘驱动器中的主轴和轮毂组件包括具有圆柱形套筒和两个端部凸缘的壳体,所述圆柱形套筒和上端凸缘是一体的并且形成所述毂,并且所述下端凸缘被压入所述毂 并且轴通过流体动力轴承可旋转地支撑在端部凸缘中,其中流体动力轴承具有朝向壳体内部会聚的锥形轴承表面,从而提供高精度和低成本的主轴和轮毂组件。

    Device and method for aligning and holding a plurality of singulated semiconductor components in receiving pockets of a terminal carrier
    2.
    发明授权
    Device and method for aligning and holding a plurality of singulated semiconductor components in receiving pockets of a terminal carrier 有权
    用于对准和保持端子载体的接收袋中的多个单个半导体部件的装置和方法

    公开(公告)号:US08678365B2

    公开(公告)日:2014-03-25

    申请号:US12887429

    申请日:2010-09-21

    IPC分类号: B23Q3/00

    摘要: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

    摘要翻译: 在将彼此分离的端子载体的接收槽中的多个单个半导体部件对准和保持的装置和方法中,端子载体具有作为弹簧板的一部分的弹簧元件。 弹簧板具有彼此相邻设置的多个凹部,用于形成用于半导体部件的对应的多个接收凹部,其中弹簧元件由弹簧板一体地形成。

    SYSTEM FOR POST-PROCESSING OF ELECTRONIC COMPONENTS
    3.
    发明申请
    SYSTEM FOR POST-PROCESSING OF ELECTRONIC COMPONENTS 有权
    电子元件后处理系统

    公开(公告)号:US20110043231A1

    公开(公告)日:2011-02-24

    申请号:US12859059

    申请日:2010-08-18

    IPC分类号: G01R31/10 B23Q7/00 B23Q1/64

    摘要: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

    摘要翻译: 一种在制造电子部件之后后处理后处理机器中的多个电子部件的方法,包括提供具有对准固定装置的对准固定装置,其对齐固定装置具有夹紧机构,致动夹紧机构以扩大插座的尺寸, 每个插座被分配到对准夹具中的一个,并且扩大的插座大于待接收的电子部件,将电子部件定位在对准夹具的插座中,致动夹紧机构以减小插座的尺寸 电子部件在载体的插座内对准,将载体放置在后处理机中,并且当电子部件保持在载体的插座中的对准位置时,对电子部件进行后处理机的操作。

    DEVICE AND METHOD FOR ALIGNING AND HOLDING A PLURALITY OF SINGULATED SEMICONDUCTOR COMPONENTS IN RECEIVING POCKETS OF A TERMINAL CARRIER
    4.
    发明申请
    DEVICE AND METHOD FOR ALIGNING AND HOLDING A PLURALITY OF SINGULATED SEMICONDUCTOR COMPONENTS IN RECEIVING POCKETS OF A TERMINAL CARRIER 审中-公开
    用于校准和保持接收端子载体中的多个半导体半导体元件的装置和方法

    公开(公告)号:US20100206768A1

    公开(公告)日:2010-08-19

    申请号:US12665531

    申请日:2009-02-12

    IPC分类号: B65D85/00 H01L21/64 G01R31/26

    摘要: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier (5) that are separated from each other, the terminal carrier (5) has spring elements (12a, 12b), which are part of a spring plate (2). The spring plate (2) has a plurality of recesses (11) disposed next to each other for forming a corresponding plurality of receiving pockets (6) for the semi-conductor components, wherein the spring elements (12a, 12b) are formed from the spring plate (2) in one piece.

    摘要翻译: 在将彼此分离的端子载体(5)的接收凹穴中的多个单个半导体部件对准和保持的装置和方法中,端子载体(5)具有弹簧元件(12a,12b), 它们是弹簧板(2)的一部分。 弹簧板(2)具有彼此相邻设置的多个凹部(11),用于形成用于半导体部件的对应的多个接收凹部(6),其中弹簧元件(12a,12b)由 弹簧板(2)一体。

    System for post-processing of electronic components
    5.
    发明授权
    System for post-processing of electronic components 有权
    电子元器件后处理系统

    公开(公告)号:US08717048B2

    公开(公告)日:2014-05-06

    申请号:US12859059

    申请日:2010-08-18

    IPC分类号: G01R31/00

    摘要: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

    摘要翻译: 一种在制造电子部件之后后处理后处理机器中的多个电子部件的方法,包括提供具有对准固定装置的对准固定装置,其对齐固定装置具有夹紧机构,致动夹紧机构以扩大插座的尺寸, 每个插座被分配到对准夹具中的一个,并且扩大的插座大于待接收的电子部件,将电子部件定位在对准夹具的插座中,致动夹紧机构以减小插座的尺寸 电子部件在载体的插座内对准,将载体放置在后处理机中,并且当电子部件保持在载体的插座中的对准位置时,对电子部件进行后处理机的操作。

    Device for testing electronic components, in particular ICs, having a sealing board arranged inside a pressure test chamber
    7.
    发明授权
    Device for testing electronic components, in particular ICs, having a sealing board arranged inside a pressure test chamber 有权
    用于测试电子部件,特别是IC的装置,其具有布置在压力测试室内的密封板

    公开(公告)号:US07633304B2

    公开(公告)日:2009-12-15

    申请号:US12169899

    申请日:2008-07-09

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2881 G01R31/2862

    摘要: A device for testing electronic components such as integrated circuit ICs, under particular pressure conditions, has a pressure test chamber with contact elements which on the one hand are connected to an electronic testing device and on the other hand extend into a cavity of the pressure test chamber. Arranged inside the cavity of the pressure test chamber, there is and air-fight sealing board which extends transversely over the contact elements and is sealed peripherally from an assigned pressure chamber half. By means of the sealing board, first contact element sections are separated air-tightly from second contact element sections but are in electrically conductive connection.

    摘要翻译: 用于在特定压力条件下测试诸如集成电路IC的电子部件的装置具有压力测试室,其具有接触元件,其一方面连接到电子测试装置,另一方面延伸到压力测试的空腔中 房间。 在压力测试室的腔内设置有横向延伸接触元件的空气密封板,并且与指定的压力室一半在周围密封。 通过密封板,第一接触元件部分与第二接触元件部分气密分离,但是是导电连接的。