摘要:
A spindle and hub assembly in a disk drive having an integrated motor including a housing having a cylindrical sleeve and two end flanges, the cylindrical sleeve and the upper end flange being one piece and forming the hub and the lower end flange being pressed into the hub and a shaft being rotatably supported in the end flanges by means of hydrodynamic bearings, where the hydrodynamic bearings have conical bearing surfaces converging towards the interior of the housing, whereby a high precision and low cost spindle and hub assembly is provided.
摘要:
In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.
摘要:
A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.
摘要:
In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier (5) that are separated from each other, the terminal carrier (5) has spring elements (12a, 12b), which are part of a spring plate (2). The spring plate (2) has a plurality of recesses (11) disposed next to each other for forming a corresponding plurality of receiving pockets (6) for the semi-conductor components, wherein the spring elements (12a, 12b) are formed from the spring plate (2) in one piece.
摘要:
A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.
摘要:
In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.
摘要:
A device for testing electronic components such as integrated circuit ICs, under particular pressure conditions, has a pressure test chamber with contact elements which on the one hand are connected to an electronic testing device and on the other hand extend into a cavity of the pressure test chamber. Arranged inside the cavity of the pressure test chamber, there is and air-fight sealing board which extends transversely over the contact elements and is sealed peripherally from an assigned pressure chamber half. By means of the sealing board, first contact element sections are separated air-tightly from second contact element sections but are in electrically conductive connection.
摘要:
A method for testing and calibrating electronic semiconductor components which convert sound into electrical signals acoustically irradiates the components in a sound chamber whose largest free length is less than half the wavelength of the highest frequency of the sound waves produced during the test.
摘要:
A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component.
摘要:
A plunger for holding and moving electrical components in particular IC's to and from a contacting device connected to a test bed, comprises a head piece with a fluid distribution chamber through which temperature-controlled fluid flows. A suction head is arranged such that the temperature-controlled fluid flows around the suction head and is diverted along the suction head to the component.