Electronic device, charger within the electronic device, and detecting method for detecting abnormal status of connector of electronic device

    公开(公告)号:US10658860B2

    公开(公告)日:2020-05-19

    申请号:US16214150

    申请日:2018-12-10

    Applicant: MEDIATEK INC.

    Abstract: An electronic device includes: a connector, arranged for coupling to a power supply external to the electronic device, wherein the power supply is arranged to provide a supply voltage to the electronic device to charge a battery of the electronic device; and a charger, coupled to the connector and selectively operated in a normal mode or a self-test mode, wherein when the charger operates in the normal mode, the charger is arranged for receiving the supply voltage via a power pin of the connector to charge the battery of the electronic device; and when the charger operates in the self-test mode, the charger provides a specific voltage to the power pin of the connector. The charger includes a detector to detect the current or voltage of at least one pin of the connector to generate a detecting result, and the supply voltage is set based on the detecting result.

    SYSTEM AND METHOD FOR UTILIZING TRANSFORMER DEEP LEARNING BASED OUTLIER IC DETECTION

    公开(公告)号:US20250148273A1

    公开(公告)日:2025-05-08

    申请号:US18926397

    申请日:2024-10-25

    Applicant: MEDIATEK INC.

    Abstract: In an aspect of the disclosure, a method for detecting outlier integrated circuits on a wafer is provided. The method comprises: operating multiple test items for each IC on the wafer to generate measured values of the multiple test items for each IC; selecting a target IC and neighboring ICs on the wafer repeatedly. each time after selecting the target IC executes the following steps: selecting a measured value of the target IC as a target measured value and selecting measured values of the target IC and the neighboring ICs as feature values of the target IC and the neighboring ICs; executing a transformer deep learning model to generate a predicted value of the target measured value; and identifying outlier ICs according to the predicted values of all the target ICs and the corresponding target measured values of all the target ICs.

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