公开(公告)号：US20140135882A1

公开(公告)日：2014-05-15

申请号：US13676839

申请日：2012-11-14

Applicant: MEDTRONIC, INC.

Inventor： Jeevan M. Prasannakumar ,  Christopher M. Haenisch ,  David Bates ,  John C. Olson ,  George Patras ,  Yanzhu Zhao ,  Jason P. Weiand

IPC: A61N1/05

CPC classification number: A61N1/05 ,  A61N1/3752 ,  Y10T29/49016 ,  Y10T29/49117

Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.

Abstract translation: 描述了通过双注射成型工艺形成可植入医疗装置的头部的技术。 双射模制过程可以包括第一模制步骤，其创建第一模制组件和第二模制步骤，其创建二次组装。 第一射出组件可以形成为包括被配置为在第二模制步骤中与二次注射模具和/或模制材料相互作用的一个或多个突起。 第二模制步骤可以被配置为包覆模制第一射出组件。 集管可以包括至少部分地嵌入模制材料中并被配置为机械地联接到可植入医疗装置的主体的附接板。

公开(公告)号：US20140133123A1

公开(公告)日：2014-05-15

申请号：US13676742

申请日：2012-11-14

Applicant: MEDTRONIC, INC.

Inventor： Jeevan M. Prasannakumar ,  Christopher M. Haenisch ,  David Bates ,  John C. Olson ,  George Patras ,  Yanzhu Zhao ,  Jason P. Weiand

IPC: H05K13/00 ,  H05K7/02

CPC classification number: H05K13/0015 ,  A61N1/37205 ,  A61N1/37229 ,  A61N1/3752 ,  A61N1/3756 ,  B29C45/1671 ,  B29L2031/753 ,  H01Q1/273 ,  H01Q9/42 ,  H05K7/02

Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.

公开(公告)号：US09345185B2

公开(公告)日：2016-05-17

申请号：US13676742

申请日：2012-11-14

Applicant: Medtronic, Inc.

Inventor： Jeevan M. Prasannakumar ,  Christopher M. Haenisch ,  David Bates ,  John C. Olson ,  George Patras ,  Yanzhu Zhao ,  Jason P. Weiand

IPC: H05K13/00 ,  H05K7/02 ,  A61N1/375 ,  B29C45/16 ,  A61N1/372 ,  B29L31/00 ,  H01Q1/27 ,  H01Q9/42

CPC classification number: H05K13/0015 ,  A61N1/37205 ,  A61N1/37229 ,  A61N1/3752 ,  A61N1/3756 ,  B29C45/1671 ,  B29L2031/753 ,  H01Q1/273 ,  H01Q9/42 ,  H05K7/02

Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.

公开(公告)号：US08989872B2

公开(公告)日：2015-03-24

申请号：US13676839

申请日：2012-11-14

Applicant: Medtronic, Inc.

Inventor： Jeevan M. Prasannakumar ,  Christopher M. Haenisch ,  David Bates ,  John C. Olson ,  George Patras ,  Yanzhu Zhao ,  Jason P. Weiand

IPC: A61N1/05 ,  A61N1/375

CPC classification number: A61N1/05 ,  A61N1/3752 ,  Y10T29/49016 ,  Y10T29/49117

Abstract: Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.

Abstract translation: 描述了通过双注射成型工艺形成可植入医疗装置的头部的技术。 双射模制过程可以包括第一模制步骤，其创建第一模制组件和第二模制步骤，其创建二次组装。 第一射出组件可以形成为包括被配置为在第二模制步骤中与二次注射模具和/或模制材料相互作用的一个或多个突起。 第二模制步骤可以被配置为包覆模制第一射出组件。 集管可以包括至少部分地嵌入模制材料中并被配置为机械地联接到可植入医疗装置的主体的附接板。