公开(公告)号：US11633611B2

公开(公告)日：2023-04-25

申请号：US17125250

申请日：2020-12-17

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

IPC: A61N1/375

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

公开(公告)号：US20210187307A1

公开(公告)日：2021-06-24

申请号：US17125250

申请日：2020-12-17

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

IPC: A61N1/375

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

公开(公告)号：US12220590B2

公开(公告)日：2025-02-11

申请号：US18124706

申请日：2023-03-22

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

IPC: A61N1/375

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

公开(公告)号：US20230218911A1

公开(公告)日：2023-07-13

申请号：US18124706

申请日：2023-03-22

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  A61N1/3756

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.