-
公开(公告)号：US20210121706A1
公开(公告)日：2021-04-29
申请号：US17077437
申请日：2020-10-22
Applicant: Medtronic, Inc.
Inventor： Steven Deininger , Michael Baade
Abstract: An implantable medical device (IMD) including an insulating frame defining a drop-in coil channel adjacent a perimeter of the insulating frame, a rechargeable power source configured to supply power for the implantable medical device, a secondary coil including a first and a second wire end, where the secondary coil is received within the drop-in coil channel and is configured to inductively couple with a primary coil of an external charging device to transcutaneously charge the rechargeable power source. The IMD also includes a circuit board attached to the insulating frame and a pair of electrical connectors each having a respective first arm that is electrically coupled to the respective first and second wire ends of the secondary coil and respective second arm that is electrically coupled to the circuit board.
-
公开(公告)号：US11638829B2
公开(公告)日：2023-05-02
申请号：US17077437
申请日：2020-10-22
Applicant: Medtronic, Inc.
Inventor： Steven Deininger , Michael Baade
Abstract: An implantable medical device (IMD) including an insulating frame defining a drop-in coil channel adjacent a perimeter of the insulating frame, a rechargeable power source configured to supply power for the implantable medical device, a secondary coil including a first and a second wire end, where the secondary coil is received within the drop-in coil channel and is configured to inductively couple with a primary coil of an external charging device to transcutaneously charge the rechargeable power source. The IMD also includes a circuit board attached to the insulating frame and a pair of electrical connectors each having a respective first arm that is electrically coupled to the respective first and second wire ends of the secondary coil and respective second arm that is electrically coupled to the circuit board.
-
公开(公告)号：USD952852S1
公开(公告)日：2022-05-24
申请号：US29652586
申请日：2020-09-25
Applicant: Medtronic, Inc.
Designer： Steven Deininger , Michael Baade
-
4.发明授权公开(公告)号：US11058882B2
公开(公告)日：2021-07-13
申请号：US16273133
申请日：2019-02-11
Applicant: MEDTRONIC, INC.
Inventor： Steven Deininger , Jeffrey Clayton , Michael Baade , Anthony Chasensky
Abstract: Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.
-
5.发明授权公开(公告)号：US11938329B2
公开(公告)日：2024-03-26
申请号：US17372522
申请日：2021-07-12
Applicant: MEDTRONIC, INC.
Inventor： Steven Deininger , Jeffrey Clayton , Michael Baade , Anthony Chasensky
CPC classification number: A61N1/3754 , A61N1/36062 , A61N1/37514 , A61N1/0551 , A61N1/36107 , A61N1/3756
Abstract: Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.
-
Patent Agency Ranking
公开(公告)号：USD952853S1
公开(公告)日：2022-05-24
申请号：US29652587
申请日：2020-09-25
Applicant: Medtronic, Inc.
Designer： Jeffrey Clayton , Steven Deininger , Michael Baade
-
7.发明申请公开(公告)号：US20200254263A1
公开(公告)日：2020-08-13
申请号：US16273133
申请日：2019-02-11
Applicant: MEDTRONIC, INC.
Inventor： Steven Deininger , Jeffrey Clayton , Michael Baade , Anthony Chasensky
Abstract: Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.
-
8.发明公开公开(公告)号：US20240261580A1
公开(公告)日：2024-08-08
申请号：US18614666
申请日：2024-03-23
Applicant: Medtronic Inc.
Inventor： Steven Deininger , Jeffrey Clayton , Michael Baade , Anthony Chasensky
CPC classification number: A61N1/3754 , A61N1/36062 , A61N1/37514 , A61N1/0551 , A61N1/36107 , A61N1/3756
Abstract: Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.
-
公开(公告)号：US20230293897A1
公开(公告)日：2023-09-21
申请号：US18193610
申请日：2023-03-30
Applicant: Medtronic, Inc.
Inventor： Steven Deininger , Michael Baade
CPC classification number: A61N1/3787 , A61N1/36125
Abstract: An implantable medical device (IMD) including an insulating frame defining a drop-in coil channel adjacent a perimeter of the insulating frame, a rechargeable power source configured to supply power for the implantable medical device, a secondary coil including a first and a second wire end, where the secondary coil is received within the drop-in coil channel and is configured to inductively couple with a primary coil of an external charging device to transcutaneously charge the rechargeable power source. The IMD also includes a circuit board attached to the insulating frame and a pair of electrical connectors each having a respective first arm that is electrically coupled to the respective first and second wire ends of the secondary coil and respective second arm that is electrically coupled to the circuit board.
-
10.发明申请公开(公告)号：US20210339029A1
公开(公告)日：2021-11-04
申请号：US17372522
申请日：2021-07-12
Applicant: MEDTRONIC, INC.
Inventor： Steven Deininger , Jeffrey Clayton , Michael Baade , Anthony Chasensky
Abstract: Implantable medical devices include circuitry positioned adjacent to header-related structures, rather than having the header and related structures sitting atop the position of the circuitry within a device housing. A circuit board within the device housing may be positioned adjacently to a lead bore of the header. Feedthrough conductors may extend from the circuitry to conductors of the header while being positioned adjacently to the circuit board. Lead frame conductors may extend to the electrical connectors of the lead bores while also being adjacent to the upper portion of the circuitry. Device height may be reduced by having the circuitry be positioned adjacent to one or more of the various header-related structures.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.013 seconds)
