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    LOW-COST ELECTRONIC MEDICAL DEVICE AND RELATED MANUFACTURING PROCESS
    2.
    发明申请
    LOW-COST ELECTRONIC MEDICAL DEVICE AND RELATED MANUFACTURING PROCESS 有权

    公开(公告)号：US20210385955A1

    公开(公告)日：2021-12-09

    申请号：US17410597

    申请日：2021-08-24

    Applicant: Medtronic MiniMed, Inc.

    Inventor： Claire F. Ferraro ,  Shelley L. Thurk

    IPC: H05K5/00 ,  H05K5/06 ,  A61B5/145 ,  B29C45/14

    Abstract: An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.

    A METHOD OF FABRICATING AN ELECTRONIC MEDICAL DEVICE DEVICE INCLUDING OVERMOLDING THE ASSEMBLY WITH THERMOPLASTIC MATERIAL
    4.
    发明申请
    A METHOD OF FABRICATING AN ELECTRONIC MEDICAL DEVICE DEVICE INCLUDING OVERMOLDING THE ASSEMBLY WITH THERMOPLASTIC MATERIAL 审中-公开

    公开(公告)号：US20200053889A1

    公开(公告)日：2020-02-13

    申请号：US16057656

    申请日：2018-08-07

    Applicant: MEDTRONIC MINIMED, INC.

    Inventor： Claire F. Ferraro ,  Shelley L. Thurk

    IPC: H05K5/00 ,  H05K5/06 ,  A61B5/145 ,  B29C45/14

    Abstract: An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.

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