公开(公告)号：US20240407096A1

公开(公告)日：2024-12-05

申请号：US18203679

申请日：2023-05-31

Applicant: Mellanox Technologies, Ltd.

Inventor： Ihab KHOURY ,  Tzuf LEVY ,  Ilya MARGOLIN ,  Sharon RECHNITZ ,  Dmitry FLITER ,  David FISCHER ,  Dor DADON

IPC: H05K1/11 ,  B23K1/00 ,  H05K1/14 ,  H05K3/36

Abstract: An electronic sub-assembly, which may include: a ceramic substrate having a top surface and a bottom surface, a plurality of layers of ceramic material disposed between the top surface and the bottom surface of the substrate, and a plurality of conductive structures passing through the substrate between the top surface and the bottom surface of the substrate; and a ball grid array disposed on the bottom surface of the substrate, the ball grid array comprising a plurality of solder balls, wherein at least a portion of the solder balls are connected to at least a portion of the conductive structures.