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公开(公告)号:US20240407096A1
公开(公告)日:2024-12-05
申请号:US18203679
申请日:2023-05-31
Applicant: Mellanox Technologies, Ltd.
Inventor: Ihab KHOURY , Tzuf LEVY , Ilya MARGOLIN , Sharon RECHNITZ , Dmitry FLITER , David FISCHER , Dor DADON
Abstract: An electronic sub-assembly, which may include: a ceramic substrate having a top surface and a bottom surface, a plurality of layers of ceramic material disposed between the top surface and the bottom surface of the substrate, and a plurality of conductive structures passing through the substrate between the top surface and the bottom surface of the substrate; and a ball grid array disposed on the bottom surface of the substrate, the ball grid array comprising a plurality of solder balls, wherein at least a portion of the solder balls are connected to at least a portion of the conductive structures.