公开(公告)号：US20220128779A1

公开(公告)日：2022-04-28

申请号：US17077089

申请日：2020-10-22

Applicant: Mellanox Technologies, Ltd.

Inventor： Ilya MARGOLIN ,  Rony SETTER ,  Andrey GER ,  Yaniv KAZAV ,  Tarek HATHOOT

IPC: G02B6/42 ,  H04B10/40

Abstract: Apparatuses, systems, and methods are described that provide improved networking communication systems and associated adapters. An example networking communication adapter includes an adapter housing defining a first end and a second end opposite the first end. The first end is configured to engage an Octal Small Form Factor Pluggable (OSFP) connector, and the second end is configured to receive a Quad Small Form Factor Pluggable Double Density (QSFP-DD) transceiver therein. The networking communication adapter further includes an inner connector positioned within the adapter housing. In an operational configuration in which the first end engages the OSFP connector and the second end receives the QSFP-DD transceiver, the inner connector operably connects the QSFP-DD transceiver with the OSFP connector such that signals may pass therebetween.

公开(公告)号：US20220236502A1

公开(公告)日：2022-07-28

申请号：US17717623

申请日：2022-04-11

Applicant: Mellanox Technologies, Ltd.

Inventor： Ilya MARGOLIN ,  Rony SETTER ,  Andrey GER ,  Yaniv KAZAV ,  Tarek HATHOOT

IPC: G02B6/42 ,  H04B10/40

Abstract: Apparatuses, systems, and methods are described that provide improved networking communication systems and associated adapters. An example networking communication adapter includes an adapter housing defining a first end and a second end opposite the first end. The first end is configured to engage an Octal Small Form Factor Pluggable (OSFP) connector, and the second end is configured to receive a Quad Small Form Factor Pluggable Double Density (QSFP-DD) transceiver therein. The networking communication adapter further includes an inner connector positioned within the adapter housing. In an operational configuration in which the first end engages the OSFP connector and the second end receives the QSFP-DD transceiver, the inner connector operably connects the QSFP-DD transceiver with the OSFP connector such that signals may pass therebetween.

公开(公告)号：US20240407096A1

公开(公告)日：2024-12-05

申请号：US18203679

申请日：2023-05-31

Applicant: Mellanox Technologies, Ltd.

Inventor： Ihab KHOURY ,  Tzuf LEVY ,  Ilya MARGOLIN ,  Sharon RECHNITZ ,  Dmitry FLITER ,  David FISCHER ,  Dor DADON

IPC: H05K1/11 ,  B23K1/00 ,  H05K1/14 ,  H05K3/36

Abstract: An electronic sub-assembly, which may include: a ceramic substrate having a top surface and a bottom surface, a plurality of layers of ceramic material disposed between the top surface and the bottom surface of the substrate, and a plurality of conductive structures passing through the substrate between the top surface and the bottom surface of the substrate; and a ball grid array disposed on the bottom surface of the substrate, the ball grid array comprising a plurality of solder balls, wherein at least a portion of the solder balls are connected to at least a portion of the conductive structures.