公开(公告)号：US12284783B2

公开(公告)日：2025-04-22

申请号：US17534645

申请日：2021-11-24

Applicant: Mellanox Technologies Ltd.

Inventor： Oren Weltsch ,  Rom Becker ,  Shay Zaretsky ,  Ayal Shabtay ,  Beeri Halachmi ,  Yuval Blayer ,  Kfir Katz ,  Yuval Dagan ,  Bar Noyman

IPC: H05K7/20 ,  G06F1/20

Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

公开(公告)号：US20230164948A1

公开(公告)日：2023-05-25

申请号：US17534645

申请日：2021-11-24

Applicant: Mellanox Technologies Ltd.

Inventor： Oren WELTSCH ,  Rom Becker ,  Shay Zaretsky ,  Ayal Shabtay ,  Beeri Halachmi ,  Yuval Blayer ,  Kfir Katz ,  Yuval Dagan ,  Bar NOYMAN

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20272 ,  H05K7/20263 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.