公开(公告)号：US20230309829A1

公开(公告)日：2023-10-05

申请号：US18174594

申请日：2023-02-24

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Tawfik Khbeis ,  Raza Qazi ,  Lichuan Chen ,  Jeremy Wurmlinger ,  Yue Yin

IPC: A61B5/00

CPC classification number: A61B5/002 ,  A61B5/6801

Abstract: An example electrode configured to receive biometric signals is described herein. The electrode is constructed of a rigid structure coupled to electrical signal-processing components, wherein the electrical signal-processing components are configured to at least partially process received biometric signals. The electrode has a conductive deformable material that is adhered to the rigid structure and houses the electrical signal-processing components. The conductive deformable material is configured to deform while it is in contact with skin of a user. The conductive deformable material is also configured to: define an outer surface of the electrode that receives a biometric signal from the user, and provide the biometric signal to the electrical signal-processing components that are housed within the conductive deformable material for at least partially processing the biometric signal.

公开(公告)号：US20240126217A1

公开(公告)日：2024-04-18

申请号：US18378810

申请日：2023-10-11

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Tawfik Khbeis ,  Shantonu Biswas ,  Lichuan Chen ,  Omar Awartani ,  Benjamin Cook ,  Amirhossein Hajiagha Memar

IPC: G04G17/08 ,  G04G17/02 ,  G06F1/16

CPC classification number: G04G17/08 ,  G04G17/02 ,  G06F1/163 ,  G06F1/1635 ,  G06F1/1652

Abstract: A flexible electronic system comprises a flexible substrate comprising an interlayer elastomer dielectric and a plurality of rigid components disposed within the flexible substrate. The flexible electronic system may further comprise a high-density interconnect region comprising one or more routing layers. In examples, the flexible electronic system may further comprise a flexible barrier material encapsulating the flexible electronic system. In some examples the flexible electronic system and the high-density interconnect region may further comprise a plurality of routing layers and one or more through-vias. Each through-via may couple at least one of two rigid components, two routing layers, or a rigid component and a routing layer. In examples, at least some of the routing layers may comprise conductive traces.

公开(公告)号：US20240114630A1

公开(公告)日：2024-04-04

申请号：US18479767

申请日：2023-10-02

Applicant: Meta Platforms Technologies, LLC

Inventor： Cameron Elliot Glasscock ,  Zhenzhen Shen ,  Felippe Jose Pavinatto ,  Omar Awartani ,  Allison Tuuri ,  Lichuan Chen ,  Aleksey Reiderman ,  Marcos Antonio Santana Andrade, JR.

IPC: H05K3/32 ,  H05K1/02 ,  H05K3/18

CPC classification number: H05K3/326 ,  H05K1/0272 ,  H05K1/028 ,  H05K1/0289 ,  H05K3/181 ,  H05K2201/0344

Abstract: The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.