公开(公告)号：US20240120246A1

公开(公告)日：2024-04-11

申请号：US18479780

申请日：2023-10-02

Applicant: Meta Platforms Technologies, LLC

Inventor： Omar Awartani ,  Zhen Zheng ,  Marcos Antonio Santana Andrade, JR. ,  Kristopher Erickson ,  Alejandra Alvarez Albarran ,  Allison Tuuri

IPC: H01L23/29 ,  H01B1/22 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/298 ,  H01B1/22 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/49872

Abstract: An electronic device includes a substrate and a circuit having a plurality of electrically-conductive components disposed on the substrate. The plurality of electrically-conductive components includes first, second and third electrically-conductive components. The third electrically-conductive component has a first end portion forming a first interface with the first electrically-conductive component and a second end portion forming a second interface with the second electrically conductive component. The first electrically-conductive component is made of a first material including a first metal. The second electrically-conductive component is made of a second material including the first metal. The third electrically-conductive component is made of a third material including a gallium-based alloy and a metallic filler. The metallic filler reduces a reactivity of the third electrically-conductive component with the first metal at the first and second interfaces, and thus minimizes deterioration of the first electrically-conductive component and the second electrically-conductive component over time.

公开(公告)号：US20240114630A1

公开(公告)日：2024-04-04

申请号：US18479767

申请日：2023-10-02

Applicant: Meta Platforms Technologies, LLC

Inventor： Cameron Elliot Glasscock ,  Zhenzhen Shen ,  Felippe Jose Pavinatto ,  Omar Awartani ,  Allison Tuuri ,  Lichuan Chen ,  Aleksey Reiderman ,  Marcos Antonio Santana Andrade, JR.

IPC: H05K3/32 ,  H05K1/02 ,  H05K3/18

CPC classification number: H05K3/326 ,  H05K1/0272 ,  H05K1/028 ,  H05K1/0289 ,  H05K3/181 ,  H05K2201/0344

Abstract: The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.