公开(公告)号：US20240114630A1

公开(公告)日：2024-04-04

申请号：US18479767

申请日：2023-10-02

Applicant: Meta Platforms Technologies, LLC

Inventor： Cameron Elliot Glasscock ,  Zhenzhen Shen ,  Felippe Jose Pavinatto ,  Omar Awartani ,  Allison Tuuri ,  Lichuan Chen ,  Aleksey Reiderman ,  Marcos Antonio Santana Andrade, JR.

IPC: H05K3/32 ,  H05K1/02 ,  H05K3/18

CPC classification number: H05K3/326 ,  H05K1/0272 ,  H05K1/028 ,  H05K1/0289 ,  H05K3/181 ,  H05K2201/0344

Abstract: The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.

公开(公告)号：US11792924B2

公开(公告)日：2023-10-17

申请号：US17319633

申请日：2021-05-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyeun Ha ,  Taeje Park

IPC: H05K1/02 ,  H01L23/00 ,  H01L21/02

CPC classification number: H05K1/0289 ,  H01L21/02288 ,  H01L24/26 ,  H05K1/028

Abstract: Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

公开(公告)号：US20180090037A1

公开(公告)日：2018-03-29

申请号：US15819543

申请日：2017-11-21

Applicant: CHENG-CHANG TRANSFLEX DISPLAY CORP.

Inventor： HUI-LAN TSO ,  WEN-CHANG FAN

IPC: G09F9/30 ,  H05K1/11 ,  H01B1/24 ,  H01L51/00 ,  H01L23/14 ,  H01L23/532 ,  H01L27/15 ,  H01L33/62 ,  H01L33/42

CPC classification number: G09F9/301 ,  F21K9/20 ,  H01B1/24 ,  H01L23/14 ,  H01L23/53276 ,  H01L23/5328 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/42 ,  H01L33/486 ,  H01L33/62 ,  H01L51/0021 ,  H01L2933/0066 ,  H05K1/0289 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4685 ,  H05K2201/0108 ,  H05K2201/10106

Abstract: This application provides a LED display by utilizing flexible wires and the locations of the conductive pins on the bottom side of each single color LEDs or full color LEDs to make each of the single color LEDs or full color LEDs mount on each pixel defined by the flexible wires formed on a transparent substrate, and this LED display is characterized in separating the wires crossing with each other by a so-called bridge technology and utilizing a single-layered substrate to save costs of processes and materials.

公开(公告)号：US09812412B2

公开(公告)日：2017-11-07

申请号：US14980404

申请日：2015-12-28

Applicant: ROHM CO., LTD.

Inventor： Takuma Shimoichi ,  Yasuhiro Kondo

IPC: H01L23/66 ,  H01L49/02 ,  H01L27/01

CPC classification number: H01L23/66 ,  H01L27/016 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L2223/6672 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/029 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/107 ,  H05K3/146 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0376 ,  H05K2201/0391 ,  H05K2201/09263 ,  H05K2201/09981 ,  H05K2201/10181 ,  H05K2203/0353 ,  H05K2203/1338 ,  H01L2924/00

Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

公开(公告)号：US09788420B2

公开(公告)日：2017-10-10

申请号：US14762875

申请日：2014-01-16

Applicant: TORAY INDUSTRIES, INC.

Inventor： Hitoshi Araki ,  Mitsuhito Suwa

IPC: H05K1/00 ,  H05K1/03 ,  G06F3/041

CPC classification number: H05K1/0353 ,  B32B7/12 ,  B32B9/045 ,  B32B27/281 ,  B32B27/283 ,  B32B27/286 ,  B32B27/308 ,  B32B27/325 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2255/26 ,  B32B2264/102 ,  B32B2307/306 ,  B32B2307/412 ,  B32B2307/418 ,  B32B2307/714 ,  B32B2307/732 ,  B32B2307/75 ,  B32B2457/208 ,  G06F3/041 ,  H05K1/0289 ,  H05K2201/0108 ,  H05K2201/0326

Abstract: The present invention aims to provide a substrate having an ITO with a low ITO pattern visibility, which substrate is formed by a method utilizing a simple technique such as coating, printing or the like, and which method is less burdensome from the viewpoints of cost and process; and to provide a touch panel member using the substrate. The present invention provides a substrate including a region where thin layers are laminated on a transparent ground substrate, which thin layers are, in the order mentioned from the upper surface of the substrate: an ITO (Indium Tin Oxide) thin layer (I); an organic thin layer (II) having a film thickness of from 0.01 to 0.4 μm and a refractive index of from 1.58 to 1.85; and a transparent adhesive thin layer (III) having a refractive index of from 1.46 to 1.52.

公开(公告)号：US09780826B2

公开(公告)日：2017-10-03

申请号：US15032041

申请日：2013-10-31

Applicant: Apple Inc.

Inventor： Romain A. Teil ,  Michael B. Wittenberg ,  Steven J. Martisauskas ,  Kuo-Hua Sung

IPC: H01B13/00 ,  H04B1/3888 ,  G06F1/16 ,  G06F1/18 ,  H05K1/05 ,  H05K1/16 ,  H05K1/09 ,  H05K1/18 ,  H05K3/10 ,  H05K3/32 ,  B44C1/22 ,  H05K1/02

CPC classification number: H04B1/3888 ,  G06F1/1633 ,  G06F1/1656 ,  G06F1/182 ,  G06F1/183 ,  H05K1/0289 ,  H05K1/056 ,  H05K1/09 ,  H05K1/162 ,  H05K1/18 ,  H05K3/103 ,  H05K3/32 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10151

Abstract: An electronic device may include a mechanical structure that mechanically supports the electronic device. One or more traces may be formed on one or more surfaces of the mechanical structure. Other electrical components may also be mounted on the surface of the mechanical structure and may or may not be connected to one or more of the traces. Additionally, one or more passivation layers may be formed on one or more of the surfaces, traces, and/or other electrical components and one or more traces and/or other electrical components may be intermixed with such passivation layers. In this way, the mechanical structure may be operable to function as an electrical component of the electronic device.

公开(公告)号：US09609735B2

公开(公告)日：2017-03-28

申请号：US13927276

申请日：2013-06-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Kyoung Jong Yoo ,  Jin Su Kim ,  Young Jae Lee ,  Jun Lee

IPC: H05K1/02 ,  G06F3/041 ,  H05K3/06

CPC classification number: H05K1/02 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0289 ,  H05K1/0296 ,  H05K3/06 ,  H05K2203/0113

Abstract: Provided is an electrode substrate, including: a substrate; a first pattern unit on the substrate; and a second pattern unit on the substrate.

公开(公告)号：US09589939B2

公开(公告)日：2017-03-07

申请号：US14407891

申请日：2013-05-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/52 ,  H01L31/18 ,  H01L25/075 ,  H05K1/02 ,  H01L23/538 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L23/5386 ,  H01L33/382 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K2201/0969 ,  H05K2201/10106 ,  H01L2924/00

Abstract: An optoelectronic semiconductor chip includes an interconnection layer with a first electrically conductive contact layer, a second electrically conductive contact layer and an insulation layer, which is formed of an electrically insulating material. Further, the optoelectronic semiconductor chip includes two optoelectronic semiconductor bodies, each of which include an active region that is intended to generate radiation. The insulation layer is arranged on a top of the second electrically conductive contact layer facing the optoelectronic semiconductor bodies. The first electrically conductive contact layer is arranged on a top of the insulation layer remote from the second electrically conductive contact layer. The optoelectronic semiconductor bodies are interconnected electrically in parallel by the interconnection layer.

Abstract translation: 光电半导体芯片包括由电绝缘材料形成的具有第一导电接触层，第二导电接触层和绝缘层的互连层。 此外，光电子半导体芯片包括两个光电子半导体本体，每个光电半导体主体包括旨在产生辐射的有源区。 绝缘层设置在面向光电半导体主体的第二导电接触层的顶部上。 第一导电接触层布置在远离第二导电接触层的绝缘层的顶部上。 光电半导体本体通过互连层并联连接。

公开(公告)号：US09575599B1

公开(公告)日：2017-02-21

申请号：US13628033

申请日：2012-09-26

Applicant: Parade Technologies, Ltd.

Inventor： Cole Wilson ,  Jonathan R. Peterson

IPC: G06F3/044 ,  H05K1/02

CPC classification number: G06F3/044 ,  G06F3/0418 ,  G06F2203/04104 ,  H05K1/0289

Abstract: An apparatus includes a touch screen panel including a sensing matrix arranged in a row-column format. The apparatus also includes a control device to scan the sensing matrix to detect a presence of multiple objects at least proximate to the touch screen panel. The control device can identify rows and columns of the sensing matrix that correspond to the presence of the multiple objects. The control device can orthogonally multiplex the identified rows and columns into one or more row-column pairs. The control device can scan at least one of the row-column pairs to detect locations of the multiple objects relative to the touch screen panel.

Abstract translation: 一种装置包括触摸屏面板，其包括以行列格式布置的感测矩阵。 该装置还包括控制装置，用于扫描感测矩阵以检测至少接近触摸屏面板的多个物体的存在。 控制装置可以识别对应于多个对象的存在的感测矩阵的行和列。 控制装置可以将所识别的行和列正交地多路复用成一个或多个行列对。 控制装置可以扫描行列对中的至少一个以检测多个对象相对于触摸屏面板的位置。

公开(公告)号：US20170048979A1

公开(公告)日：2017-02-16

申请号：US15304655

申请日：2015-03-20

Applicant: Schaeffler Technologies AG & Co. KG

Inventor： Daniel Ritter ,  Steffen Linz ,  Thomas Wacker

IPC: H05K1/18 ,  B60R16/023 ,  H02H7/20 ,  H05K1/02

CPC classification number: H05K1/18 ,  B60R16/023 ,  H02H7/20 ,  H05K1/0259 ,  H05K1/0289 ,  H05K1/029 ,  H05K1/0295 ,  H05K1/111 ,  H05K3/222 ,  H05K2201/09954 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10636 ,  H05K2203/173 ,  Y02P70/611

Abstract: The invention relates to a variable sensor interface for a control unit, this variable sensor interface including a circuit board which is provided with components. In a sensor interface which can easily be used for the use of different sensor types, the circuit board has a predefined conductive track layout having a plurality of predefined mounting locations, the mounting locations being provided with components in a sensor-specific manner.

Abstract translation: 本发明涉及一种用于控制单元的可变传感器接口，该可变传感器接口包括设置有部件的电路板。 在可以容易地用于使用不同传感器类型的传感器接口中，电路板具有预定的导电轨道布局，其具有多个预定义的安装位置，安装位置以传感器特定的方式设置有部件。