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公开(公告)号:US20240092987A1
公开(公告)日:2024-03-21
申请号:US18467201
申请日:2023-09-14
Applicant: Meta Platforms Technologies, LLC
Inventor: Li Yao , Wenyang Pan , Ziyan Liu , Shawn Reese , Thomas John Farrell Wallin , Zhenzhen Shen , Fang He , Robert Cole Bolger-Cruz , Sudhanshu Rathod , Kristopher Erickson
CPC classification number: C08J9/0076 , A61B5/268 , C08K3/046 , C08K2201/001 , C08K2201/011
Abstract: Described herein are conductive elastomeric foam materials and methods of making and using the same. The conductive elastomeric foam materials include a polymeric matrix, one or more conductive fillers, and one or more foaming agents. The polymeric matrix can include a thermoset polymer or a thermoplastic polymer. Also described herein are methods of making conductive elastomeric foam materials. Further described herein are molded products including the conductive elastomeric foam materials as described herein and wearable devices including the molded products.
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公开(公告)号:US20240076429A1
公开(公告)日:2024-03-07
申请号:US18460204
申请日:2023-09-01
Applicant: Meta Platforms Technologies, LLC
Inventor: Wenyang Pan , Shawn Reese , Li Yao , Ziyan Liu , Fang He , Robert Cole Bolger-Cruz , Sandeep Rekhi
IPC: C08F214/28 , C08F2/04 , C08K3/04 , C08L27/20
CPC classification number: C08F214/282 , C08F2/04 , C08K3/041 , C08K3/046 , C08L27/20 , C08K2201/003 , C08L2203/20 , C08L2207/04
Abstract: Described herein are conductive fluorinated elastomeric materials and methods of making and using the same. The conductive fluorinated elastomeric materials include a fluorinated polymeric matrix and one or more high aspect-ratio fillers, wherein a surface resistance of the elastomeric material is 15 ohm/square or less and/or a bulk conductivity of the elastomeric material is 0.7 Ohm-cm or less. Also described herein are liquid fluorinated elastomeric compositions, including a fluorinated polymer, one or more high aspect-ratio fillers, and a solvent. Further described herein are molded products including the conductive fluorinated elastomeric materials as described herein and wearable devices including the molded products.
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