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公开(公告)号:US20240338081A1
公开(公告)日:2024-10-10
申请号:US18587637
申请日:2024-02-26
Applicant: Meta Platforms Technologies, LLC
Inventor: Sudhanshu Rathod
CPC classification number: G06F3/016 , G02B27/017 , G06F3/014
Abstract: Described herein is an example computer-readable storage medium that includes instructions that, when executed by an artificial-reality system that includes a wearable device, cause the artificial-reality system to perform operations. These operations include that after a user has donned the wearable device on a body part of the user, obtaining, based on data from a sensor of the wearable device, one or more fit characteristics indicating how the wearable device fits on the body part of the user. The operations also include that after the user has donned the wearable device on a body part of the user, in accordance with a determination that the user is interacting with an object within an artificial reality presented via the artificial-reality system using the wearable device, providing a fit-adjusted haptic response based (i) on the one or more fit characteristics and (ii) an emulated feature associated with the object.
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公开(公告)号:US20240092987A1
公开(公告)日:2024-03-21
申请号:US18467201
申请日:2023-09-14
Applicant: Meta Platforms Technologies, LLC
Inventor: Li Yao , Wenyang Pan , Ziyan Liu , Shawn Reese , Thomas John Farrell Wallin , Zhenzhen Shen , Fang He , Robert Cole Bolger-Cruz , Sudhanshu Rathod , Kristopher Erickson
CPC classification number: C08J9/0076 , A61B5/268 , C08K3/046 , C08K2201/001 , C08K2201/011
Abstract: Described herein are conductive elastomeric foam materials and methods of making and using the same. The conductive elastomeric foam materials include a polymeric matrix, one or more conductive fillers, and one or more foaming agents. The polymeric matrix can include a thermoset polymer or a thermoplastic polymer. Also described herein are methods of making conductive elastomeric foam materials. Further described herein are molded products including the conductive elastomeric foam materials as described herein and wearable devices including the molded products.
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