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公开(公告)号:US09970089B2
公开(公告)日:2018-05-15
申请号:US14105246
申请日:2013-12-13
Applicant: Metglas, Inc.
Inventor: William Coughlan , Eric Theisen
IPC: C22C45/04 , B32B15/01 , B23K1/00 , B23K35/30 , B23K35/02 , B23K1/008 , B23K1/19 , B23K101/14 , B23K103/04
CPC classification number: C22C45/04 , B23K1/0012 , B23K1/008 , B23K1/19 , B23K35/0222 , B23K35/0233 , B23K35/3033 , B23K35/304 , B23K2101/14 , B23K2103/05 , B32B15/01 , Y10T428/12944
Abstract: Disclosed is the semi-amorphous, ductile brazing foil with composition consisting essentially of NibalCraBbPcSidMoeFef with approximately 24 atomic percent≤a≤approximately 31 atomic percent; b≤approximately 3 atomic percent; approximately 9 atomic percent≤c≤approximately 11 atomic percent; approximately 2 atomic percent≤d≤approximately 4 atomic percent; e≤approximately 2 atomic percent; f≤approximately 1 atomic percent; and the balance being Ni and other impurities; where b+c+d
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公开(公告)号:US20150168088A1
公开(公告)日:2015-06-18
申请号:US14105246
申请日:2013-12-13
Applicant: Metglas, Inc.
Inventor: William COUGHLAN , Eric Theisen
CPC classification number: C22C45/04 , B23K1/0012 , B23K1/008 , B23K1/19 , B23K35/0222 , B23K35/0233 , B23K35/3033 , B23K35/304 , B23K2101/14 , B23K2103/05 , B32B15/01 , Y10T428/12944
Abstract: Disclosed is the semi-amorphous, ductile brazing foil with composition consisting essentially of NibalCraBbPcSidMoeFef with approximately 24 atomic percent≦a≦approximately 31 atomic percent; b≦approximately 3 atomic percent; approximately 9 atomic percent≦c≦approximately 11 atomic percent; approximately 2 atomic percent≦d≦approximately 4 atomic percent; e≦approximately 2 atomic percent; f≦approximately 1 atomic percent; and the balance being Ni and other impurities; where b+c+d
Abstract translation: 公开了半无定形的韧性钎焊箔,其组成基本上由NibalCraBbPcSidMoeFef组成,其具有约24原子百分比&amp; A1; a&amp; NE;约31原子百分比; b&nlE;约3原子%; 约9原子百分比&nlE; c&nlE;约11原子百分比; 约2原子百分比&nlE; d&nlE;约4原子百分比; 约2原子%; 约1原子%; 余量为Ni和其他杂质; 其中b + c + d <约16原子%。
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公开(公告)号:US10566127B2
公开(公告)日:2020-02-18
申请号:US15534381
申请日:2015-12-08
Applicant: METGLAS, INC. , HITACHI METALS, LTD.
Inventor: Eric Theisen , Yuichi Ogawa , Daichi Azuma
Abstract: An Fe—Si—B—C-based amorphous alloy ribbon as thick as 20-30 μm having a composition comprising 80.0-80.7 atomic % of Fe, 6.1-7.99 atomic % of Si, and 11.5-13.2 atomic % of B, the total amount of Fe, Si and B being 100 atomic %, and further comprising 0.2-0.45 atomic % of C per 100 atomic % of the total amount of Fe, Si and B, except for inevitable impurities has a stress relief degree of 92% or more.
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公开(公告)号:US10022824B2
公开(公告)日:2018-07-17
申请号:US14218452
申请日:2014-03-18
Applicant: Metglas, Inc.
Inventor: William Coughlan , Eric Theisen
IPC: B21C37/00 , B23K35/30 , B23K1/00 , B23K1/008 , B23K35/02 , C22C19/05 , C22C30/00 , F28F21/08 , C22C45/00
Abstract: Disclosed is a semi-amorphous, ductile brazing foil with a composition consisting essentially of NibalFeaCrbPcSidBeMof with approximately 30 atomic percent≤a≤approximately 38 atomic percent; approximately 10 atomic percent≤b≤approximately 20 atomic percent; approximately 7 atomic percent≤c≤approximately 20 atomic percent; approximately 2 atomic percent≤d≤approximately 4 atomic percent; e≤approximately 2 atomic percent; f≤approximately 5 atomic percent; and the balance being Ni and other impurities; where c+d+e
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公开(公告)号:US10046420B2
公开(公告)日:2018-08-14
申请号:US14656263
申请日:2015-03-12
Applicant: Metglas, Inc.
Inventor: William Coughlan , Eric Theisen
IPC: B21C37/00 , B23K35/30 , B32B15/01 , B23K1/00 , B23K1/008 , C22C19/05 , C22C30/00 , C22C45/00 , B32B9/04
Abstract: Disclosed is a semi-amorphous, ductile brazing foil with a composition consisting essentially of NibalFeaCrbPcSidBeMof with approximately 30 atomic percent ≤a≤approximately 70 atomic percent; approximately 0 atomic percent ≤b≤approximately 20 atomic percent; approximately 9 atomic percent ≤c≤approximately 16 atomic percent; approximately 0 atomic percent ≤d≤approximately 4 atomic percent; e≤approximately 2 atomic percent; f≤approximately 5 atomic percent; and the balance being Ni and other impurities; where c+d+e
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