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公开(公告)号:US20180254256A1
公开(公告)日:2018-09-06
申请号:US15762837
申请日:2015-09-25
申请人: Intel Corporation
IPC分类号: H01L23/00 , B23K35/26 , B23K35/02 , H01L21/768
CPC分类号: H01L24/81 , B23K35/0222 , B23K35/0233 , B23K35/0238 , B23K35/26 , B23K35/264 , H01L21/76843 , H01L23/48 , H01L24/05 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/0239 , H01L2224/0401 , H01L2224/05647 , H01L2224/11462 , H01L2224/13082 , H01L2224/13083 , H01L2224/13113 , H01L2224/13147 , H01L2224/16147 , H01L2224/81447 , H01L2224/81815 , H01L2924/00014 , H01L2924/0105 , H01L2924/01322
摘要: Some forms relate to an electronic assembly includes a first substrate that has a copper pad mounted to the first substrate. The electronic assembly further includes a second substrate that includes a copper redistribution layer mounted on the second substrate. The electronic assembly further includes bismuth-rich solder that includes 10-40 w.t. % tin. The bismuth-rich solder is electrically engaged with the copper pad and the copper redistribution layer. In some forms, the copper redistribution layer is another copper pad. The first substrate may include a memory die and the second substrate may include a logic die. In other forms, the first and second substrates may be part of a variety of different electronic components. The types of electronic components that are associated with the first and second substrates will depend on part on the application where the electronic assembly is be utilized (among other factors).
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公开(公告)号:US20180222151A1
公开(公告)日:2018-08-09
申请号:US15945897
申请日:2018-04-05
申请人: Kathrin Eckhard , Olaf Güssgen , Thorsten Richter , Hartmut Janssen , Nico Eigen
发明人: Kathrin Eckhard , Olaf Güssgen , Thorsten Richter , Hartmut Janssen , Nico Eigen
CPC分类号: B32B15/016 , B23K35/0222 , B23K35/0233 , B23K35/286 , B23K35/288 , B32B37/04 , B32B38/10 , B32B38/1858 , B32B2310/0418 , C22C21/00 , C22C21/02 , C22C21/04 , C22C21/06
摘要: Provided are embodiments of an aluminium composite material for use in thermal flux-free joining methods. The composite material has at least one core layer of an aluminium core alloy and at least one outer solder layer of an aluminium solder alloy. The aluminium solder alloy has the following composition in wt %: 6.5%≤Si≤13%, Fe≤1%, 230 ppm≤Mg≤450 ppm, Bi≤500 ppm, Mn≤0.15%, Cu≤0.3%, Zn≤3%, and Ti≤0.30% with the remainder Al and unavoidable impurities individually at most 0.05%, in total at most 0.15% and the aluminium solder layer has an alkaline pickled or acid pickled surface. The invention further relates to a method for producing an aluminium composite material, a method for the thermal joining of components, and a thermally joined construction.
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公开(公告)号:US20180214991A1
公开(公告)日:2018-08-02
申请号:US15880452
申请日:2018-01-25
发明人: Brennan YAHATA , Justin MAYER , John H. MARTIN
CPC分类号: B23K35/286 , B22F1/02 , B22F1/025 , B22F2998/10 , B22F2999/00 , B23K35/0227 , B23K35/0233 , B23K35/0244 , B23K35/284 , B23K35/302 , B23K35/3033 , B23K35/3053 , B23K35/325 , B23K35/3601 , B23K35/3602 , B23K35/3606 , B22F1/0081 , B22F1/0088 , B22F1/0059 , B22F3/20 , B22F3/225 , B22F3/02 , B22F3/10 , B22F3/105 , B22F1/0018
摘要: A universal approach is described to produce welding filler materials with enhanced grain refining, for making welded objects with hot-crack resistance. Some variations provide a welding filler material comprising a functionalized metal-containing powder, wherein the functionalized metal-containing powder comprises metal or metal alloy particles and a plurality of nanoparticles disposed on surfaces of the metal or metal alloy particles, and wherein the nanoparticles are consolidated in a three-dimensional architecture throughout the welding filler material. A welded object contains a welding filler material comprising the functionalized metal-containing powder, enabling the welded object to be free of hot cracks. Other variations provide methods of making a welding filler material. This approach has been successfully demonstrated by incorporating zirconium-based nanoparticle grain refiners within a welding precursor material for welding aluminum alloy Al 7075, as one non-limiting example.
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公开(公告)号:US10018056B2
公开(公告)日:2018-07-10
申请号:US14750415
申请日:2015-06-25
发明人: Eric W. Stratton , Michael J. Minor
IPC分类号: B23K31/02 , F01D5/28 , C23C10/28 , C23C24/10 , C23C28/02 , F01D5/20 , B23K1/00 , B23K35/02 , B23K35/30 , C09K3/14 , C22C19/00 , C22C19/05 , F01D11/12
CPC分类号: F01D5/288 , B23K1/0018 , B23K31/02 , B23K35/0233 , B23K35/304 , C09K3/1409 , C22C19/007 , C22C19/055 , C22C19/056 , C22C19/057 , C22C19/058 , C23C10/28 , C23C24/103 , C23C28/022 , C23C28/027 , F01D5/20 , F01D11/122 , F05D2220/32 , F05D2230/237 , F05D2230/90 , F05D2300/132 , F05D2300/135 , F05D2300/173 , F05D2300/2282
摘要: A method for applying an abrasive comprises: applying, to a substrate, the integral combination of a self-braze material, an abrasive, a matrix in which the abrasive is at least partially embedded, and an intermediate layer between the self-braze material and the matrix; and heating to cause the self-braze material to braze to the substrate.
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公开(公告)号:US10012095B2
公开(公告)日:2018-07-03
申请号:US14750324
申请日:2015-06-25
发明人: Eric W. Stratton , Michael J. Minor
IPC分类号: B23K31/02 , F01D5/28 , C23C10/30 , C23C24/10 , C23C28/02 , B23K1/00 , B23K35/02 , B23K35/30 , C09K3/14 , C22C19/00 , C22C19/05 , F01D11/12 , B23K101/00
CPC分类号: F01D5/288 , B23K1/0018 , B23K31/02 , B23K35/0222 , B23K35/0233 , B23K35/0238 , B23K35/0244 , B23K35/30 , B23K35/3033 , B23K35/304 , B23K2101/001 , C09K3/1409 , C22C19/007 , C22C19/055 , C22C19/056 , C22C19/057 , C22C19/058 , C23C10/30 , C23C24/103 , C23C28/022 , C23C28/027 , F01D11/122 , F05D2220/32 , F05D2230/237 , F05D2300/132 , F05D2300/135 , F05D2300/173
摘要: A method for applying an abrasive comprises: applying, to a substrate, the integral combination of: a self-braze material; an abrasive; and a matrix in which the abrasive is at least partially embedded; and heating to cause the self-braze material to braze to the substrate. The heating leaves at least a portion of the self-braze material with a composition comprising, in weight percent: cobalt 2.5-13.5; chromium 12-27; aluminum 5-7; yttrium 0.0-1.0; hafnium 0.0-1.0; silicon 1.0-3.0; tantalum 0.0-4.5; tungsten 0.0-6.5; rhenium 0.0-2.0; molybdenum 0.1-1.0; and the balance nickel.
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公开(公告)号:US20180169796A1
公开(公告)日:2018-06-21
申请号:US15580379
申请日:2016-06-06
发明人: Richard Angus Clark , Toshimasa Oyama , David Earl Slutz , Jaspal Singh Kamboj , Edgar Giovanni Vanegas-Hurtado
CPC分类号: B23K35/0222 , B23K1/0008 , B23K35/00 , B23K35/001 , B23K35/0233 , B23K35/0238 , B23K35/325 , B23K35/36
摘要: A process for joining articles comprises the steps of: joining the articles together at a brazing temperature to form one or more brazed joints in a brazed assembly, wherein at least one of the one or more brazed joints comprises a filler at least in part capable of age hardening at a temperature below the brazing temperature; and heat treating the brazed assembly at a temperature and for a time sufficient to age harden the filler at least in part; wherein the articles comprise at least one diamond body, and the filler comprises an active brazing alloy for brazing to the at least one diamond body.
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公开(公告)号:US09999947B2
公开(公告)日:2018-06-19
申请号:US15133934
申请日:2016-04-20
发明人: Brent Elliot , Frank Balma , Alexander Veytser , Michael Parker , Jeff Cunha
IPC分类号: B23K31/02 , B23P6/00 , C04B37/00 , B23K1/00 , B23K1/19 , B23K35/28 , H01L21/67 , H01L21/687 , H01L21/683 , B23K103/00 , B23K101/20
CPC分类号: B23P6/00 , B23K1/0008 , B23K1/19 , B23K35/0233 , B23K35/0244 , B23K35/286 , B23K2101/20 , B23K2103/52 , C04B37/00 , H01L21/67103 , H01L21/6833 , H01L21/68785
摘要: A method for the repair of a heater, or an electrostatic chuck, using a ceramic top layer joined with a hermetically sealed joint. The heater or electrostatic chuck may be machined down to remove a damaged top surface, and to allow for the joining of a new top surface. The new top pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
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公开(公告)号:US20180166411A1
公开(公告)日:2018-06-14
申请号:US15797296
申请日:2017-10-30
发明人: KIYOHIRO HINE , AKIO FURUSAWA , HIDETOSHI KITAURA , KAZUKI SAKAI
CPC分类号: H01L24/29 , B23K35/0233 , B23K35/26 , B23K35/262 , C22C13/00 , H01L21/52 , H01L23/00 , H01L23/488 , H01L2224/29083 , H01L2224/29209 , H01L2224/29211 , H01L2224/29213 , H01L2224/29217 , H01L2224/29239 , H01L2224/29247 , H01L2224/29255 , H01L2224/29257 , H01L2924/014 , H01L2924/3512
摘要: A mount structure includes two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer at the interfaces with the two members. The bonding material layer contains a first intermetallic compound and a stress relaxation material. The first intermetallic compound has a spherical, a columnar, or an oval spherical shape, and the same crystalline structure as the first interface layer and the second interface layer, and partly closes the space between the first interface layer and the second interface layer. The stress relaxation material contains tin as a main component, and fills around the first intermetallic compound.
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公开(公告)号:US09970089B2
公开(公告)日:2018-05-15
申请号:US14105246
申请日:2013-12-13
申请人: Metglas, Inc.
发明人: William Coughlan , Eric Theisen
IPC分类号: C22C45/04 , B32B15/01 , B23K1/00 , B23K35/30 , B23K35/02 , B23K1/008 , B23K1/19 , B23K101/14 , B23K103/04
CPC分类号: C22C45/04 , B23K1/0012 , B23K1/008 , B23K1/19 , B23K35/0222 , B23K35/0233 , B23K35/3033 , B23K35/304 , B23K2101/14 , B23K2103/05 , B32B15/01 , Y10T428/12944
摘要: Disclosed is the semi-amorphous, ductile brazing foil with composition consisting essentially of NibalCraBbPcSidMoeFef with approximately 24 atomic percent≤a≤approximately 31 atomic percent; b≤approximately 3 atomic percent; approximately 9 atomic percent≤c≤approximately 11 atomic percent; approximately 2 atomic percent≤d≤approximately 4 atomic percent; e≤approximately 2 atomic percent; f≤approximately 1 atomic percent; and the balance being Ni and other impurities; where b+c+d
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公开(公告)号:US20180093354A1
公开(公告)日:2018-04-05
申请号:US15661360
申请日:2017-07-27
CPC分类号: B23K35/0233 , B23K1/00 , B23K35/025 , B23K35/3033 , B23K35/304 , F01D5/18 , F01D9/02 , F01D25/12 , F05D2230/237 , F05D2230/60 , F05D2230/90
摘要: A system for sealing an internal passage of a component includes a closure element positioned within the internal passage, and a joint material coupling the closure element to at least one passage wall that defines the internal passage. The system also includes a flexible braze element positioned proximate the closure element, the joint material, and the at least one passage wall.
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