公开(公告)号：US12119322B2

公开(公告)日：2024-10-15

申请号：US18014272

申请日：2021-06-28

Applicant: SUPERUFO291 TEC

Inventor： Akira Fukui ,  Toshie Fukui

IPC: H01L23/48 ,  B23K35/02 ,  B23K35/30 ,  H01L23/00 ,  H01L23/52 ,  H01L29/40 ,  B23K101/40

CPC classification number: H01L24/29 ,  B23K35/0233 ,  B23K35/3006 ,  B23K2101/40 ,  H01L24/05 ,  H01L24/32 ,  H01L2224/05155 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/2908 ,  H01L2224/29111 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32245 ,  H01L2924/0132 ,  H01L2924/10272 ,  H01L2924/13055

Abstract: A bonding member 10 used for bonding a semiconductor device 20 and a substrate 30, the bonding member including: a thermal stress relieving layer 11 made of any of Ag, Cu, Au, and Al; a first Ag brazing material layer 12 containing Ag and Sn as main components and provided on a side of the thermal stress relieving layer to which the semiconductor device is bonded; a second Ag brazing material layer 13 containing Ag and Sn as main components and provided on a side of the thermal stress relieving layer to which the substrate is bonded; a first barrier layer 14 made of Ni and/or Ni alloy and provided between the thermal stress relieving layer and the first Ag brazing material layer; and a second barrier layer 15 made of Ni and/or Ni alloy and provided between the stress relieving layer and the second Ag brazing material layer, in which a thermal conductivity of the bonding member after a power cycle test is 200 W/m·K or more.

公开(公告)号：US20240001470A1

公开(公告)日：2024-01-04

申请号：US18267887

申请日：2021-12-15

Applicant: AB SANDVIK COROMANT

Inventor： Tim ULITZKA ,  Wolfgang TILLMANN ,  Leif DAHL

IPC: B23K1/008 ,  B23K1/00 ,  B23K35/00 ,  B23K35/02 ,  B23K35/30 ,  C22C29/10 ,  C22C5/08

CPC classification number: B23K1/008 ,  B23K1/0008 ,  B23K35/004 ,  B23K35/0233 ,  B23K35/3006 ,  C22C29/10 ,  C22C5/08 ,  B23K2101/20

Abstract: A tool includes a cemented carbide part and a maraging steel part, wherein the two parts are joined by brazing. The cemented carbide part has a hard phase embedded in a metallic binder phase matrix. The maraging steel part has a hardness of between 350 and 600 HV1 with a standard deviation between 0 and 20 HV1. A method of making such tool is also provided.

公开(公告)号：US20230395550A1

公开(公告)日：2023-12-07

申请号：US18014272

申请日：2021-06-28

Applicant: SUPERUFO291 TEC

Inventor： Akira FUKUI ,  Toshie FUKUI

IPC: H01L23/00 ,  B23K35/30 ,  B23K35/02

CPC classification number: H01L24/29 ,  B23K35/3006 ,  B23K35/0233 ,  H01L2924/10272 ,  H01L2924/13055 ,  H01L2224/05573 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05644 ,  H01L2224/05155 ,  H01L2224/29139 ,  H01L2224/29155 ,  H01L2224/29144 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/29147 ,  H01L2224/29124 ,  H01L2224/2908 ,  H01L24/32 ,  H01L24/05 ,  H01L2924/0132 ,  B23K2101/40

Abstract: A bonding member 10 used for bonding a semiconductor device 20 and a substrate 30, the bonding member including: a thermal stress relieving layer 11 made of any of Ag, Cu, Au, and Al; a first Ag brazing material layer 12 containing Ag and Sn as main components and provided on a side of the thermal stress relieving layer to which the semiconductor device is bonded; a second Ag brazing material layer 13 containing Ag and Sn as main components and provided on a side of the thermal stress relieving layer to which the substrate is bonded; a first barrier layer 14 made of Ni and/or Ni alloy and provided between the thermal stress relieving layer and the first Ag brazing material layer; and a second barrier layer 15 made of Ni and/or Ni alloy and provided between the stress relieving layer and the second Ag brazing material layer, in which a thermal conductivity of the bonding member after a power cycle test is 200 W/m·K or more.

公开(公告)号：US11772204B2

公开(公告)日：2023-10-03

申请号：US18117754

申请日：2023-03-06

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Shunsuke Koga ,  Tomoki Sasaki ,  Yoshie Tachibana ,  Shunsaku Yoshikawa

IPC: B23K35/26 ,  B23K35/02 ,  B23K35/30 ,  C22C13/00 ,  C22C19/03

CPC classification number: B23K35/262 ,  B23K35/0233 ,  B23K35/3033 ,  C22C13/00 ,  C22C19/03

Abstract: Provided is a preform solder including a first metal containing Sn and a second metal formed of an alloy containing Ni and Fe. Alternatively, provided is a preform solder (1) having a metal structure including a first phase (10) that is a continuous phase and a second phase (20) dispersed in the first phase (10), the first phase (10) contains Sn, the second phase (20) is formed of an alloy containing Ni and Fe, and a grain boundary (15) of a metal is present in the first phase (10).

公开(公告)号：US11712759B2

公开(公告)日：2023-08-01

申请号：US17790847

申请日：2021-02-08

Applicant: Pfarr Stanztechnik GmbH

Inventor： Ralph Maedler ,  Stephan Reichelt

IPC: B23K35/26 ,  B23K35/02

CPC classification number: B23K35/0233 ,  B23K35/262

Abstract: A lead-free soldering foil, for connecting metal and/or metal-coated components. allows the setting of a defined connecting-zone geometry and, with pores and/or voids being formed only to a minimal extent, achieves a high-temperature-resistant soldered connection that ensures great reliability even in staged soldering processes and increases the thermal conductivity of the connecting zone. The lead-free soldering foil is constructed so that, in a soft-solder matrix, two or more composite wires are each individually sandwiched by roll cladding between two soft-solder strips, parallel to one another and parallel to the edges of the strips. These composite wires include a core, which contains a higher-melting, stronger metal/metal alloy in comparison with the soft-solder matrix and around which a shell of another metal/metal alloy is arranged, and, after the roll-cladding operation, there is still 5 pm to 15 pm of soft-solder material arranged above and below at least one of the cores.

公开(公告)号：US20180254256A1

公开(公告)日：2018-09-06

申请号：US15762837

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Pilin Liu ,  Purushotham Kaushik Muthur Srinath ,  Deepak Goyal

IPC: H01L23/00 ,  B23K35/26 ,  B23K35/02 ,  H01L21/768

CPC classification number: H01L24/81 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/26 ,  B23K35/264 ,  H01L21/76843 ,  H01L23/48 ,  H01L24/05 ,  H01L24/08 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13113 ,  H01L2224/13147 ,  H01L2224/16147 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01322

Abstract: Some forms relate to an electronic assembly includes a first substrate that has a copper pad mounted to the first substrate. The electronic assembly further includes a second substrate that includes a copper redistribution layer mounted on the second substrate. The electronic assembly further includes bismuth-rich solder that includes 10-40 w.t. % tin. The bismuth-rich solder is electrically engaged with the copper pad and the copper redistribution layer. In some forms, the copper redistribution layer is another copper pad. The first substrate may include a memory die and the second substrate may include a logic die. In other forms, the first and second substrates may be part of a variety of different electronic components. The types of electronic components that are associated with the first and second substrates will depend on part on the application where the electronic assembly is be utilized (among other factors).

公开(公告)号：US20180222151A1

公开(公告)日：2018-08-09

申请号：US15945897

申请日：2018-04-05

Applicant: Kathrin Eckhard ,  Olaf Güssgen ,  Thorsten Richter ,  Hartmut Janssen ,  Nico Eigen

Inventor： Kathrin Eckhard ,  Olaf Güssgen ,  Thorsten Richter ,  Hartmut Janssen ,  Nico Eigen

IPC: B32B15/01 ,  B32B38/10 ,  B32B38/18 ,  B32B37/04

CPC classification number: B32B15/016 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/286 ,  B23K35/288 ,  B32B37/04 ,  B32B38/10 ,  B32B38/1858 ,  B32B2310/0418 ,  C22C21/00 ,  C22C21/02 ,  C22C21/04 ,  C22C21/06

Abstract: Provided are embodiments of an aluminium composite material for use in thermal flux-free joining methods. The composite material has at least one core layer of an aluminium core alloy and at least one outer solder layer of an aluminium solder alloy. The aluminium solder alloy has the following composition in wt %: 6.5%≤Si≤13%, Fe≤1%, 230 ppm≤Mg≤450 ppm, Bi≤500 ppm, Mn≤0.15%, Cu≤0.3%, Zn≤3%, and Ti≤0.30% with the remainder Al and unavoidable impurities individually at most 0.05%, in total at most 0.15% and the aluminium solder layer has an alkaline pickled or acid pickled surface. The invention further relates to a method for producing an aluminium composite material, a method for the thermal joining of components, and a thermally joined construction.

公开(公告)号：US20180214991A1

公开(公告)日：2018-08-02

申请号：US15880452

申请日：2018-01-25

Applicant: HRL Laboratories, LLC

Inventor： Brennan YAHATA ,  Justin MAYER ,  John H. MARTIN

IPC: B23K35/28 ,  B23K35/02 ,  B22F1/02

CPC classification number: B23K35/286 ,  B22F1/02 ,  B22F1/025 ,  B22F2998/10 ,  B22F2999/00 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/284 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3053 ,  B23K35/325 ,  B23K35/3601 ,  B23K35/3602 ,  B23K35/3606 ,  B22F1/0081 ,  B22F1/0088 ,  B22F1/0059 ,  B22F3/20 ,  B22F3/225 ,  B22F3/02 ,  B22F3/10 ,  B22F3/105 ,  B22F1/0018

Abstract: A universal approach is described to produce welding filler materials with enhanced grain refining, for making welded objects with hot-crack resistance. Some variations provide a welding filler material comprising a functionalized metal-containing powder, wherein the functionalized metal-containing powder comprises metal or metal alloy particles and a plurality of nanoparticles disposed on surfaces of the metal or metal alloy particles, and wherein the nanoparticles are consolidated in a three-dimensional architecture throughout the welding filler material. A welded object contains a welding filler material comprising the functionalized metal-containing powder, enabling the welded object to be free of hot cracks. Other variations provide methods of making a welding filler material. This approach has been successfully demonstrated by incorporating zirconium-based nanoparticle grain refiners within a welding precursor material for welding aluminum alloy Al 7075, as one non-limiting example.

公开(公告)号：US10018056B2

公开(公告)日：2018-07-10

申请号：US14750415

申请日：2015-06-25

Applicant: United Technologies Corporation

Inventor： Eric W. Stratton ,  Michael J. Minor

IPC: B23K31/02 ,  F01D5/28 ,  C23C10/28 ,  C23C24/10 ,  C23C28/02 ,  F01D5/20 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  C09K3/14 ,  C22C19/00 ,  C22C19/05 ,  F01D11/12

CPC classification number: F01D5/288 ,  B23K1/0018 ,  B23K31/02 ,  B23K35/0233 ,  B23K35/304 ,  C09K3/1409 ,  C22C19/007 ,  C22C19/055 ,  C22C19/056 ,  C22C19/057 ,  C22C19/058 ,  C23C10/28 ,  C23C24/103 ,  C23C28/022 ,  C23C28/027 ,  F01D5/20 ,  F01D11/122 ,  F05D2220/32 ,  F05D2230/237 ,  F05D2230/90 ,  F05D2300/132 ,  F05D2300/135 ,  F05D2300/173 ,  F05D2300/2282

Abstract: A method for applying an abrasive comprises: applying, to a substrate, the integral combination of a self-braze material, an abrasive, a matrix in which the abrasive is at least partially embedded, and an intermediate layer between the self-braze material and the matrix; and heating to cause the self-braze material to braze to the substrate.

公开(公告)号：US10012095B2

公开(公告)日：2018-07-03

申请号：US14750324

申请日：2015-06-25

Applicant: United Technologies Corporation

Inventor： Eric W. Stratton ,  Michael J. Minor

IPC: B23K31/02 ,  F01D5/28 ,  C23C10/30 ,  C23C24/10 ,  C23C28/02 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  C09K3/14 ,  C22C19/00 ,  C22C19/05 ,  F01D11/12 ,  B23K101/00

CPC classification number: F01D5/288 ,  B23K1/0018 ,  B23K31/02 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/30 ,  B23K35/3033 ,  B23K35/304 ,  B23K2101/001 ,  C09K3/1409 ,  C22C19/007 ,  C22C19/055 ,  C22C19/056 ,  C22C19/057 ,  C22C19/058 ,  C23C10/30 ,  C23C24/103 ,  C23C28/022 ,  C23C28/027 ,  F01D11/122 ,  F05D2220/32 ,  F05D2230/237 ,  F05D2300/132 ,  F05D2300/135 ,  F05D2300/173

Abstract: A method for applying an abrasive comprises: applying, to a substrate, the integral combination of: a self-braze material; an abrasive; and a matrix in which the abrasive is at least partially embedded; and heating to cause the self-braze material to braze to the substrate. The heating leaves at least a portion of the self-braze material with a composition comprising, in weight percent: cobalt 2.5-13.5; chromium 12-27; aluminum 5-7; yttrium 0.0-1.0; hafnium 0.0-1.0; silicon 1.0-3.0; tantalum 0.0-4.5; tungsten 0.0-6.5; rhenium 0.0-2.0; molybdenum 0.1-1.0; and the balance nickel.