公开(公告)号：US20010017215A1

公开(公告)日：2001-08-30

申请号：US09804663

申请日：2001-03-13

Applicant: Methode Electronics, Inc.

Inventor： Ryan Kimura ,  James Farquhar ,  Jeffrey Allen ,  Michael Chao ,  Stephen Hatch ,  Scott Herbert ,  Brandt Weibezhan ,  Iggoni Fajardo

IPC: H02G003/08 ,  H05K005/00 ,  B22D001/00

CPC classification number: H05K5/0269 ,  Y10S29/029 ,  Y10S164/90 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49988

Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

Abstract translation: 用于屏蔽电磁辐射的PCB封装，以退出或进入封装。 在一个实施例中，封装包括第一和第二导电盖以及第一和第二导电框架。 电连接到第一盖和第二框架的第一框架电连接到第二盖。 然后，第一框架电连接到第二框架。 第一和第二框架可以由导电塑料或金属或任何其它导电材料制成。 还阐述了组装各种实施例的包装的方法。

公开(公告)号：US20020124400A1

公开(公告)日：2002-09-12

申请号：US09804671

申请日：2001-03-13

Applicant: Methode Electronics, Inc.

Inventor： Ryan Kimura ,  James Farquhar ,  Jeffrey Allen ,  Michael Chao ,  Stephen Hatch ,  Scott Herbert ,  Brandt Weibezhan ,  Iggoni Fajardo

IPC: H05K003/36 ,  H05K003/02

CPC classification number: H05K5/0269 ,  Y10S29/029 ,  Y10S164/90 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49988

Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

Abstract translation: 用于屏蔽电磁辐射的PCB封装，以退出或进入封装。 在一个实施例中，封装包括第一和第二导电盖以及第一和第二导电框架。 电连接到第一盖和第二框架的第一框架电连接到第二盖。 然后，第一框架电连接到第二框架。 第一和第二框架可以由导电塑料或金属或任何其它导电材料制成。 还阐述了组装各种实施例的包装的方法。

公开(公告)号：US20010019475A1

公开(公告)日：2001-09-06

申请号：US09804670

申请日：2001-03-13

Applicant: Methode Electronics, Inc.

Inventor： Ryan Kimura ,  James Farquhar ,  Jeffrey Allen ,  Michael Chao ,  Stephen Hatch ,  Scott Herbert ,  Brandt Weibezhan ,  Iggon Fajardo

IPC: H05K005/00 ,  H05K005/04 ,  H05K005/06

CPC classification number: H05K5/0269 ,  Y10S29/029 ,  Y10S164/90 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49988

Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.