Apparatus For Forming Structural Members
    5.
    发明申请
    Apparatus For Forming Structural Members 有权
    用于形成结构构件的装置

    公开(公告)号:US20090123588A1

    公开(公告)日:2009-05-14

    申请号:US12354856

    申请日:2009-01-16

    Abstract: A method and associated apparatus for forming a composite structural member from a charge are provided. The charge can be disposed on a first die of the apparatus and formed to a desired configuration defined by a recess of the die by inserting a second die or a tool into the recess. In some cases, the first die can include two portions that are adjustable in a transverse direction so that the recess can be opened by the insertion of the second die or tool. The second die or tool can be a substantially rigid member or an inflatable bladder. In either case, the charge can be disposed on the first die, formed, and then further processed on the first die, thereby facilitating indexing of the charge for each operation.

    Abstract translation: 提供了一种用于从电荷形成复合结构构件的方法和相关联的装置。 电荷可以设置在设备的第一裸片上,并且通过将第二模具或工具插入凹槽中而形成为由凹模的凹槽限定的期望构型。 在一些情况下,第一模具可以包括在横向方向上可调节的两个部分,使得可以通过插入第二模具或工具来打开凹部。 第二模具或工具可以是基本上刚性的构件或可充气囊。 在任一种情况下,电荷可以设置在第一裸片上,形成,然后在第一裸片上进一步处理,从而便于每个操作的电荷分度。

    Apparatus for forming structural members
    7.
    发明授权
    Apparatus for forming structural members 有权
    用于形成结构构件的装置

    公开(公告)号:US07708546B2

    公开(公告)日:2010-05-04

    申请号:US12354856

    申请日:2009-01-16

    Abstract: A method and associated apparatus for forming a composite structural member from a charge are provided. The charge can be disposed on a first die of the apparatus and formed to a desired configuration defined by a recess of the die by inserting a second die or a tool into the recess. In some cases, the first die can include two portions that are adjustable in a transverse direction so that the recess can be opened by the insertion of the second die or tool. The second die or tool can be a substantially rigid member or an inflatable bladder. In either case, the charge can be disposed on the first die, formed, and then further processed on the first die, thereby facilitating indexing of the charge for each operation.

    Abstract translation: 提供了一种用于从电荷形成复合结构构件的方法和相关联的装置。 电荷可以设置在设备的第一裸片上,并且通过将第二模具或工具插入凹槽中而形成为由凹模的凹槽限定的期望构型。 在一些情况下,第一模具可以包括在横向方向上可调节的两个部分,使得可以通过插入第二模具或工具来打开凹部。 第二模具或工具可以是基本上刚性的构件或可充气囊。 在任一种情况下,电荷可以设置在第一裸片上,形成,然后在第一裸片上进一步处理,从而便于每个操作的电荷分度。

    Conductor head
    8.
    发明授权
    Conductor head 有权
    导体头

    公开(公告)号:US07300301B2

    公开(公告)日:2007-11-27

    申请号:US11347878

    申请日:2006-02-06

    Applicant: Michael A. Lee

    Inventor: Michael A. Lee

    CPC classification number: H02G1/02 G01R1/22

    Abstract: A quick-release conductor head for engaging a conductor, but capable of quickly releasing the conductor, if necessary. The quick-release conductor head includes a body for receiving the conductor, a latch pivotally connected to the body, a locking system for temporarily maintaining the latch in a closed position, and an opening system for automatically moving the latch from the closed position to the open position. In the closed position, the conductor is maintained within the body, while in the open position the body can be easily disengaged from the conductor. The present invention can include a guide system adapted to guide the conductor towards the body and guide the latch towards the locking system, when the latch is moved towards the closed position. The opening system can include a triggering mechanism and a bias adapted to disengage the latch from the locking system and move the latch towards the open position.

    Abstract translation: 用于接合导体但能够快速释放导体的快速释放导体头,如有必要。 快速释放导体头包括用于接收导体的主体,枢转地连接到主体的闩锁,用于将闩锁暂时保持在关闭位置的锁定系统,以及用于将闩锁从关闭位置自动移动到 开仓 在关闭位置,导体保持在主体内,而在打开位置,主体可以容易地从导体脱离。 本发明可以包括导向系统,当导向件朝向关闭位置移动时,引导系统适于将导体引向主体并将闩锁引向锁定系统。 打开系统可以包括触发机构和适于使闩锁与锁定系统分离的偏压并将闩锁移向打开位置。

    On-chip temperature sensor utilizing a Schottky barrier diode structure
    10.
    发明授权
    On-chip temperature sensor utilizing a Schottky barrier diode structure 失效
    利用肖特基势垒二极管结构的片上温度传感器

    公开(公告)号:US5154514A

    公开(公告)日:1992-10-13

    申请号:US751490

    申请日:1991-08-29

    CPC classification number: G01K7/01

    Abstract: A temperature sensor, comprising: a diode structure including, a) a silicon substrate, b) a first region of a metal silicide in the silicon substrate, c) a second region of a metal-oxide semiconductor material on the first region, d) a third region of a metal over the second region; and, means for using the diode structure as a temperature sensitive device to measure an ambient temperature. The metal-oxide semiconductor material is preferably selected to have a bandgap of not less than about 3.0 eV.

    Abstract translation: 1.一种温度传感器,包括:二极管结构,包括:a)硅衬底,b)所述硅衬底中的金属硅化物的第一区域,c)所述第一区域上的金属氧化物半导体材料的第二区域,d) 第二区域上的金属的第三区域; 以及用于使用二极管结构作为温度敏感设备来测量环境温度的装置。 金属氧化物半导体材料优选选择为具有不小于约3.0eV的带隙。

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