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    Wafer bonding system and method for bonding and debonding thereof
    1.
    发明授权
    Wafer bonding system and method for bonding and debonding thereof 有权
    晶圆接合系统及其粘合和剥离方法

    公开(公告)号：US09029269B2

    公开(公告)日：2015-05-12

    申请号：US14001298

    申请日：2012-02-24

    申请人： Michael Bourbina ,  Jeffrey N. Bremmer ,  Eric S. Moyer ,  Sheng Wang ,  Craig R. Yeakle

    发明人： Michael Bourbina ,  Jeffrey N. Bremmer ,  Eric S. Moyer ,  Sheng Wang ,  Craig R. Yeakle

    IPC分类号： H01L21/683 ,  B32B7/12 ,  B32B33/00 ,  H01L21/304

    CPC分类号： B32B7/12 ,  B32B33/00 ,  H01L21/304 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T428/1476 ,  Y10T428/2839 ,  Y10T428/31663

    摘要： A method of treating the surface of a semiconductor wafer through the formation of a bonding system is provided in order to enhance the handling of the wafer during subsequent processing operations. The method generally comprises the steps of applying a release layer and an adhesive to different wafers; bonding the wafers together to form a bonded wafer system; performing at least one wafer processing operation (e.g., wafer grinding, etc.) to form a thin processed wafer; debonding the wafers; and then cleaning the surface of the processed wafer with an organic solvent that is capable of dissolving the release layer or any residue thereof. The adhesive includes a vinyl-functionalized polysiloxane oligomeric resin, a Si—H functional polysiloxane oligomeric resin, a catalyst, and optionally an inhibitor, while the release layer is comprised of either a silsesquioxane-based resin or a thermoplastic resin.

    摘要翻译： 提供了通过形成接合系统来处理半导体晶片的表面的方法，以便在随后的处理操作期间增强晶片的处理。 该方法通常包括将剥离层和粘合剂施加到不同晶片的步骤; 将晶片接合在一起以形成接合晶片系统; 执行至少一个晶片处理操作（例如，晶片研磨等）以形成薄的加工晶片; 剥离晶片; 然后用能够溶解脱模层的有机溶剂或其任何残余物清洗加工晶片的表面。 粘合剂包括乙烯基官能化聚硅氧烷低聚树脂，Si-H官能聚硅氧烷低聚树脂，催化剂和任选的抑制剂，而脱模层由倍半硅氧烷基树脂或热塑性树脂构成。

    Wafer Bonding System and Method for Bonding and Debonding Thereof
    2.
    发明申请
    Wafer Bonding System and Method for Bonding and Debonding Thereof 有权
    晶圆贴合系统及其粘合和剥离方法

    公开(公告)号：US20140057450A1

    公开(公告)日：2014-02-27

    申请号：US14001298

    申请日：2012-02-24

    申请人： Michael Bourbina ,  Jeffrey N. Bremmer ,  Eric S. Moyer ,  Sheng Wang ,  Craig R. Yeakle

    发明人： Michael Bourbina ,  Jeffrey N. Bremmer ,  Eric S. Moyer ,  Sheng Wang ,  Craig R. Yeakle

    IPC分类号： H01L21/683 ,  B32B7/12 ,  B32B33/00 ,  H01L21/304

    CPC分类号： B32B7/12 ,  B32B33/00 ,  H01L21/304 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T428/1476 ,  Y10T428/2839 ,  Y10T428/31663

    摘要： A method of treating the surface of a semiconductor wafer through the formation of a bonding system is provided in order to enhance the handling of the wafer during subsequent processing operations. The method generally comprises the steps of applying a release layer and an adhesive to different wafers; bonding the wafers together to form a bonded wafer system; performing at least one wafer processing operation (e.g., wafer grinding, etc.) to form a thin processed wafer; debonding the wafers; and then cleaning the surface of the processed wafer with an organic solvent that is capable of dissolving the release layer or any residue thereof. The adhesive includes a vinyl-functionalized polysiloxane oligomeric resin, a Si—H functional polysiloxane oligomeric resin, a catalyst, and optionally an inhibitor, while the release layer is comprised of either a silsesquioxane-based resin or a thermoplastic resin.

    摘要翻译： 提供了通过形成接合系统来处理半导体晶片的表面的方法，以便在随后的处理操作期间增强晶片的处理。 该方法通常包括将剥离层和粘合剂施加到不同晶片的步骤; 将晶片接合在一起以形成接合晶片系统; 执行至少一个晶片处理操作（例如，晶片研磨等）以形成薄的加工晶片; 剥离晶片; 然后用能够溶解脱模层的有机溶剂或其任何残余物清洗加工晶片的表面。 粘合剂包括乙烯基官能化聚硅氧烷低聚树脂，Si-H官能聚硅氧烷低聚树脂，催化剂和任选的抑制剂，而脱模层由倍半硅氧烷基树脂或热塑性树脂构成。