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公开(公告)号：US20110300815A1
公开(公告)日：2011-12-08
申请号：US12796280
申请日：2010-06-08
CPC分类号： H05K7/20154 , H01L23/36 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, a locking mechanism comprises: a lever-arm-component coupled to a first side of an module and a second side of the module that opposes the first side; the lever-arm-component rotates about a first axis; first and second latching-arm-components including latching-hooks, the first latching-arm-component coupled to the lever-arm-component on the first side and rotating about a second axis that run parallel to and offset from the first axis; the second latching-arm-component coupled to the lever-arm-component on the second side and rotating about the second axis; and a secondary fastener. The first and second axes are oriented in an over-center configuration such that when the lever-arm-component is rotated about the first axis from a first to second position, the second axis will pass through a locking axis and the latching-hooks apply a force against a mechanism of the enclosure that presses the module against a heat sink of the enclosure.
摘要翻译： 在一个实施例中，锁定机构包括：耦合到模块的第一侧的杠杆臂部件和与第一侧相对的模块的第二侧; 杠杆臂组件绕第一轴线旋转; 第一和第二闩锁臂部件包括闩锁钩，第一闩锁臂部件联接到第一侧上的杠杆臂部件并围绕平行于第一轴线偏移的第二轴线旋转; 所述第二闩锁臂部件联接到所述第二侧上的所述杠杆臂部件并围绕所述第二轴线旋转; 和次级紧固件。 第一和第二轴线定位成过中心构造，使得当杠杆臂部件从第一轴线旋转到第二位置时，第二轴线将穿过锁定轴线并且锁定钩应用 抵抗外壳机构的力将模块压靠在外壳的散热片上。
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公开(公告)号：US20090311974A1
公开(公告)日：2009-12-17
申请号：US12470648
申请日：2009-05-22
CPC分类号： H04B1/38 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49133
摘要： A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.
摘要翻译： 提供通信模块。 在一个实施例中，通信模块包括至少一个收发器，与所述至少一个收发器通信耦合的滤波器，通信地耦合到所述至少一个收发器和所述滤波器的功率放大器，被配置为保持所述至少一个收发器 收发器，滤波器和功率放大器，以及连接到主模块机箱的滤波器悬架框架组件。 过滤器悬架框架组件被配置为相对于主模块底盘漂浮至少一个收发器。
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公开(公告)号：US20090032234A1
公开(公告)日：2009-02-05
申请号：US11831561
申请日：2007-07-31
IPC分类号： F28F13/00
CPC分类号： F28F3/06 , F28F2215/10 , F28F2255/00 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for dissipating heat through a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins projecting from a first side of the heat dissipating member. Additionally, the apparatus includes a thermal material within at least one fin of the plurality of fins, the thermal material having a thermal conductivity greater than the thermal conductivity of the at least one fin in a direction normal to the first side of the heat dissipating member. Finally, a thermal spreader thermally coupled to the heat dissipating member, the thermal spreader configured to spread heat across the plurality of fins of the heat dissipating member is included.
摘要翻译： 提供了一种通过多个散热片散热的装置。 该装置包括由金属构成并具有从散热构件的第一侧突出的多个翅片的散热构件。 另外，该装置包括在多个翅片的至少一个翅片内的热材料，该热材料的热导率大于该散热构件的第一侧垂直方向的该至少一个翅片的热导率 。 最后，包括热耦合到散热构件的散热器，散热器被配置成散热穿过散热构件的多个翅片。
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公开(公告)号：US08148648B2
公开(公告)日：2012-04-03
申请号：US12410736
申请日：2009-03-25
CPC分类号： H05K9/0049 , H04Q1/026 , H04Q1/10 , H04Q1/114 , H04Q1/116 , Y10T29/49002
摘要： A method for forming an electronics enclosure is disclosed. The method comprises extruding a backplane having a first extruded length, the backplane comprising slots on opposing sides of the backplane, wherein the slots extend along the first extruded length. The method further comprises extruding at least one door panel at the first extruded length, wherein the backplane and the door panel each have extruded hinge features for pivotally coupling the door panel to the backplane, and coupling at least two cast metal plates to opposing ends of the backplane, where each of the cast metal plates comprise a gland that aligns with the slots of the backplane to create a continuous channel for inserting a seal.
摘要翻译： 公开了一种用于形成电子外壳的方法。 该方法包括挤压具有第一挤出长度的背板，背板在背板的相对侧上包括槽，其中槽沿着第一挤压长度延伸。 该方法还包括以第一挤压长度挤出至少一个门板，其中背板和门板各具有挤压铰链特征，用于将门板枢转地连接到背板，并将至少两个铸造金属板耦合到 底板，其中每个铸造金属板包括与底板的槽对准的压盖，以形成用于插入密封件的连续通道。
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公开(公告)号：US07724521B2
公开(公告)日：2010-05-25
申请号：US12137309
申请日：2008-06-11
IPC分类号： H05K7/20
CPC分类号： H05K7/20163
摘要： Systems and methods for Venturi fan-assisted cooling of electrical equipment are provided. In one embodiment, a cooling unit for an enclosure housing electronics is provided. The cooling unit comprises: a fan shroud having at least one electrical fan; and a Venturi chamber having a first inlet for receiving a heated airflow from a heatsink, a second inlet for receiving an airflow from a surrounding environment, and an outlet coupled to the fan shroud, the fan drawing air from the Venturi chamber via the outlet when the fan is on. The Venturi chamber comprises a wall for directing the airflow air from the surrounding environment in from the second inlet and across the heated airflow from the heatsink in a manner to as to draw the heated airflow through the heatsink using a Venturi effect, when the fan is on.
摘要翻译： 提供了文丘里风扇辅助冷却电气设备的系统和方法。 在一个实施例中，提供了一种用于外壳电子设备的外壳的冷却单元。 冷却单元包括：具有至少一个电风扇的风扇罩; 文丘里室具有用于接收来自散热器的加热空气流的第一入口，用于接收来自周围环境的气流的第二入口和联接到风扇罩的出口，风扇经由出口从文丘里室抽出空气， 风扇已打开。 文丘里室包括一个墙壁，用于从第二入口引导来自周围环境的气流空气，并且以一种方式将暖气的气流横跨加热的气流，以便当风扇为 上。
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6.发明申请APPARATUS FOR MOUNTING A MODULE AND ENABLING HEAT CONDUCTION FROM THE MODULE TO THE MOUNTING SURFACE 有权用于安装模块和从模块到安装表面启用热传导的装置公开(公告)号：US20090310312A1
公开(公告)日：2009-12-17
申请号：US12137297
申请日：2008-06-11
IPC分类号： H05K7/20
CPC分类号： H05K7/20418 , Y10T24/44026 , Y10T24/44556
摘要： An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a first part of a latch mechanism adjacent to the heat conducting surface. The first part of the latch mechanism is adjacent an edge of the heat conducting surface opposite to the first flange, such that a portion of the heat conducting surface is between the first flange and the first part of the latch mechanism. The electronics enclosure also includes a plurality of electronic modules configured to mount to the heat dissipating body. Each of the plurality of electronic modules comprises: a plurality of electronic components, a heat conducting side configured to contact the heat conducting surface of the heat dissipating body, a second flange adjacent the heat conducting side, the second flange configured to couple with the first flange, and a second part of the latch mechanism adjacent the heat conducting side, the second part of the latch mechanism configured to couple with the first part of the latch mechanism. The second flange and the second part of the latch mechanism are on opposite edges of the heat conducting side.
摘要翻译： 提供电子外壳。 电子外壳包括散热体，该散热体包括：导热表面，与导热表面相邻的第一凸缘，以及邻近导热表面的闩锁机构的第一部分。 闩锁机构的第一部分与导热表面的与第一凸缘相对的边缘相邻，使得导热表面的一部分位于第一凸缘和闩锁机构的第一部分之间。 电子外壳还包括配置成安装到散热体的多个电子模块。 所述多个电子模块中的每一个包括：多个电子部件，被配置为接触所述散热体的导热表面的导热侧，与所述导热侧相邻的第二凸缘，所述第二凸缘被配置为与所述第一 所述闩锁机构的第二部分邻近所述导热侧，所述闩锁机构的所述第二部分配置成与所述闩锁机构的所述第一部分联接。 第二凸缘和闩锁机构的第二部分在导热侧的相对边缘上。
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公开(公告)号：US20090310309A1
公开(公告)日：2009-12-17
申请号：US12472490
申请日：2009-05-27
IPC分类号： H05K7/20
CPC分类号： H05K7/20163 , H05K7/20518
摘要： A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively. The first and second conductive paths are independent from each other.
摘要翻译： 提供了一种热管理方法。 该方法包括在至少一个高功率耐热电子部件与容纳在电气外壳内的至少一个低功率热敏电子部件之间提供热隔离，提供从该至少一个低功率电子元件到第一导电路径的第一导电路径 第一散热器，提供从所述至少一个高功率电子部件到第二散热器的第二导电路径，消散由所述至少一个低功率热敏电子部件产生的热并且散发由所述至少一个高功率电子部件产生的热量， 通过将所述至少一个低功率热敏电子部件和所述至少一个大功率耐热电子部件所产生的热量引导沿着所述第一和第二导电路径传递到所述电气外壳外部的环境的功率耐热电子部件， 分别。 第一和第二导电路径彼此独立。
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公开(公告)号：US08125785B2
公开(公告)日：2012-02-28
申请号：US12137307
申请日：2008-06-11
IPC分类号： H05K5/00
CPC分类号： H05K7/20536 , H05K9/0062
摘要： In one embodiment, an electronics enclosure is provided. The electronics enclosure comprises a base operable to secure one or more electronic components in place. The base comprises a back wall to which the electronic components are secured; a first end plate extending from a first end of the back wall; and a second end plate extending from a second end of the back wall. The electronics enclosure further comprises a first side wall coupled to a first side of the base and operable to rotate between an open position and a closed position; a second side wall coupled to a second side of the base and operable to rotate between an open position and a closed position; and wherein each of the first and second side walls comprise a first section and a second section which form an angle such that, when in the closed position, the first and second side walls interconnect with each other and together abut the exposed perimeter of the first end plate, the second end plate and the back wall to enclose the one or more electronic components.
摘要翻译： 在一个实施例中，提供电子外壳。 电子外壳包括可操作以将一个或多个电子部件固定在适当位置的基座。 底座包括固定电子部件的后壁; 从所述后壁的第一端延伸的第一端板; 以及从后壁的第二端延伸的第二端板。 电子外壳还包括联接到基座的第一侧并可操作以在打开位置和关闭位置之间旋转的第一侧壁; 耦合到所述基座的第二侧并且可操作以在打开位置和关闭位置之间旋转的第二侧壁; 并且其中所述第一侧壁和所述第二侧壁中的每一个包括第一部分和第二部分，所述第一部分和第二部分形成一个角度，使得当处于所述关闭位置时，所述第一和第二侧壁彼此互连并且一起抵靠所述第一和第二侧壁的暴露的周边 端板，第二端板和后壁以封闭一个或多个电子部件。
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公开(公告)号：US20090311463A1
公开(公告)日：2009-12-17
申请号：US12137313
申请日：2008-06-11
CPC分类号： H02G3/081 , H02G3/086 , Y10T428/24008
摘要： Systems and methods for proving solar shields are provided. In one embodiment, a solar shield system comprises at least one solar shield having a first set of snap-fit features positioned on the first solar shield to engage with attachment channels of an enclosure; at least one solar shield cover having a flexible hinge integrated therein, the at least one solar shield cover further comprises a second set of snap-fit features for coupling the at least one solar shield cover with the at least one solar shield; and a plurality of fastening devices for securing the at least one solar shield and the at least one solar shield cover to the attachment channels of the enclosure.
摘要翻译： 提供了证明太阳能屏蔽的系统和方法。 在一个实施例中，太阳能屏蔽系统包括至少一个太阳能屏蔽，其具有定位在第一太阳能屏蔽上的第一组卡扣配合特征，以与外壳的附接通道接合; 至少一个太阳能屏蔽盖，其具有集成在其中的柔性铰链，所述至少一个太阳能屏蔽盖还包括用于将所述至少一个太阳能屏蔽盖与所述至少一个太阳能屏蔽件联接的第二组卡扣配合特征; 以及用于将所述至少一个太阳能护罩和所述至少一个太阳能护罩盖固定到所述外壳的附接通道的多个紧固装置。
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公开(公告)号：US20090309467A1
公开(公告)日：2009-12-17
申请号：US12137307
申请日：2008-06-11
IPC分类号： A47B81/00
CPC分类号： H05K7/20536 , H05K9/0062
摘要： In one embodiment, an electronics enclosure is provided. The electronics enclosure comprises a base operable to secure one or more electronic components in place. The base comprises a back wall to which the electronic components are secured; a first end plate extending from a first end of the back wall; and a second end plate extending from a second end of the back wall. The electronics enclosure further comprises a first side wall coupled to a first side of the base and operable to rotate between an open position and a closed position; a second side wall coupled to a second side of the base and operable to rotate between an open position and a closed position; and wherein each of the first and second side walls comprise a first section and a second section which form an angle such that, when in the closed position, the first and second side walls interconnect with each other and together abut the exposed perimeter of the first end plate, the second end plate and the back wall to enclose the one or more electronic components.
摘要翻译： 在一个实施例中，提供电子外壳。 电子外壳包括可操作以将一个或多个电子部件固定在适当位置的基座。 底座包括固定电子部件的后壁; 从所述后壁的第一端延伸的第一端板; 以及从后壁的第二端延伸的第二端板。 电子外壳还包括联接到基座的第一侧并可操作以在打开位置和关闭位置之间旋转的第一侧壁; 耦合到所述基座的第二侧并且可操作以在打开位置和关闭位置之间旋转的第二侧壁; 并且其中所述第一侧壁和所述第二侧壁中的每一个包括第一部分和第二部分，所述第一部分和第二部分形成一个角度，使得当处于所述关闭位置时，所述第一和第二侧壁彼此互连并且一起抵靠所述第一和第二侧壁的暴露的周边 端板，第二端板和后壁以封闭一个或多个电子部件。
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