Method And System For A Light Source Assembly Supporting Direct Coupling To An Integrated Circuit
    1.
    发明申请
    Method And System For A Light Source Assembly Supporting Direct Coupling To An Integrated Circuit 有权
    支持直接耦合到集成电路的光源组件的方法和系统

    公开(公告)号:US20120205524A1

    公开(公告)日:2012-08-16

    申请号:US13455641

    申请日:2012-04-25

    IPC分类号: H01L31/16

    摘要: Methods and systems for a light source assembly for coupling to a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The light source assembly may comprise a laser, a microlens, a turning mirror, and an optical bench, and may generate an optical signal utilizing the laser, focus the optical signal utilizing the microlens, and reflect the optical signal at an angle defined by the turning mirror. The reflected optical signal may be transmitted out of the assembly to grating couplers in the photonically enabled CMOS chip. The assembly may comprise a non-reciprocal polarization rotator, comprising a latching faraday rotator. The assembly may comprise a reciprocal polarization rotator, which may comprise a half-wave plate comprising birefringent materials operably coupled to the optical bench. The turning mirror may be integrated in the optical bench and may reflect the optical signal to transmit through a lid operably coupled to the optical bench.

    摘要翻译: 公开了用于耦合到光子学互补金属氧化物半导体(CMOS)芯片的光源组件的方法和系统。 光源组件可以包括激光器,微透镜,转向镜和光学台,并且可以使用激光产生光信号,利用微透镜聚焦光信号,并以由 转镜。 反射的光信号可以从组件传输到光子启用的CMOS芯片中的光栅耦合器。 组件可以包括非互易偏振旋转器,包括锁定法拉第旋转器。 组件可以包括互逆偏振旋转器,其可以包括半波片,其包括可操作地耦合到光学平台的双折射材料。 转向镜可以集成在光学台中并且可以反射光学信号以透过可操作地耦合到光学台的盖。

    METHOD AND SYSTEM FOR A LIGHT SOURCE ASSEMBLY SUPPORTING DIRECT COUPLING TO AN INTEGRATED CIRCUIT
    2.
    发明申请
    METHOD AND SYSTEM FOR A LIGHT SOURCE ASSEMBLY SUPPORTING DIRECT COUPLING TO AN INTEGRATED CIRCUIT 有权
    用于轻组件支持直接耦合到集成电路的方法和系统

    公开(公告)号:US20130336664A1

    公开(公告)日:2013-12-19

    申请号:US13894052

    申请日:2013-05-14

    IPC分类号: H04B10/50

    摘要: Methods and systems for a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The CMOS chip may comprise a laser, a microlens, a turning mirror, and an optical bench, and may generate an optical signal utilizing the laser, focus the optical signal utilizing the microlens, and reflect the optical signal at an angle defined by the turning mirror. The reflected optical signal may be transmitted into the photonically enabled CMOS chip, which may comprise a non-reciprocal polarization rotator, comprising a latching faraday rotator. The CMOS chip may comprise a reciprocal polarization rotator, which may comprise a half-wave plate comprising birefringent materials operably coupled to the optical bench. The turning mirror may be integrated in the optical bench and may reflect the optical signal to transmit through a lid operably coupled to the optical bench.

    摘要翻译: 公开了一种用于光子学互补金属氧化物半导体(CMOS)芯片的方法和系统。 CMOS芯片可以包括激光器,微透镜,转向镜和光学台,并且可以使用激光产生光信号,利用微透镜聚焦光信号,并以由转动限定的角度反射光信号 镜子。 反射的光信号可以被传输到光子启用的CMOS芯片,其可以包括非互易偏振旋转器,其包括闭锁法拉第旋转器。 CMOS芯片可以包括互逆偏振旋转器,其可以包括半波片,其包括可操作地耦合到光学平台的双折射材料。 转向镜可以集成在光学台中并且可以反射光学信号以透过可操作地耦合到光学台的盖。

    METHOD AND SYSTEM FOR A LIGHT SOURCE ASSEMBLY SUPPORTING DIRECT COUPLING TO AN INTEGRATED CIRCUIT
    3.
    发明申请
    METHOD AND SYSTEM FOR A LIGHT SOURCE ASSEMBLY SUPPORTING DIRECT COUPLING TO AN INTEGRATED CIRCUIT 有权
    用于轻组件支持直接耦合到集成电路的方法和系统

    公开(公告)号:US20100006784A1

    公开(公告)日:2010-01-14

    申请号:US12500465

    申请日:2009-07-09

    IPC分类号: G02B27/00

    摘要: Methods and systems for a light source assembly supporting direct coupling to a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The assembly may include a laser, a microlens, a turning mirror, reciprocal and/or non-reciprocal polarization rotators, and an optical bench. The laser may generate an optical signal that may be focused utilizing the microlens. The optical signal may be reflected at an angle defined by the turning mirror, and may be transmitted out of the light source assembly to one or more grating couplers in the chip. The laser may include a feedback insensitive laser. The light source assembly may include two electro-thermal interfaces between the optical bench, the laser, and a lid affixed to the optical bench. The turning mirror may be integrated in a lid affixed to the optical bench or may be integrated in the optical bench.

    摘要翻译: 公开了用于支持与光子学互补金属氧化物半导体(CMOS)芯片的直接耦合的光源组件的方法和系统。 组件可以包括激光器,微透镜,转向镜,倒数和/或非倒数偏振旋转器以及光学平台。 激光器可以产生可以利用微透镜聚焦的光信号。 光信号可以以由转向镜定义的角度反射,并且可以从光源组件传输到芯片中的一个或多个光栅耦合器。 激光器可以包括反馈不敏感的激光器。 光源组件可以包括在光学台,激光器和固定到光学台之间的盖子之间的两个电热接口。 转向镜可以集成在固定到光学工作台上的盖中,或者可以集成在光学台中。

    Method and system for a light source assembly supporting direct coupling to an integrated circuit
    4.
    发明授权
    Method and system for a light source assembly supporting direct coupling to an integrated circuit 有权
    支持与集成电路直接耦合的光源组件的方法和系统

    公开(公告)号:US08440989B2

    公开(公告)日:2013-05-14

    申请号:US13455641

    申请日:2012-04-25

    摘要: Methods and systems for a light source assembly for coupling to a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The light source assembly may comprise a laser, a microlens, a turning mirror, and an optical bench, and may generate an optical signal utilizing the laser, focus the optical signal utilizing the microlens, and reflect the optical signal at an angle defined by the turning mirror. The reflected optical signal may be transmitted out of the assembly to grating couplers in the photonically enabled CMOS chip. The assembly may comprise a non-reciprocal polarization rotator, comprising a latching faraday rotator. The assembly may comprise a reciprocal polarization rotator, which may comprise a half-wave plate comprising birefringent materials operably coupled to the optical bench. The turning mirror may be integrated in the optical bench and may reflect the optical signal to transmit through a lid operably coupled to the optical bench.

    摘要翻译: 公开了用于耦合到光子学互补金属氧化物半导体(CMOS)芯片的光源组件的方法和系统。 光源组件可以包括激光器,微透镜,转向镜和光学台,并且可以使用激光产生光信号,利用微透镜聚焦光信号,并以由 转镜。 反射的光信号可以从组件传输到光子启用的CMOS芯片中的光栅耦合器。 组件可以包括非互易偏振旋转器,包括锁定法拉第旋转器。 组件可以包括互逆偏振旋转器,其可以包括半波片,其包括可操作地耦合到光学平台的双折射材料。 转向镜可以集成在光学台中并且可以反射光学信号以透过可操作地耦合到光学台的盖。

    Method and system for a light source assembly supporting direct coupling to an integrated circuit
    5.
    发明授权
    Method and system for a light source assembly supporting direct coupling to an integrated circuit 有权
    支持与集成电路直接耦合的光源组件的方法和系统

    公开(公告)号:US08168939B2

    公开(公告)日:2012-05-01

    申请号:US12500465

    申请日:2009-07-09

    摘要: Methods and systems for a light source assembly supporting direct coupling to a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The assembly may include a laser, a microlens, a turning mirror, reciprocal and/or non-reciprocal polarization rotators, and an optical bench. The laser may generate an optical signal that may be focused utilizing the microlens. The optical signal may be reflected at an angle defined by the turning mirror, and may be transmitted out of the light source assembly to one or more grating couplers in the chip. The laser may include a feedback insensitive laser. The light source assembly may include two electro-thermal interfaces between the optical bench, the laser, and a lid affixed to the optical bench. The turning mirror may be integrated in a lid affixed to the optical bench or may be integrated in the optical bench.

    摘要翻译: 公开了用于支持与光子学互补金属氧化物半导体(CMOS)芯片的直接耦合的光源组件的方法和系统。 组件可以包括激光器,微透镜,转向镜,倒数和/或非倒数偏振旋转器以及光学平台。 激光器可以产生可以利用微透镜聚焦的光信号。 光信号可以以由转向镜定义的角度反射,并且可以从光源组件传输到芯片中的一个或多个光栅耦合器。 激光器可以包括反馈不敏感的激光器。 光源组件可以包括在光学台,激光器和固定到光学台之间的盖子之间的两个电热接口。 转向镜可以集成在固定到光学工作台上的盖中,或者可以集成在光学台中。

    INTEGRATED TRANSCEIVER WITH LIGHTPIPE COUPLER
    8.
    发明申请
    INTEGRATED TRANSCEIVER WITH LIGHTPIPE COUPLER 有权
    集成收发器与LIGHTPIPE耦合器

    公开(公告)号:US20100046955A1

    公开(公告)日:2010-02-25

    申请号:US12483699

    申请日:2009-06-12

    IPC分类号: H04B10/00

    摘要: Systems and methods for configuring an integrated transceiver are disclosed. In one embodiment, very small form factor transceivers can be configured to allow 10G optical interconnects over distances up to 2k km. Transceiver circuitry can be integrated on a single die, and be electrically connected to a transmitter such as a laser-diode and a receiver such as a photo-diode. In one embodiment, the laser and photo diodes can be edge-operating, and be mounted on the die. In one embodiment, one or both of the diodes can be surface-operating so as to allow relaxation of alignment requirement. In one embodiment, one or both of the diodes can be mounted to a submount that is separate from the die so as to facilitate separate assembly and testing. In one embodiment, the diodes can be optically coupled to a ferrule via an optical coupling element so as to manage loss in certain situations.

    摘要翻译: 公开了用于配置集成收发器的系统和方法。 在一个实施例中,非常小的形状因数收发器可被配置为允许距离高达2k公里的10G光学互连。 收发器电路可以集成在单个管芯上,并且电连接到诸如激光二极管的发射器和诸如光电二极管的接收器。 在一个实施例中,激光器和光电二极管可以是边缘操作的,并且被安装在管芯上。 在一个实施例中,一个或两个二极管可以是表面操作的,以便允许放宽对准要求。 在一个实施例中,一个或两个二极管可以安装到与模具分开的子安装座,以便于单独的组装和测试。 在一个实施例中,二极管可以经由光耦合元件光学耦合到套圈,以便在某些情况下管理损耗。

    Integrated transceiver with lightpipe coupler
    9.
    发明授权
    Integrated transceiver with lightpipe coupler 有权
    集成收发器与光管耦合器

    公开(公告)号:US08121447B2

    公开(公告)日:2012-02-21

    申请号:US13156894

    申请日:2011-06-09

    IPC分类号: G02B6/12 G02B6/26 H05K1/18

    摘要: A transceiver comprising a plurality of CMOS chips may be operable to communicate an optical source signal from a semiconductor laser into a first CMOS chip via optical couplers. The optical source signal may be used to generate first optical signals that are transmitted from the first CMOS chip to optical fibers coupled to the first CMOS chip via one or more optical couplers. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the first CMOS chip. The optical source signal may be communicated from the semiconductor laser into the first CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the first CMOS chip. The electrical signals may be communicated to at least a second of the plurality of CMOS chips comprising electronic devices.

    摘要翻译: 包括多个CMOS芯片的收发器可以用于通过光耦合器将来自半导体激光器的光源信号传送到第一CMOS芯片。 光源信号可以用于产生经由一个或多个光耦合器从第一CMOS芯片传输到耦合到第一CMOS芯片的光纤的第一光信号。 可以从光纤接收第二光信号并且经由第一CMOS芯片中的光电探测器转换成电信号。 光源信号可以通过光纤从半导体激光器传送到第一CMOS芯片到顶表面,并且第一光信号可以从第一CMOS芯片的顶表面传出。 电信号可以传送到包括电子设备的多个CMOS芯片中的至少一个。

    INTEGRATED TRANSCEIVER WITH LIGHTPIPE COUPLER
    10.
    发明申请
    INTEGRATED TRANSCEIVER WITH LIGHTPIPE COUPLER 有权
    集成收发器与LIGHTPIPE耦合器

    公开(公告)号:US20110236029A1

    公开(公告)日:2011-09-29

    申请号:US13156979

    申请日:2011-06-09

    IPC分类号: H04B10/12

    摘要: A transceiver comprising a CMOS chip and a laser coupled to the chip may be operable to communicate an optical source signal from a semiconductor laser into the CMOS chip. The optical source signal may be used to generate first optical signals that are transmitted from the CMOS chip to optical fibers coupled to the CMOS chip. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the CMOS chip. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The optical source signal may be communicated into the CMOS chip and the first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers.

    摘要翻译: 包括CMOS芯片和耦合到芯片的激光器的收发器可以用于将来自半导体激光器的光源信号传送到CMOS芯片。 光源信号可以用于产生从CMOS芯片发送到耦合到CMOS芯片的光纤的第一光信号。 可以从光纤接收第二光信号并且经由CMOS芯片中的光电检测器转换成电信号。 光源信号可以通过光纤从半导体激光器传送到CMOS芯片到顶表面,并且第一光信号可以从CMOS芯片的顶表面传出。 光源信号可以被传送到CMOS芯片,并且可以通过可以包括光栅耦合器的光耦合器从CMOS芯片传送第一光信号。