公开(公告)号：US06711859B2

公开(公告)日：2004-03-30

申请号：US09872316

申请日：2001-06-01

申请人： Michael Ray Bell ,  Kechuan Liu

发明人： Michael Ray Bell ,  Kechuan Liu

IPC分类号： E06B300

CPC分类号： H05K5/0008 ,  B65D11/00 ,  B65D2585/86 ,  Y10T403/606

摘要： A system for fixing two components together includes: (a) a boss integrally formed from one component about a boss axis; and (b) a latch integrally formed from the other component in a depending extension facilitating latch movement in an engaging plane and exerting a spring force urging the latch toward a first position. The latch is oriented about a latch axis in the engaging plane. The latch is in the first position when the components are situated in an initial position with the latch axis and the boss axis separated a first distance. The latch axis and the boss axis are separated a second distance less than the first distance when the components are urged together to an installed orientation with the latch held from the first position by the boss bearing against the latch with the engaging plane crossing the boss axis.

摘要翻译： 用于将两个部件固定在一起的系统包括：（a）从一个部件围绕凸台轴线一体地形成的凸台; 和（b）一个从另一个部件以一个垂直的延伸部分一体地形成的闩锁，便于在接合平面中的闩锁运动，并施加一个将闩锁推向第一位置的弹簧力。 闩锁在接合平面中围绕闩锁轴定向。 当部件位于初始位置时闩锁处于第一位置，其中闩锁轴线和凸台轴线分开第一距离。 当将部件一起施加到安装的方向时，闩锁轴线和凸台轴线分开第二距离，其中闩锁件通过凸台轴承从第一位置保持抵靠闩锁，接合平面与凸台轴线交叉 。

公开(公告)号：US20050013120A1

公开(公告)日：2005-01-20

申请号：US10885317

申请日：2004-07-06

申请人： Kechuan Liu

发明人： Kechuan Liu

IPC分类号： H01L23/367 ,  H01L23/40 ,  H05K7/20

CPC分类号： H01L23/3675 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink apparatus for use with electronic components comprises a base frame, a clipping system and a plurality of supporting members. The base frame and the clipping system and the supporting members are of unitary construction. The base frame is configured to have “i” repeatable channels with fins extended from or attached to its outside surfaces. The clipping system comprises a matrix [i, j] set of i×j spring clips. Each spring clip is configured to have partially constrained with the base frame, and to flex about an axis resiliently to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation with the inside walls of the channel. The supporting members are configured to have fixed connection with the base frame and be solderable. The heat sink apparatus's capacity of holding electronic components is scalable to accommodate upgrades and design changes of electronic products.

摘要翻译： 一种用于电子部件的散热装置包括基架，夹紧系统和多个支撑构件。 底架和夹紧系统以及支撑构件是一体的结构。 底架被配置为具有从其外表面延伸或附着的翅片的“i”个可重复通道。 剪辑系统包括一组矩阵[i，j] ixj弹簧夹。 每个弹簧夹被构造成部分地与基部框架约束，并且围绕轴线弹性地弯曲以实现接合关系，以基本上固定地将电子部件保持与通道的内壁邻接。 支撑构件被构造成与基架具有固定连接并且是可焊接的。 散热装置的电子元件的容纳能力是可扩展的，以适应电子产品的升级和设计变更。

公开(公告)号：US20080019095A1

公开(公告)日：2008-01-24

申请号：US11492180

申请日：2006-07-24

申请人： Kechuan Liu

发明人： Kechuan Liu

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink apparatus for use with electronic components comprises a base portion and at least a securing portion. The base portion and the securing portion are of unitary construction. The base portion is configured to have at least one receiving aperture and one heat-conducting surface with fins extended from or attached to its opposite surface. The securing portion is a unitary construction which comprises a cam element and spring clip with auto-align and camming mechanism features. The securing portion is configured to have partially constrained with the base portion, and to be slide along the length direction for dynamic location of electronic device on heat sink. The cam element can be rotated about its cylindrical feature axis resiliently to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation with heat-conducting surface.

摘要翻译： 用于电子部件的散热装置包括基部和至少一固定部。 基部和固定部分是一体的结构。 基部构造成具有至少一个接收孔和一个具有从其相对表面延伸或连接到其相对表面的翅片的导热表面。 固定部分是一体的结构，其包括具有自动对准和凸轮机构特征的凸轮元件和弹簧夹。 固定部被构造成部分地被基部约束，并且沿着长度方向滑动以使电子设备在散热器上的动态定位。 凸轮元件可以围绕其圆柱形特征轴线弹性地旋转以实现接合关系，以基本上固定地将电子部件保持与导热表面邻接。

公开(公告)号：US06769150B1

公开(公告)日：2004-08-03

申请号：US10053469

申请日：2001-11-07

申请人： Kechuan Liu ,  Shawn Legas

发明人： Kechuan Liu ,  Shawn Legas

IPC分类号： A46B1300

CPC分类号： B08B1/00 ,  B08B1/04 ,  B08B2240/02 ,  G02B6/3807

摘要： An optical connector cleaning device for cleaning a ferrule end surface of an optical or fiberoptic connector is described. The device includes a cleaning rod, a drive mechanism, and a cleaning media, such as a swab, a brush, a pad, or a foam, connected to an end of the cleaning rod and having a thickness past the end of the cleaning rod of at least about 0.125 inches. A mating connector housing the cleaning rod may be provided for connecting with the optical connector. The drive mechanism may be housed in a handheld body or may be mounted on a dummy card connector physically compatible with a slot in a card-cage. The dummy card connector may include an adjustable frame which can be adjusted to modify card size in order for the same dummy card connector to be physically compatible with more than one physical slot configuration.

摘要翻译： 描述了用于清洁光学或光纤连接器的套圈端面的光学连接器清洁装置。 该装置包括清洁杆，驱动机构和清洁介质，例如拭子，刷子，垫或泡沫，连接到清洁杆的端部并具有穿过清洁杆的端部的厚度 至少约0.125英寸。 可以提供容纳清洁杆的配合连接器，用于与光学连接器连接。 驱动机构可以容纳在手持式主体中，或者可以安装在物理上与卡笼中的狭槽物理上相适应的虚拟卡连接器上。 虚拟卡连接器可以包括可调整的框架，其可以被调节以修改卡尺寸，以便相同的虚拟卡连接器在物理上与多于一个的物理槽配置兼容。

公开(公告)号：US20050225945A1

公开(公告)日：2005-10-13

申请号：US11099378

申请日：2005-04-05

申请人： Kechuan Liu

发明人： Kechuan Liu

IPC分类号： H01L23/40 ,  H05K7/20

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink apparatus for use with electronic components comprises a base member and an integral spring clip. The base member and the integral spring clip(s) are of unitary construction. The base member is configured to have at least one receiving aperture and one heat-conducting surface with fins extended from or attached to its opposite surface. The integral spring clip comprises solderable elements, i.e. leads and surfaces, and auto-align mechanism feature. The integral spring clip is configured to have fully constrained with the base member, and to flex about an axis resiliently to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation with heat-conducting surface. The heat sink apparatus can be mounted onto a print circuit or wiring board via either through-hole or surface mounting technology to meet the circuit design and space requirements.

摘要翻译： 用于电子部件的散热装置包括基座部件和一体的弹簧夹。 基座构件和一体式弹簧夹具有一体式结构。 基部构件被构造成具有至少一个接收孔和一个具有从其相对表面延伸或附接到其相对表面的翅片的导热表面。 一体的弹簧夹包括可焊接元件，即引线和表面，以及自动对准机构特征。 整体弹簧夹被构造成完全受到基部构件的约束，并且围绕轴线弹性地弯曲以实现接合关系，以基本上固定地保持电子部件与导热表面的邻接关系。 散热装置可以通过通孔或表面安装技术安装到打印电路或布线板上，以满足电路设计和空间要求。

公开(公告)号：US06262893B1

公开(公告)日：2001-07-17

申请号：US09449048

申请日：1999-11-24

申请人： Kechuan Liu

发明人： Kechuan Liu

IPC分类号： H05K720

CPC分类号： H01L23/3672 ,  H01L23/4093 ,  H01L2924/0002 ,  Y10T24/307 ,  H01L2924/00

摘要： An improved heat sink apparatus for use with an electronic component comprises a base portion and a securing portion. The base portion and the securing portion are of unitary construction. The securing portion is configured to flex about an axis to effect an engaged relation with the base portion at a locus distal from the axis. The base portion and the securing portion cooperate in the engaged relation to substantially fixedly maintain the electronic component in abutting relation with the base portion.

摘要翻译： 用于电子部件的改进的散热装置包括基部和固定部。 基部和固定部分是一体的结构。 固定部分构造成围绕轴线弯曲以在远离轴线的位置处实现与基部接合的关系。 底座部分和固定部分以啮合的关系相配合，以将电子部件基本上固定地保持与基部相邻的关系。