Multi-layer printed circuit board
    1.
    发明授权
    Multi-layer printed circuit board 失效
    多层印刷电路板

    公开(公告)号:US4928061A

    公开(公告)日:1990-05-22

    申请号:US330293

    申请日:1989-03-29

    摘要: A printed circuit board especially for use in device testing apparatus is provided. The circuit board includes a plurality of stacked layers of dielectric or insulating material with each of the layers having coated on one surface thereof a layer of conducting material defining a plane. The conducting material extends to at least one outer edge of the stack of the material for each plane and at each plane it is spaced with respect to the outer edge locations of all of the other planes. A plurality of lands extend vertically along the stack of material, each land while extending the entire length, only contacting the plane of conducting material extending to the edge at the location of the land whereby a signal applied to any given land is conducted only on the planes where that plane extends to the surface. The configuration for a testing device preferably is an annular configuration and the planes of conducting material extend to both the inner and outer surfaces and signals are applied to the outer surface from an external source and delivered to the test piece from the inner surface.