Systems for integrated pump and cold plate
    2.
    发明授权
    Systems for integrated pump and cold plate 失效
    集成泵和冷板系统

    公开(公告)号:US07124811B2

    公开(公告)日:2006-10-24

    申请号:US11026167

    申请日:2004-12-31

    IPC分类号: H05K7/20

    摘要: According to some embodiments, systems for an integrated pump and cold plate may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, and a cold plate disposed at least partially within the housing. In some embodiments, the pump may also or alternatively comprise a motor to power the impeller, wherein the motor comprises a rotor and at least two magnets disposed within the housing and at least two electromagnetic coils disposed outside of the housing.

    摘要翻译: 根据一些实施例,可以提供用于集成泵和冷板的系统。 在一些实施例中,泵可以包括限定入口以接收流体的外壳和排出流体的出口,设置在壳体内的叶轮,其中叶轮将流体朝向出口移动,电动机为叶轮供电 ,以及至少部分地设置在壳体内的冷板。 在一些实施例中,泵还可以或者可选地包括用于为叶轮供电的马达,其中马达包括转子和设置在壳体内的至少两个磁体和布置在壳体外部的至少两个电磁线圈。

    Systems for integrated pump and reservoir
    3.
    发明授权
    Systems for integrated pump and reservoir 有权
    集成泵和水库系统

    公开(公告)号:US07543457B2

    公开(公告)日:2009-06-09

    申请号:US11170427

    申请日:2005-06-29

    IPC分类号: F25D23/02

    摘要: According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, a reservoir hydraulically coupled to the inlet, and a cold plate disposed at least partially within the housing.

    摘要翻译: 根据一些实施例,可以提供用于集成泵和储存器的系统。 在一些实施例中,泵可以包括限定入口以接收流体的外壳和排出流体的出口,设置在壳体内的叶轮,其中叶轮将流体朝向出口移动,电动机为叶轮供电 液压耦合到入口的储液器,以及至少部分地设置在壳体内的冷板。

    Radial heat sink with helical shaped fins
    7.
    发明授权
    Radial heat sink with helical shaped fins 失效
    带有螺旋形翅片的径向散热片

    公开(公告)号:US06886627B2

    公开(公告)日:2005-05-03

    申请号:US10608056

    申请日:2003-06-27

    IPC分类号: H01L23/467 H05K7/20

    摘要: An electronic assembly includes an integrated circuit (e.g., a processor) mounted on a substrate (e.g., a motherboard), and a radial heat sink thermally coupled to the integrated circuit. The radial heat sink includes a core having an outer surface, and a plurality of helical fins that extend from the outer surface of the core. The electronic assembly may include a fan positioned near the heat sink. The appropriate angle for the helical fins relative to the longitudinal axis of the heat sink depends in part on the direction of the airflow that is produced by the fan.

    摘要翻译: 电子组件包括安装在基板(例如,母板)上的集成电路(例如,处理器)和热耦合到集成电路的径向散热器。 径向散热器包括具有外表面的芯和从芯的外表面延伸的多个螺旋翅片。 电子组件可以包括位于散热器附近的风扇。 螺旋翅片相对于散热器的纵向轴线的适当角度部分地取决于由风扇产生的气流的方向。

    Electronic assemblies with high capacity heat sinks and methods of manufacture
    8.
    发明授权
    Electronic assemblies with high capacity heat sinks and methods of manufacture 有权
    具有高容量散热器的电子组件和制造方法

    公开(公告)号:US07200934B2

    公开(公告)日:2007-04-10

    申请号:US10656968

    申请日:2003-09-05

    IPC分类号: B21D53/02 H05K7/20 H01L23/34

    摘要: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

    摘要翻译: 包括一个或多个高性能集成电路的电子组件包括至少一个高容量散热器。 散热器包括从芯部大体上径向突出的多个翅片,其被构造成从风扇捕获空气并引导空气以优化从散热器的热传递。 散热片可以形成为不同的形状。 在一个实施例中,翅片是弯曲的。 在另一个实施例中,翅片弯曲。 在另一个实施例中,翅片弯曲并弯曲。 还描述了制造散热器和电子组件的方法,以及将散热器应用于电子组件和电子系统。

    Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
    10.
    发明授权
    Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods 有权
    具有高容量弯曲和弯曲翅片散热器的电子组件及相关方法

    公开(公告)号:US07911790B2

    公开(公告)日:2011-03-22

    申请号:US11209414

    申请日:2005-08-23

    IPC分类号: H05K7/20 F28F7/00 H01L23/34

    摘要: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

    摘要翻译: 包括一个或多个高性能集成电路的电子组件包括至少一个高容量散热器。 散热器包括从芯部大体上径向突出的多个翅片,其被构造成从风扇捕获空气并引导空气以优化从散热器的热传递。 散热片可以形成为不同的形状。 在一个实施例中,翅片是弯曲的。 在另一个实施例中,翅片弯曲。 在另一个实施例中,翅片弯曲并弯曲。 还描述了制造散热器和电子组件的方法,以及将散热器应用于电子组件和电子系统。