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42 条记录 (耗时 0.026 秒)

    Method and system of advanced fan speed control
    3.
    发明申请
    Method and system of advanced fan speed control 有权

    公开(公告)号：US20090228148A1

    公开(公告)日：2009-09-10

    申请号：US12378559

    申请日：2009-02-17

    申请人： Tod A. Byquist ,  Michael T. Crocker

    发明人： Tod A. Byquist ,  Michael T. Crocker

    IPC分类号： G05B15/00 ,  G05D23/00 ,  F28F13/12

    CPC分类号： G01K1/026 ,  G01K7/42

    摘要： According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.

    Systems for integrated pump and reservoir
    4.
    发明授权
    Systems for integrated pump and reservoir 有权
    集成泵和水库系统

    公开(公告)号：US07543457B2

    公开(公告)日：2009-06-09

    申请号：US11170427

    申请日：2005-06-29

    申请人： Michael T. Crocker ,  Daniel P. Carter ,  Kazimierz L. Kozyra

    发明人： Michael T. Crocker ,  Daniel P. Carter ,  Kazimierz L. Kozyra

    IPC分类号： F25D23/02

    CPC分类号： H01L23/473 ,  F04D29/588 ,  H01L2924/0002 ,  H01L2924/00

    摘要： According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, a reservoir hydraulically coupled to the inlet, and a cold plate disposed at least partially within the housing.

    摘要翻译： 根据一些实施例，可以提供用于集成泵和储存器的系统。 在一些实施例中，泵可以包括限定入口以接收流体的外壳和排出流体的出口，设置在壳体内的叶轮，其中叶轮将流体朝向出口移动，电动机为叶轮供电 液压耦合到入口的储液器，以及至少部分地设置在壳体内的冷板。

    Electronic assemblies with high capacity heat sinks and methods of manufacture
    5.
    发明授权
    Electronic assemblies with high capacity heat sinks and methods of manufacture 有权
    具有高容量散热器的电子组件和制造方法

    公开(公告)号：US07200934B2

    公开(公告)日：2007-04-10

    申请号：US10656968

    申请日：2003-09-05

    申请人： Daniel P. Carter ,  Michael T. Crocker ,  Ben M. Broili ,  Tod A. Byquist ,  David J. Llapitan

    发明人： Daniel P. Carter ,  Michael T. Crocker ,  Ben M. Broili ,  Tod A. Byquist ,  David J. Llapitan

    IPC分类号： B21D53/02 ,  H05K7/20 ,  H01L23/34

    CPC分类号： H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

    摘要翻译： 包括一个或多个高性能集成电路的电子组件包括至少一个高容量散热器。 散热器包括从芯部大体上径向突出的多个翅片，其被构造成从风扇捕获空气并引导空气以优化从散热器的热传递。 散热片可以形成为不同的形状。 在一个实施例中，翅片是弯曲的。 在另一个实施例中，翅片弯曲。 在另一个实施例中，翅片弯曲并弯曲。 还描述了制造散热器和电子组件的方法，以及将散热器应用于电子组件和电子系统。

    Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
    8.
    发明授权
    Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods 有权
    具有高容量弯曲和弯曲翅片散热器的电子组件及相关方法

    公开(公告)号：US07911790B2

    公开(公告)日：2011-03-22

    申请号：US11209414

    申请日：2005-08-23

    申请人： Daniel P. Carter ,  Michael T. Crocker

    发明人： Daniel P. Carter ,  Michael T. Crocker

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

    摘要翻译： 包括一个或多个高性能集成电路的电子组件包括至少一个高容量散热器。 散热器包括从芯部大体上径向突出的多个翅片，其被构造成从风扇捕获空气并引导空气以优化从散热器的热传递。 散热片可以形成为不同的形状。 在一个实施例中，翅片是弯曲的。 在另一个实施例中，翅片弯曲。 在另一个实施例中，翅片弯曲并弯曲。 还描述了制造散热器和电子组件的方法，以及将散热器应用于电子组件和电子系统。

    CHAMBER SEALING VALVE
    9.
    发明申请
    CHAMBER SEALING VALVE 有权
    室密封阀

    公开(公告)号：US20080282775A1

    公开(公告)日：2008-11-20

    申请号：US12180733

    申请日：2008-07-28

    申请人： Russell S. Aoki ,  Michael T. Crocker ,  Daniel P. Carter

    发明人： Russell S. Aoki ,  Michael T. Crocker ,  Daniel P. Carter

    IPC分类号： G01M3/32 ,  F16K1/44

    CPC分类号： H05K7/20272 ,  G01M3/228 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： According to some embodiments, a test fluid may be provided into a chamber associated with a cooling system for an electronic integrated circuit. Moreover, a valve may be partially inserted into an opening of the chamber to seal the chamber. The valve may include a first sealing portion to seal the chamber at the opening when the valve shaft is inserted the first distance. The valve may then be inserted an intermediate distance, between the first distance and a second distance, to unseal the chamber. Note that the valve may include a second sealing portion, offset from the first sealing portion, to seal the chamber at the opening when the valve is inserted the second distance. The valve may further define a passage, between the first and second sealing portions, to permit a flow of the test fluid when the valve is inserted the intermediate distance.

    摘要翻译： 根据一些实施例，可以将测试流体提供到与用于电子集成电路的冷却系统相关联的室中。 此外，阀可以部分地插入到腔室的开口中以密封腔室。 阀可以包括第一密封部分，以在阀轴插入第一距离时将腔室密封在开口处。 然后，阀可以在第一距离和第二距离之间插入中间距离以开启腔室。 注意，阀可以包括从第一密封部分偏移的第二密封部分，以在阀插入第二距离时将腔室密封在开口处。 阀可以进一步限定在第一和第二密封部分之间的通道，以允许当阀插入中间距离时测试流体的流动。