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公开(公告)号：US20070188991A1
公开(公告)日：2007-08-16
申请号：US11637633
申请日：2006-12-12
申请人： Michael Wilson , Jonathan Wattelet , Donald Lightner , Richard DeKeuster , Ernest Dubble , Gregg Baldassarre
发明人： Michael Wilson , Jonathan Wattelet , Donald Lightner , Richard DeKeuster , Ernest Dubble , Gregg Baldassarre
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.
摘要翻译： 一种用于冷却电子部件的系统，其具有安装在其上的具有一个或多个电子部件的表面，包括集成电路。 位于与集成电路上方接触关系的液冷式热交换器。 耦合到表面的弹性冷板被液体冷却的热交换器的一部分偏压，从而提供液体冷却的热交换器，集成电路和弹性冷板之间的强制接合。
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公开(公告)号：US20060050483A1
公开(公告)日：2006-03-09
申请号：US11220456
申请日：2005-09-07
申请人： Michael Wilson , Jonathan Wattelet , Donald Lightner , Richard DeKeuster , Ernest Dubble , Gregg Baldassarre
发明人： Michael Wilson , Jonathan Wattelet , Donald Lightner , Richard DeKeuster , Ernest Dubble , Gregg Baldassarre
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.
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公开(公告)号：US20070103867A1
公开(公告)日：2007-05-10
申请号：US11266812
申请日：2005-11-05
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： A cooling system is provided for supplying a coolant flow to a cold plate associated with a processing chip of an electronic device to cool the processing chip. The system includes an electric motor driven fan; a radiator; an accumulator tank connected to the radiator for the transfer of coolant between the accumulator and the radiator; an electric driven pump connected to at least one of the radiator, the accumulator, and the cold plate to provide the coolant flow through the radiator and the cold plate; and a fan shroud adapted to direct the airflow provided by the fan. The fan, the radiator, the accumulator tank, and the pump are mounted on the shroud to be carried thereby, and the pump is located on an exterior side of the of the fan shroud and outside of the radiator and the accumulator tank.
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公开(公告)号：US20050133212A1
公开(公告)日：2005-06-23
申请号：US10739759
申请日：2003-12-18
IPC分类号： F25B39/02 , F28D9/00 , F28D15/02 , F28F3/00 , F28F3/02 , F28F3/08 , F28F9/22 , F28F9/24 , H01L23/473 , H05K7/20
CPC分类号： F28F3/025 , F28D15/0266 , F28F3/086 , F28F3/12 , F28F2250/102 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a first portion of the through-bores within the block, and a plurality of passageways are formed by an alignment of a second portion of the through-bores within the stack such that at least one of the passageways is arranged in fluid communication with at least two of the chambers. A baffle-plate is disposed within a portion of the stack so as to form a chamber boundary and thereby to define a circuitous fluid flow path between the chambers through the at least one passageway. A fluid entrance port is defined in a first outer one of the plates and arranged in fluid communication with one of the chambers, and a fluid exit port is also defined in a second outer one of the plates and arranged in fluid communication with another one of the chambers.
摘要翻译： 提供一种用于冷却发热装置的热交换器，其包括多个板，每个板限定至少一个通孔。 板被层压在一起以形成堆叠，使得通过在块内的通孔的第一部分的对准来形成多个封闭的室，并且通过对准第二部分的通孔，形成多个通道 在堆叠内的通孔，使得至少一个通道布置成与至少两个室流体连通。 挡板设置在堆叠的一部分内，以形成室边界，从而限定通过至少一个通道的室之间的迂回流体流动路径。 流体入口端口被限定在第一外板中的一个，并且布置成与其中一个腔室流体连通，并且流体出口还限定在第二外板中，并且布置成与另一个中的另一个流体连通 房间。
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公开(公告)号：US07414844B2
公开(公告)日：2008-08-19
申请号：US11637633
申请日：2006-12-12
申请人： Michael J. Wilson , Jonathan Wattelet , Donald Lightner , Richard DeKeuster , Ernest H. Dubble , Gregg J. Baldassarre
发明人： Michael J. Wilson , Jonathan Wattelet , Donald Lightner , Richard DeKeuster , Ernest H. Dubble , Gregg J. Baldassarre
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.
摘要翻译： 一种用于冷却电子部件的系统，其具有安装在其上的具有一个或多个电子部件的表面，包括集成电路。 位于与集成电路上方接触关系的液冷式热交换器。 耦合到表面的弹性冷板被液体冷却的热交换器的一部分偏压，从而提供液体冷却的热交换器，集成电路和弹性冷板之间的强制接合。
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公开(公告)号：US07149087B2
公开(公告)日：2006-12-12
申请号：US11220456
申请日：2005-09-07
申请人： Michael J. Wilson , Jonathan Wattelet , Donald Lightner , Richard DeKeuster , Ernest H. Dubble , Gregg J. Baldassarre
发明人： Michael J. Wilson , Jonathan Wattelet , Donald Lightner , Richard DeKeuster , Ernest H. Dubble , Gregg J. Baldassarre
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.
摘要翻译： 一种用于冷却电子部件的系统，其具有安装在其上的具有一个或多个电子部件的表面，包括集成电路。 位于与集成电路上方接触关系的液冷式热交换器。 耦合到表面的弹性冷板被液体冷却的热交换器的一部分偏压，从而提供液体冷却的热交换器，集成电路和弹性冷板之间的强制接合。
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公开(公告)号：US07017655B2
公开(公告)日：2006-03-28
申请号：US10739759
申请日：2003-12-18
CPC分类号： F28F3/025 , F28D15/0266 , F28F3/086 , F28F3/12 , F28F2250/102 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a first portion of the through-bores within the block, and a plurality of passageways are formed by an alignment of a second portion of the through-bores within the stack such that at least one of the passageways is arranged in fluid communication with at least two of the chambers. A baffle-plate is disposed within a portion of the stack so as to form a chamber boundary and thereby to define a circuitous fluid flow path between the chambers through the at least one passageway. A fluid entrance port is defined in a first outer one of the plates and arranged in fluid communication with one of the chambers, and a fluid exit port is also defined in a second outer one of the plates and arranged in fluid communication with another one of the chambers.
摘要翻译： 提供一种用于冷却发热装置的热交换器，其包括多个板，每个板限定至少一个通孔。 板被层压在一起以形成堆叠，使得通过在块内的通孔的第一部分的对准来形成多个封闭的室，并且通过对准第二部分的通孔，形成多个通道 在堆叠内的通孔，使得至少一个通道布置成与至少两个室流体连通。 挡板设置在堆叠的一部分内，以形成室边界，从而限定通过至少一个通道的室之间的迂回流体流动路径。 流体入口端口被限定在第一外板中的一个，并且布置成与其中一个腔室流体连通，并且流体出口还限定在第二外板中，并且布置成与另一个中的另一个流体连通 房间。
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