公开(公告)号：US20040182716A1

公开(公告)日：2004-09-23

申请号：US10724515

申请日：2003-11-26

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen ,  Dennis R. Smalley

IPC: C25D005/02

CPC classification number: B81C1/00126 ,  B33Y10/00 ,  B81C2201/019

Abstract: Treatment of substrates, formation of structures, and formation of multilayer structures using contact masks are disclosed where a non-parallel or non-simultaneous mating of various mask contact surfaces to a substrate surface occurs. Some embodiments involve bringing a relative planar mask contact surface and a relative planar substrate surface together at a small angle (but larger than an alignment tolerance associated with the system). Some embodiments involve flexing a mask to make it non-planar and bringing it into contact with a substrate such that progressively more contact between the mask and substrate occur until complete mating is achieved. Some embodiments involve use of gas or liquid pressure to bow a flexible or semi-flexible mask and use a linear actuator to bring the mating surfaces together and to bring the mask into a more planar configuration.

Abstract translation: 公开了基板的处理，结构的形成和使用接触掩模的多层结构的形成，其中发生各种掩模接触表面与基板表面的非平行或非同时的配合。 一些实施例涉及将相对平面的掩模接触表面和相对平面的基板表面以小角度（但大于与系统相关联的对准公差）组合在一起。 一些实施例涉及弯曲掩模以使其非平面并使其与基底接触，使得在掩模和基底之间逐渐更多的接触发生直到完成配合。 一些实施例涉及使用气体或液体压力来弯曲柔性或半柔性掩模，并且使用线性致动器将配合表面合在一起并使掩模进入更平面的构型。

公开(公告)号：US20040147124A1

公开(公告)日：2004-07-29

申请号：US10724513

申请日：2003-11-26

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen ,  Dennis R. Smalley

IPC: H01L021/302 ,  H01L021/461

CPC classification number: B81C1/00182 ,  B33Y10/00

Abstract: Electrochemical Fabrication techniques are used to modify substrates or to form multilayer structures (e.g. components or devices) from a plurality of overlaying and adhered layers. Masks are used to selectively etch or deposit material. Some masks may be of the contact type and may be formed of multiple materials some of which may be support materials, some of which may be mating materials for contacting a substrate and some may be intermediate materials. In some embodiments the contact masks may have conformable contact surfaces (i.e. surfaces with sufficient flexibility or deformability that they can substantially conform to surface of the substrate to form a seal with it) or they may have semi-rigid or even rigid surfaces. In embodiments where masks are used for selective deposition operations, etching operations may be performed after deposition to remove flash deposits (thin undesired deposits from areas that were intended to be masked).

Abstract translation: 电化学制造技术用于修饰衬底或从多个覆盖和粘附层形成多层结构（例如组件或器件）。 掩模用于选择性地蚀刻或沉积材料。 一些掩模可以是接触型并且可以由多种材料形成，其中一些可以是支撑材料，其中一些可以是用于接触基底的配合材料，一些可以是中间材料。 在一些实施例中，接触掩模可以具有适形的接触表面（即具有足够的柔性或可变形性的表面，使得它们可以基本上符合基底的表面以与其形成密封），或者它们可以具有半刚性或甚至刚性的表面。 在掩模用于选择性沉积操作的实施例中，可以在沉积之后执行蚀刻操作以去除闪蒸沉积物（来自旨在被掩蔽的区域的不希望的沉积物）。

公开(公告)号：US20040134788A1

公开(公告)日：2004-07-15

申请号：US10677498

申请日：2003-10-01

Applicant: Microfabrica Inc.

Inventor： Adam L. Cohen ,  Dennis R. Smalley ,  Gang Zhang

IPC: C25D005/02 ,  C25D005/48

CPC classification number: C25D5/022 ,  B33Y10/00 ,  C25D1/08 ,  C25D5/10

Abstract: Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obtained via a blanket deposition and a selective removal of material via a multi-cell mask. Individual cells of the mask may contain electrodes comprising depositable material or electrodes capable of receiving etched material from a substrate. Alternatively, individual cells may include passages that allow or inhibit ion flow between a substrate and an external electrode and that include electrodes or other control elements that can be used to selectively allow or inhibit ion flow and thus inhibit significant deposition or etching. Single cell masks having a cell size that is smaller or equal to the desired deposition resolution may also be used to form structures.

Abstract translation: 多层结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 沉积的选择性通过多单元可控掩模获得。 或者，通过覆盖沉积和通过多细胞掩模选择性去除材料获得净选择性沉积。 掩模的各个单元可以包含包含可沉积材料的电极或能够从基底接受蚀刻材料的电极。 或者，单个电池可以包括允许或抑制衬底和外部电极之间的离子流动并且包括电极或其它控制元件的通道，其可以用于选择性地允许或抑制离子流动，从而抑制显着的沉积或蚀刻。 具有小于或等于所需沉积分辨率的单元尺寸的单细胞掩模也可用于形成结构。