公开(公告)号：US20240074110A1

公开(公告)日：2024-02-29

申请号：US18239427

申请日：2023-08-29

Applicant: Micron Technology, Inc.

Inventor： Shiva Pahwa ,  Abhiash Ramamurthy Nag ,  Suresh Reddy Yarragunta

IPC: H05K7/20 ,  F28F3/04 ,  G06F1/20

CPC classification number: H05K7/20336 ,  F28F3/048 ,  G06F1/20 ,  H05K7/20409

Abstract: Example embodiments are directed to an input/output (IO) bracket that may be used in a solid-state drive (SSD), the IO bracket comprises a faceplate and at least one heat pipe coupled to the faceplate that extends horizontally from a surface of the faceplate. The at least one heat pipe is configured to be coupled to a controller of the SSD in order to transfer heat from the controller out of the SSD. By coupling the controller to the heat pipe instead of a main heatsink, the main heatsink can efficiently dissipate heat from remaining components of the SSD.