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公开(公告)号:US11856766B2
公开(公告)日:2023-12-26
申请号:US17391377
申请日:2021-08-02
Applicant: Micron Technology, Inc.
Inventor: Venkatakrishnan Sriraman , Dae Hong Eom , Ramanathan Gandhi , Donghua Li , Ashok Kumar Muthukumaran
IPC: H10B43/27 , H10B41/27 , H01L29/788 , H01L29/792 , H01L29/66
CPC classification number: H10B41/27 , H01L29/66825 , H01L29/66833 , H01L29/788 , H01L29/792 , H10B43/27
Abstract: A memory cell comprises channel material, charge-passage material, programmable material, a charge-blocking region, and a control gate. The programmable material comprises at least two regions comprising SiNx having a region comprising SiOy therebetween, where “x” is 0.5 to 3.0 and “y” is 1.0 to 3.0. Methods are disclosed.
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公开(公告)号:US12133383B2
公开(公告)日:2024-10-29
申请号:US18506889
申请日:2023-11-10
Applicant: Micron Technology, Inc.
Inventor: Venkatakrishnan Sriraman , Dae Hong Eom , Ramanathan Gandhi , Donghua Li , Ashok Kumar Muthukumaran
IPC: H01L29/788 , H01L29/66 , H01L29/792 , H10B41/27 , H10B43/27
CPC classification number: H10B41/27 , H01L29/66825 , H01L29/66833 , H01L29/788 , H01L29/792 , H10B43/27
Abstract: A memory cell comprises channel material, charge-passage material, programmable material, a charge-blocking region, and a control gate. The programmable material comprises at least two regions comprising SiNx having a region comprising SiOy therebetween, where “x” is 0.5 to 3.0 and “y” is 1.0 to 3.0. Methods are disclosed.
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公开(公告)号:US20240081053A1
公开(公告)日:2024-03-07
申请号:US18506889
申请日:2023-11-10
Applicant: Micron Technology, Inc.
Inventor: Venkatakrishnan Sriraman , Dae Hong Eom , Ramanathan Gandhi , Donghua Li , Ashok Kumar Muthukumaran
IPC: H10B41/27 , H01L29/66 , H01L29/788 , H01L29/792 , H10B43/27
CPC classification number: H10B41/27 , H01L29/66825 , H01L29/66833 , H01L29/788 , H01L29/792 , H10B43/27
Abstract: A memory cell comprises channel material, charge-passage material, programmable material, a charge-blocking region, and a control gate. The programmable material comprises at least two regions comprising SiNx having a region comprising SiOy therebetween, where “x” is 0.5 to 3.0 and “y” is 1.0 to 3.0. Methods are disclosed.
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公开(公告)号:US20230031891A1
公开(公告)日:2023-02-02
申请号:US17391377
申请日:2021-08-02
Applicant: Micron Technology, Inc.
Inventor: Venkatakrishnan Sriraman , Dae Hong Eom , Ramanathan Gandhi , Donghua Li , Ashok Kumar Muthukumaran
IPC: H01L27/11556 , H01L29/788 , H01L29/66 , H01L27/11582 , H01L29/792
Abstract: A memory cell comprises channel material, charge-passage material, programmable material, a charge-blocking region, and a control gate. The programmable material comprises at least two regions comprising SiNx having a region comprising SiOy therebetween, where “x” is 0.5 to 3.0 and “y” is 1.0 to 3.0. Methods are disclosed.
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