公开(公告)号：US10276539B1

公开(公告)日：2019-04-30

申请号：US15797900

申请日：2017-10-30

Applicant: Micron Technology, Inc.

Inventor： Brandon P. Wirz ,  Benjamin L. McClain ,  C. Alexander Ernst ,  Jeremy E. Minnich

IPC: H01L23/00

Abstract: A semiconductor device, semiconductor device assembly, and method of forming a semiconductor device assembly that includes a barrier on a pillar. The semiconductor device assembly includes a semiconductor device disposed over another semiconductor device. At least one pillar extends from one semiconductor device towards a pad on the other semiconductor device. The barrier on the exterior of the pillar may be a standoff to control a bond line between the semiconductor devices. The barrier may reduce solder bridging and may prevent reliability and electromigration issues that can result from the IMC formation between the solder and copper portions of a pillar. The barrier may help align the pillar with a pad when forming a semiconductor device assembly and may reduce misalignment due to lateral movement of the semiconductor devices. Windows or slots in the barrier may permit the expansion of solder in predetermined directions while preventing bridging in other directions.

公开(公告)号：US20190131272A1

公开(公告)日：2019-05-02

申请号：US15797900

申请日：2017-10-30

Applicant: Micron Technology, Inc.

Inventor： Brandon P. Wirz ,  Benjamin L. McClain ,  C. Alexander Ernst ,  Jeremy E. Minnich

IPC: H01L23/00

Abstract: A semiconductor device, semiconductor device assembly, and method of forming a semiconductor device assembly that includes a barrier on a pillar. The semiconductor device assembly includes a semiconductor device disposed over another semiconductor device. At least one pillar extends from one semiconductor device towards a pad on the other semiconductor device. The barrier on the exterior of the pillar may be a standoff to control a bond line between the semiconductor devices. The barrier may reduce solder bridging and may prevent reliability and electromigration issues that can result from the IMC formation between the solder and copper portions of a pillar. The barrier may help align the pillar with a pad when forming a semiconductor device assembly and may reduce misalignment due to lateral movement of the semiconductor devices. Windows or slots in the barrier may permit the expansion of solder in predetermined directions while preventing bridging in other directions.