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    METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
    2.
    发明申请
    METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES 审中-公开

    公开(公告)号：US20200211999A1

    公开(公告)日：2020-07-02

    申请号：US16236250

    申请日：2018-12-28

    Applicant: Micron Technology, Inc.

    Inventor： Wei Zhou ,  Bret K. Street ,  Benjamin L. McClain ,  Mark E. Tuttle

    IPC: H01L23/00 ,  H01L23/48

    Abstract: A thermocompression bonding (TCB) apparatus can include a wall having a height measured in a first direction and configured to be positioned between a first pressing surface and a second pressing surface of a semiconductor bonding apparatus. The apparatus can include a cavity at least partially surrounded by the wall, the cavity sized to receive a semiconductor substrate and a stack of semiconductor dies positioned between the semiconductor substrate and the first pressing surface, the stack of semiconductor dies and semiconductor substrate having a combined unpressed stack height as measured in the first direction. In some embodiments, the unpressed stack height is greater than the height of the wall, and the wall is configured to be contacted by the first pressing surface to limit movement of the first pressing surface toward the second pressing surface during a semiconductor bonding process.

    Cold fluid semiconductor device release during pick and place operations, and associated systems and methods
    3.
    发明授权
    Cold fluid semiconductor device release during pick and place operations, and associated systems and methods 有权

    公开(公告)号：US10090177B1

    公开(公告)日：2018-10-02

    申请号：US15687015

    申请日：2017-08-25

    Applicant: Micron Technology, Inc.

    Inventor： Jeremy E. Minnich ,  Benjamin L. McClain ,  Travis M. Jensen

    IPC: H01L21/67 ,  H01L21/683 ,  H05K13/00 ,  H05K13/04

    Abstract: Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

    Methods and systems for manufacturing semiconductor devices
    5.
    发明授权
    Methods and systems for manufacturing semiconductor devices 有权

    公开(公告)号：US12080678B2

    公开(公告)日：2024-09-03

    申请号：US17881572

    申请日：2022-08-04

    Applicant: Micron Technology, Inc.

    Inventor： Wei Zhou ,  Bret K. Street ,  Benjamin L. McClain ,  Mark E. Tuttle

    IPC: H01L23/00 ,  H01L23/48

    CPC classification number: H01L24/75 ,  H01L23/481 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/75317 ,  H01L2224/81203 ,  H01L2224/95091

    Abstract: A thermocompression bonding (TCB) apparatus can include a wall having a height measured in a first direction and configured to be positioned between a first pressing surface and a second pressing surface of a semiconductor bonding apparatus. The apparatus can include a cavity at least partially surrounded by the wall, the cavity sized to receive a semiconductor substrate and a stack of semiconductor dies positioned between the semiconductor substrate and the first pressing surface, the stack of semiconductor dies and semiconductor substrate having a combined unpressed stack height as measured in the first direction. In some embodiments, the unpressed stack height is greater than the height of the wall, and the wall is configured to be contacted by the first pressing surface to limit movement of the first pressing surface toward the second pressing surface during a semiconductor bonding process.

    Methods and systems for manufacturing semiconductor devices
    6.
    发明授权
    Methods and systems for manufacturing semiconductor devices 有权

    公开(公告)号：US11410963B2

    公开(公告)日：2022-08-09

    申请号：US17099655

    申请日：2020-11-16

    Applicant: Micron Technology, Inc.

    Inventor： Wei Zhou ,  Bret K. Street ,  Benjamin L. McClain ,  Mark E. Tuttle

    IPC: H01L21/00 ,  H01L23/00 ,  H01L23/48

    Abstract: A thermocompression bonding (TCB) apparatus can include a wall having a height measured in a first direction and configured to be positioned between a first pressing surface and a second pressing surface of a semiconductor bonding apparatus. The apparatus can include a cavity at least partially surrounded by the wall, the cavity sized to receive a semiconductor substrate and a stack of semiconductor dies positioned between the semiconductor substrate and the first pressing surface, the stack of semiconductor dies and semiconductor substrate having a combined unpressed stack height as measured in the first direction. In some embodiments, the unpressed stack height is greater than the height of the wall, and the wall is configured to be contacted by the first pressing surface to limit movement of the first pressing surface toward the second pressing surface during a semiconductor bonding process.

    SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCTURES
    7.
    发明申请
    SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCTURES 有权

    公开(公告)号：US20210193606A1

    公开(公告)日：2021-06-24

    申请号：US17198144

    申请日：2021-03-10

    Applicant: Micron Technology, Inc.

    Inventor： Brandon P. Wirz ,  Benjamin L. McClain

    IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00

    Abstract: A semiconductor device assembly is provided. The assembly includes a first package element and a second package element disposed over the first package element. The assembly further includes a plurality of die support structures between the first and second package elements, wherein each of the plurality of die support structures has a first height, a lower portion surface-mounted to the first package element and an upper portion in contact with the second package element. The assembly further includes a plurality of interconnects between the first and second package elements, wherein each of the plurality of interconnects includes a conductive pillar having a second height, a conductive pad, and a bond material with a solder joint thickness between the conductive pillar and the conductive pad. The first height is about equal to a sum of the solder joint thickness and the second height.

    Semiconductor device assembly with surface-mount die support structures
    8.
    发明授权
    Semiconductor device assembly with surface-mount die support structures 有权

    公开(公告)号：US10950568B2

    公开(公告)日：2021-03-16

    申请号：US15603327

    申请日：2017-05-23

    Applicant: Micron Technology, Inc.

    Inventor： Brandon P. Wirz ,  Benjamin L. McClain

    IPC: H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L25/16 ,  H01L25/18

    Abstract: A semiconductor device assembly is provided. The assembly includes a first package element and a second package element disposed over the first package element. The assembly further includes a plurality of die support structures between the first and second package elements, wherein each of the plurality of die support structures has a first height, a lower portion surface-mounted to the first package element and an upper portion in contact with the second package element. The assembly further includes a plurality of interconnects between the first and second package elements, wherein each of the plurality of interconnects includes a conductive pillar having a second height, a conductive pad, and a bond material with a solder joint thickness between the conductive pillar and the conductive pad. The first height is about equal to a sum of the solder joint thickness and the second height.

    METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
    9.
    发明申请
    METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES 审中-公开

    公开(公告)号：US20200212000A1

    公开(公告)日：2020-07-02

    申请号：US16236257

    申请日：2018-12-28

    Applicant: Micron Technology, Inc.

    Inventor： Wei Zhou ,  Bret K. Street ,  Benjamin L. McClain ,  Mark E. Tuttle

    IPC: H01L23/00 ,  H01L23/48

    Abstract: A thermocompression bonding (TCB) apparatus can include a wall having a height measured in a first direction and configured to be positioned between a first pressing surface and a second pressing surface of a semiconductor bonding apparatus. The apparatus can include a cavity at least partially surrounded by the wall, the cavity sized to receive a semiconductor substrate and a stack of semiconductor dies positioned between the semiconductor substrate and the first pressing surface, the stack of semiconductor dies and semiconductor substrate having a combined unpressed stack height as measured in the first direction. In some embodiments, the unpressed stack height is greater than the height of the wall, and the wall is configured to be contacted by the first pressing surface to limit movement of the first pressing surface toward the second pressing surface during a semiconductor bonding process.

    COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERATIONS, AND ASSOCIATED SYSTEMS AND METHODS
    10.
    发明申请
    COLD FLUID SEMICONDUCTOR DEVICE RELEASE DURING PICK AND PLACE OPERATIONS, AND ASSOCIATED SYSTEMS AND METHODS 审中-公开

    公开(公告)号：US20190326142A1

    公开(公告)日：2019-10-24

    申请号：US16460956

    申请日：2019-07-02

    Applicant: Micron Technology, Inc.

    Inventor： Jeremy E. Minnich ,  Benjamin L. McClain ,  Travis M. Jensen

    IPC: H01L21/67 ,  B28D5/00 ,  H05K13/00 ,  H01L21/683

    Abstract: Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

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