公开(公告)号：US20190326142A1

公开(公告)日：2019-10-24

申请号：US16460956

申请日：2019-07-02

Applicant: Micron Technology, Inc.

Inventor： Jeremy E. Minnich ,  Benjamin L. McClain ,  Travis M. Jensen

IPC: H01L21/67 ,  B28D5/00 ,  H05K13/00 ,  H01L21/683

Abstract: Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

公开(公告)号：US10276539B1

公开(公告)日：2019-04-30

申请号：US15797900

申请日：2017-10-30

Applicant: Micron Technology, Inc.

Inventor： Brandon P. Wirz ,  Benjamin L. McClain ,  C. Alexander Ernst ,  Jeremy E. Minnich

IPC: H01L23/00

Abstract: A semiconductor device, semiconductor device assembly, and method of forming a semiconductor device assembly that includes a barrier on a pillar. The semiconductor device assembly includes a semiconductor device disposed over another semiconductor device. At least one pillar extends from one semiconductor device towards a pad on the other semiconductor device. The barrier on the exterior of the pillar may be a standoff to control a bond line between the semiconductor devices. The barrier may reduce solder bridging and may prevent reliability and electromigration issues that can result from the IMC formation between the solder and copper portions of a pillar. The barrier may help align the pillar with a pad when forming a semiconductor device assembly and may reduce misalignment due to lateral movement of the semiconductor devices. Windows or slots in the barrier may permit the expansion of solder in predetermined directions while preventing bridging in other directions.

公开(公告)号：US20240222184A1

公开(公告)日：2024-07-04

申请号：US18508239

申请日：2023-11-14

Applicant: Micron Technology, Inc.

Inventor： Jeremy E. Minnich ,  Andrew M. Bayless

IPC: H01L21/683 ,  H01L21/306 ,  H01L21/782 ,  H01L25/065

CPC classification number: H01L21/6836 ,  H01L21/30625 ,  H01L21/782 ,  H01L25/0657 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06586

Abstract: A semiconductor substrate is provided. The semiconductor substrate includes a center portion and a peripheral portion. The semiconductor substrate further includes an annulus of sacrificial material disposed at a front side of the semiconductor substrate and extending at least partially through the semiconductor substrate. The annulus of sacrificial material separates the center portion of the substrate from the peripheral portion of the substrate at the front side. The semiconductor substrate can be thinned to expose the annulus of sacrificial material and disconnect the peripheral portion from the center portion. In doing so, the thinned substrate may have a planar substrate edge void of sharp edges, thereby increasing its mechanical robustness.

公开(公告)号：US10090177B1

公开(公告)日：2018-10-02

申请号：US15687015

申请日：2017-08-25

Applicant: Micron Technology, Inc.

Inventor： Jeremy E. Minnich ,  Benjamin L. McClain ,  Travis M. Jensen

IPC: H01L21/67 ,  H01L21/683 ,  H05K13/00 ,  H05K13/04

Abstract: Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

公开(公告)号：US11670612B2

公开(公告)日：2023-06-06

申请号：US17176095

申请日：2021-02-15

Applicant: Micron Technology, Inc.

Inventor： Brandon P. Wirz ,  Benjamin L. McClain ,  Jeremy E. Minnich ,  Zhaohui Ma

IPC: H01L21/48 ,  H01L23/00 ,  H01L21/033 ,  H01L21/60

CPC classification number: H01L24/17 ,  H01L21/0337 ,  H01L24/14 ,  H01L24/81 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2021/60007 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/92125 ,  H01L2224/92125 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2224/13101 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor device assembly that includes a semiconductor device positioned over a substrate with a number of electrical interconnections formed between the semiconductor device and the substrate. The surface of the substrate includes a plurality of discrete solder mask standoffs that extend towards the semiconductor device. A thermal compression bonding process is used to melt solder to form the electrical interconnects, which lowers the semiconductor device to contact and be supported by the plurality of discrete solder mask standoffs. The solder mask standoffs permit the application of a higher pressure during the bonding process than using traditional solder masks. The solder mask standoffs may have various polygonal or non-polygonal shapes and may be positioned in pattern to protect sensitive areas of the semiconductor device and/or the substrate. The solder mask standoffs may be an elongated shape that protects areas of the semiconductor device and/or substrate.

公开(公告)号：US10998208B2

公开(公告)日：2021-05-04

申请号：US16460956

申请日：2019-07-02

Applicant: Micron Technology, Inc.

Inventor： Jeremy E. Minnich ,  Benjamin L. McClain ,  Travis M. Jensen

IPC: H01L21/67 ,  H01L21/683 ,  H05K13/00 ,  B28D5/00 ,  H05K13/04

Abstract: Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

公开(公告)号：US10700038B2

公开(公告)日：2020-06-30

申请号：US15686963

申请日：2017-08-25

Applicant: Micron Technology, Inc.

Inventor： Benjamin L. McClain ,  Jeremy E. Minnich

IPC: H01L21/67 ,  H01L23/00

Abstract: Methods and systems for inhibiting bonding materials from entering a vacuum system of a semiconductor processing tool are disclosed herein. A semiconductor processing tool configured in accordance with a particular embodiment includes a bondhead having a first port, a second port, a first channel fluidly coupled to the first port, and a second channel fluidly coupled to the second port. The first port and first channel together comprise a first opening extending through the bondhead, and the second port and second channel together comprise a second opening extending through the bondhead. The second opening at least partially surrounds the first opening. A first flow unit is coupled to the first port and is configured to withdraw air from the first opening. A second flow unit is coupled to the second port and is configured to provide fluid to or withdraw fluid from the second opening.

公开(公告)号：US20190067053A1

公开(公告)日：2019-02-28

申请号：US16020625

申请日：2018-06-27

Applicant: Micron Technology, Inc.

Inventor： Jeremy E. Minnich ,  Benjamin L. McClain ,  Travis M. Jensen

IPC: H01L21/67 ,  H01L21/683 ,  H05K13/00

CPC classification number: H01L21/67132 ,  B28D5/0017 ,  B28D5/0041 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  H05K13/0061 ,  H05K13/0404 ,  Y10T156/1911 ,  Y10T156/1983

Abstract: Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

公开(公告)号：US11594432B2

公开(公告)日：2023-02-28

申请号：US17226259

申请日：2021-04-09

Applicant: Micron Technology, Inc.

Inventor： Jeremy E. Minnich ,  Benjamin L. McClain ,  Travis M. Jensen

IPC: H01L21/67 ,  H01L21/683 ,  H05K13/00 ,  B28D5/00 ,  H05K13/04

Abstract: Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

公开(公告)号：US20210225672A1

公开(公告)日：2021-07-22

申请号：US17226259

申请日：2021-04-09

Applicant: Micron Technology, Inc.

Inventor： Jeremy E. Minnich ,  Benjamin L. McClain ,  Travis M. Jensen

IPC: H01L21/67 ,  H01L21/683 ,  H05K13/00 ,  B28D5/00

Abstract: Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.