公开(公告)号：US20230359390A1

公开(公告)日：2023-11-09

申请号：US17735583

申请日：2022-05-03

Applicant: Micron Technology, Inc.

Inventor： Jose Rey C. De Luna ,  Suresh Rajgopal ,  Jeremy Wayne Butterfield ,  Dustin J. Carter

IPC: G06F3/06

CPC classification number: G06F3/0656 ,  G06F3/0659 ,  G06F3/0629 ,  G06F3/0604 ,  G06F3/0679

Abstract: Aspects of the present disclosure configure a system component, such as a memory sub-system controller, to provide a configurable buffer device. The configuration buffer device is coupled between a processing device and a set of memory components. The configurable buffer device can be configured based on configuration data to couple a first quantity of front-side channels to a second quantity of back-side channels. The configuration data can be received from an external source, such as the processing device, or can be stored in a configuration register at manufacture. The configuration data can also be generated or determined based on one or more pins of the buffer device that control how many font-side channels and how many back-side channels to enable/disable.

公开(公告)号：US11532348B2

公开(公告)日：2022-12-20

申请号：US17110128

申请日：2020-12-02

Applicant: Micron Technology, Inc.

Inventor： Liang Yu ,  Jeremy Wayne Butterfield ,  Jeremy Binfet

IPC: G11C11/4074 ,  G11C11/4076 ,  G11C5/14 ,  G11C5/06 ,  G11C11/409

Abstract: A variety of applications can include multiple memory die packages configured to engage in peak power management (PPM) across the multiple packages of memory dies. A communication line coupled to each memory die in the multiple memory die packages can be used to facilitate the PPM. A global management die can start a communication sequence among the multiple memory die packages to share a current budget across the multiple memory die packages by driving a signal on the communication line. Local management dies can use the received signal having clock pulses driven by the global management die on the communication line to engage in the PPM. To engage in global PPM, each memory die can be structured, to be selected as the global management die or a local management die, with one or more controllers to interface with the multiple memory die packages and to handle current budget limits.

公开(公告)号：US20220172767A1

公开(公告)日：2022-06-02

申请号：US17110128

申请日：2020-12-02

Applicant: Micron Technology, Inc.

Inventor： Liang Yu ,  Jeremy Wayne Butterfield ,  Jeremy Binfet

IPC: G11C11/4074 ,  G11C11/4076 ,  G11C11/409 ,  G11C5/06 ,  G11C5/14

Abstract: A variety of applications can include multiple memory die packages configured to engage in peak power management (PPM) across the multiple packages of memory dies. A communication line coupled to each memory die in the multiple memory die packages can be used to facilitate the PPM. A global management die can start a communication sequence among the multiple memory die packages to share a current budget across the multiple memory die packages by driving a signal on the communication line. Local management dies can use the received signal having clock pulses driven by the global management die on the communication line to engage in the PPM. To engage in global PPM, each memory die can be structured, to be selected as the global management die or a local management die, with one or more controllers to interface with the multiple memory die packages and to handle current budget limits.

公开(公告)号：US20230089479A1

公开(公告)日：2023-03-23

申请号：US17993194

申请日：2022-11-23

Applicant: Micron Technology, Inc.

Inventor： Liang Yu ,  Jeremy Wayne Butterfield ,  Jeremy Binfet

IPC: G11C11/4074 ,  G11C11/4076 ,  G11C5/14 ,  G11C5/06 ,  G11C11/409

Abstract: A variety of applications can include multiple memory die packages configured to engage in peak power management (PPM) across the multiple packages of memory dies. A communication line coupled to each memory die in the multiple memory die packages can be used to facilitate the PPM. A global management die can start a communication sequence among the multiple memory die packages to share a current budget across the multiple memory die packages by driving a signal on the communication line. Local management dies can use the received signal having clock pulses driven by the global management die on the communication line to engage in the PPM. To engage in global PPM, each memory die can be structured, to be selected as the global management die or a local management die, with one or more controllers to interface with the multiple memory die packages and to handle current budget limits.