公开(公告)号：US20230371282A1

公开(公告)日：2023-11-16

申请号：US17742154

申请日：2022-05-11

Applicant: Micron Technology, Inc.

Inventor： David A. Kewley ,  Kevin Baker ,  Trupti D. Gawai

IPC: H01L27/24 ,  G11C13/00

CPC classification number: H01L27/2463 ,  G11C13/0023 ,  G11C2213/77

Abstract: Integrated circuitry comprises a horizontally-elongated insulative wall directly above a conductive node. The wall comprises insulative material. A conductive via extends through the wall to the conductive node. A conductive line is directly above the wall and directly above the conductive via. The conductive via directly electrically couples together the conductive line with the conductive node. Insulator material is longitudinally-along laterally-opposing sides of the wall. An interface of the insulative material of the wall and the insulator material are on each of the laterally-opposing sides of the wall. Other embodiments, including method, are disclosed.