公开(公告)号：US20250014959A1

公开(公告)日：2025-01-09

申请号：US18737817

申请日：2024-06-07

Applicant: Micron Technology, Inc.

Inventor： Manish Nayini ,  Koustav Sinha ,  Christopher Glancey ,  Quang Nguyen

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

Abstract: A microelectronic device includes a semiconductor die operatively coupled to a base structure. The device further includes an encapsulant substantially surrounding the semiconductor die. The device also includes one or more recesses vertically extending from an upper surface of the encapsulant to one or more locations at or proximate to an upper surface of the base structure.