公开(公告)号：US11101171B2

公开(公告)日：2021-08-24

申请号：US16542507

申请日：2019-08-16

Applicant: Micron Technology, Inc.

Inventor： Xiaosong Zhang ,  Yongjun J. Hu ,  David A. Kewley ,  Md Zahid Hossain ,  Michael J. Irwin ,  Daniel Billingsley ,  Suresh Ramarajan ,  Robert J. Hanson ,  Biow Hiem Ong ,  Keen Wah Chow

IPC: H01L21/768

Abstract: An apparatus comprises a structure including an upper insulating material overlying a lower insulating material, a conductive element underlying the lower insulating material, and a conductive material comprising a metal line and a contact. The conductive material extends from an upper surface of the upper insulating material to an upper surface of the conductive element. The structure also comprises a liner material adjacent the metal line. A width of an uppermost surface of the conductive material of the metal line external to the contact is relatively less than a width of an uppermost surface of the conductive material of the contact. Related methods, memory devices, and electronic systems are disclosed.

公开(公告)号：US20240064988A1

公开(公告)日：2024-02-22

申请号：US17900455

申请日：2022-08-31

Applicant: Micron Technology, Inc.

Inventor： Md Zahid Hossain ,  Martin Popp ,  Xiaosong Zhang ,  Surendranath C. Eruvuru ,  Suvra Sarkar ,  Tianqi Xu

IPC: H01L27/11573 ,  H01L27/11526

CPC classification number: H01L27/11573 ,  H01L27/11526

Abstract: A variety of applications can include apparatus having a memory device structured with a circuit under array (CuA) architecture. A page buffer region in the CuA can be formed with a periphery region that is horizontally adjacent to the page buffer region. Contacts to gates for transistors in the page buffer region can be formed to land only on these gates, separating and electrically isolating the contacts and associated gates from each other in the page buffer region. Contacts to gates for transistors in the periphery region can be formed to land on conductive regions disposed on gates for transistors in the periphery region.

公开(公告)号：US20210050252A1

公开(公告)日：2021-02-18

申请号：US16542507

申请日：2019-08-16

Applicant: Micron Technology, Inc.

Inventor： Xiaosong Zhang ,  Yongjun J. Hu ,  David A. Kewley ,  Md Zahid Hossain ,  Michael J. Irwin ,  Daniel Billingsley ,  Suresh Ramarajan ,  Robert J. Hanson ,  Biow Hiem Ong ,  Keen Wah Chow

IPC: H01L21/768

Abstract: An apparatus comprises a structure including an upper insulating material overlying a lower insulating material, a conductive element underlying the lower insulating material, and a conductive material comprising a metal line and a contact. The conductive material extends from an upper surface of the upper insulating material to an upper surface of the conductive element. The structure also comprises a liner material adjacent the metal line. A width of an uppermost surface of the conductive material of the metal line external to the contact is relatively less than a width of an uppermost surface of the conductive material of the contact. Related methods, memory devices, and electronic systems are disclosed.

公开(公告)号：US11990367B2

公开(公告)日：2024-05-21

申请号：US17444948

申请日：2021-08-12

Applicant: Micron Technology, Inc.

Inventor： Xiaosong Zhang ,  Yongjun J. Hu ,  David A. Kewley ,  Md Zahid Hossain ,  Michael J. Irwin ,  Daniel Billingsley ,  Suresh Ramarajan ,  Robert J. Hanson ,  Biow Hiem Ong ,  Keen Wah Chow

IPC: H01L21/768

CPC classification number: H01L21/76831 ,  H01L21/76843 ,  H01L21/76879 ,  H01L21/76804

Abstract: An apparatus comprises a structure including an upper insulating material overlying a lower insulating material, a conductive element underlying the lower insulating material, and a conductive material comprising a metal line and a contact. The conductive material extends from an upper surface of the upper insulating material to an upper surface of the conductive element. The structure also comprises a liner material adjacent the metal line. A width of an uppermost surface of the conductive material of the metal line external to the contact is relatively less than a width of an uppermost surface of the conductive material of the contact. Related methods, memory devices, and electronic systems are disclosed.

公开(公告)号：US20210375670A1

公开(公告)日：2021-12-02

申请号：US17444948

申请日：2021-08-12

Applicant: Micron Technology, Inc.

Inventor： Xiaosong Zhang ,  Yongjun J. Hu ,  David A. Kewley ,  Md Zahid Hossain ,  Michael J. Irwin ,  Daniel Billingsley ,  Suresh Ramarajan ,  Robert J. Hanson ,  Biow Hiem Ong ,  Keen Wah Chow

IPC: H01L21/768

Abstract: An apparatus comprises a structure including an upper insulating material overlying a lower insulating material, a conductive element underlying the lower insulating material, and a conductive material comprising a metal line and a contact. The conductive material extends from an upper surface of the upper insulating material to an upper surface of the conductive element. The structure also comprises a liner material adjacent the metal line. A width of an uppermost surface of the conductive material of the metal line external to the contact is relatively less than a width of an uppermost surface of the conductive material of the contact. Related methods, memory devices, and electronic systems are disclosed.