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94 条记录 (耗时 0.039 秒)

    Method of temporarily adjusting the index of refraction of ring resonator with precision laser micromachining
    1.
    发明授权
    Method of temporarily adjusting the index of refraction of ring resonator with precision laser micromachining 失效
    利用精密激光微加工临时调整环形谐振器的折射率的方法

    公开(公告)号：US06819837B2

    公开(公告)日：2004-11-16

    申请号：US10396030

    申请日：2003-03-25

    申请人： Ming Li ,  Daniel Hogan ,  Xinbing Liu ,  Makoto Ishizuka

    发明人： Ming Li ,  Daniel Hogan ,  Xinbing Liu ,  Makoto Ishizuka

    IPC分类号： G02B626

    CPC分类号： G02B6/12007

    摘要： A tuned optical resonator having a substrate and an input waveguide and an optical resonator waveguide formed on the substrate. The optical resonator waveguide has a resonant frequency, exhibits a first index of refraction, temporarily exhibits a second index of refraction responsive to application of laser energy, and temporarily resonates at the resonant frequency while the laser energy is being applied.

    摘要翻译： 一种调谐光学谐振器，其具有基板和形成在基板上的输入波导和光学谐振波导。 光谐振器波导具有谐振频率，呈现第一折射率，响应于施加激光能量暂时呈现第二折射率，并且在施加激光能量时暂时谐振在谐振频率。

    Precision laser micromachining system for drilling holes
    7.
    发明申请
    Precision laser micromachining system for drilling holes 审中-公开
    钻孔精密激光微加工系统

    公开(公告)号：US20050103759A1

    公开(公告)日：2005-05-19

    申请号：US11005086

    申请日：2004-12-06

    申请人： Ming Li ,  Makoto Ishizuka ,  Xinbing Liu

    发明人： Ming Li ,  Makoto Ishizuka ,  Xinbing Liu

    IPC分类号： B23K26/00 ,  B23K26/04 ,  B23K26/06 ,  B23K26/38 ,  H01S3/08

    CPC分类号： B23K26/066 ,  B23K26/04 ,  B23K26/043 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/50

    摘要： A laser drilling system for drilling holes in a work piece with a laser. The system includes: a laser for creating a laser beam and directing the laser beam along an optical path; a mask having at least one aperture, the mask and the aperture being located in the optical path to cause the creation of a sub-beam; a lens for forming a reduced-size image of the sub-beam onto the work piece and a translation stage for moving the mask to change the position of the sub-beam on the work piece. The laser beam has a wavefront cross-section with an area greater than the size of the aperture and is incident upon the mask and the aperture to create the sub-beam.

    摘要翻译： 一种激光钻孔系统，用于在带有激光的工件上钻孔。 该系统包括：用于产生激光束并沿着光路引导激光束的激光器; 具有至少一个孔的掩模，所述掩模和所述孔位于所述光路中以引起子束的产生; 用于将子光束的尺寸减小的图像形成在工件上的透镜和用于移动掩模以使子光束在工件上的位置改变的平移台。 激光束具有波面横截面，其面积大于孔径的大小，并且入射到掩模和孔以产生子光束。

    Diffractive optical element changer for versatile use in laser manufacturing
    8.
    发明申请
    Diffractive optical element changer for versatile use in laser manufacturing 审中-公开
    衍射光学元件更换器，适用于激光制造

    公开(公告)号：US20060000811A1

    公开(公告)日：2006-01-05

    申请号：US10882093

    申请日：2004-06-30

    申请人： Daniel Hogan ,  Xinbing Liu

    发明人： Daniel Hogan ,  Xinbing Liu

    IPC分类号： B23K26/38 ,  B23K26/067

    CPC分类号： B23K26/0608 ,  B23K26/067 ,  B23K26/384

    摘要： A DOE array apparatus includes a plurality of different interchangeable DOEs for use with lasers in manufacturing for versatile tasks such as drilling holes or vias of various sizes and shapes and multiple ablation or material transformation patterns in a surface of an object. A method of using the apparatus in laser processing systems includes: determining a specification for the number of patterns and/or the number of layers to be patterned, designing the appropriate number of DOEs according to the product specification, assembling the DOEs into an array to be used in a laser processing system, ablating the layer on the object through laser processing, determining whether more patterns on the layer are to be processed, determining whether more layers are to be patterned, and changing and aligning the DOE for the next laser ablation or material transformation pattern to be processed.

    摘要翻译： DOE阵列设备包括多个不同的可互换DOE，用于制造激光器，用于多种任务，例如各种尺寸和形状的钻孔或通孔以及物体表面中的多个消融或材料转换图案。 在激光处理系统中使用该装置的方法包括：确定要图案化的图案数量和/或层数的规格，根据产品规格设计适当数量的DOE，将DOE组装成阵列 用于激光处理系统，通过激光处理消融物体上的层，确定是否要处理更多图案，确定是否要更多层图案，以及改变和对准下一次激光烧蚀的DOE 或要处理的材料转换图案。

    Ultrafast laser machining system and method for forming diffractive structures in optical fibers
    9.
    发明申请
    Ultrafast laser machining system and method for forming diffractive structures in optical fibers 失效
    超快激光加工系统及在光纤中形成衍射结构的方法

    公开(公告)号：US20060093265A1

    公开(公告)日：2006-05-04

    申请号：US11213412

    申请日：2005-08-26

    申请人： Jimmy Jia ,  Ming Li ,  Rajminder Singh ,  Xinbing Liu ,  Tetsuo Ohara

    发明人： Jimmy Jia ,  Ming Li ,  Rajminder Singh ,  Xinbing Liu ,  Tetsuo Ohara

    IPC分类号： G02B6/34

    CPC分类号： B23K26/04 ,  B23K26/03 ,  B23K26/032 ,  B23K26/043 ,  B23K26/0624 ,  B23K26/0665 ,  B23K26/0823 ,  B23K26/083 ,  G02B6/02123

    摘要： An ultrafast laser machining system and method to form diffractive structures in optical fibers. The fiber is mounted with its longitudinal axis perpendicular to the beam path of the laser pulses. A region of the fiber is illuminated and then imaged with two cameras. These cameras are aligned substantially orthogonally. A position of the beam spot is determined. The beam spot is aligned to a starting position within the region. This position is within a portion of the fiber to be machined for which the beam path passes through the greatest length of material. The beam spot is scanned along a path designed to pass the beam spot through all of the portion to be machined such that the beam path does not pass through previously machined material. The laser pulses, which have a duration of less than about ins, are generated as the beam spot is scanned.

    摘要翻译： 一种用于在光纤中形成衍射结构的超快速激光加工系统和方法。 光纤安装成其纵轴垂直于激光脉冲的光束路径。 光纤的一个区域被照亮，然后用两个相机成像。 这些相机基本正交对准。 确定束斑的位置。 束斑与该区域内的起始位置对准。 该位置在待加工的纤维的一部分内，光束路径通过其中最长的材料长度。 光束点沿着设计成使光束点通过所有被加工部分的路径被扫描，使得光束路径不通过预先加工的材料。 当扫描光束点时，产生具有小于约ins的持续时间的激光脉冲。

    Apparatus for drilling holes with sub-wavelength pitch with laser
    10.
    发明授权
    Apparatus for drilling holes with sub-wavelength pitch with laser 失效

    公开(公告)号：US06570122B2

    公开(公告)日：2003-05-27

    申请号：US10038330

    申请日：2002-01-03

    申请人： Xinbing Liu ,  Ming Li

    发明人： Xinbing Liu ,  Ming Li

    IPC分类号： B23K2638

    CPC分类号： B23K26/0624 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/50 ,  B82Y20/00 ,  G02B6/1225

    摘要： A method of laser machining using an ultra-fast pulse laser is presented. According to the present invention a plurality of holes with a pitch less than the wavelength of the laser are drilled into a material sample. Reliable and reproducible hole drilling is accomplished through an exemplary drilling sequence which applies a number of pulses at a first pulse energy to the surface spaced to avoid laser hardening of the surface for adjacent holes of a first set of holes. Next, the number of pulses is increased or the energy of the laser beam is increased to drill holes that are interstitial to the first set of holes. The exemplary laser machining process may used to produce both one-dimensional and two-dimensional photonic crystals, among other applications.